Quantum computing is advancing rapidly, with superconducting quantum computing (SQC) emerging as one of the most promising platforms for scalable quantum information processing. In contrast to fabrication-focused approaches prevalent in current literature, this work presents a fully simulation-based design and tuning methodology for a small-scale superconducting quantum chip - addressing practical limitations posed by fabrication resource constraints - and consequently excludes physical chip fabrication or real-time performance evaluation (e.g., fidelity and error rate measurements). A meticulous, step-by-step electromagnetic simulation was conducted on the chip, designed using Qiskit Metal and Ansys Electronics, with qubit parameters tuned and verified using the Lumped Oscillator Model (LOM) and Energy Participation Ratio (EPR) methods. The design achieves good parameter convergence with relative tuning error rates (Δ%) below 0.05% after 15 adaptive passes and approximately 50,000 solved mesh elements, yielding an Energy Participation Ratio (EPR) of 91.8 % for the chip substrate (Silicon). Furthermore, the study includes a theoretical comparison between two fundamental qubit-qubit coupling schemes. A key contribution of this work lies in systematically analyzing how geometric variations in qubit design affect critical quantum parameters such as qubit frequencies, anharmonicities, coupling strengths, and dispersive shifts - thereby offering a comprehen-sive, simulation-driven framework for early-stage quantum chip prototyping.
Quantum computing is advancing rapidly, with superconducting quantum computing (SQC) emerging as one of the most promising platforms for scalable quantum information processing. In contrast to fabrication-focused approaches prevalent in current literature, this work presents a fully simulation-based design and tuning methodology for a small-scale superconducting quantum chip - addressing practical limitations posed by fabrication resource constraints - and consequently excludes physical chip fabrication or real-time performance evaluation (e.g., fidelity and error rate measurements). A meticulous, step-by-step electromagnetic simulation was conducted on the chip, designed using Qiskit Metal and Ansys Electronics, with qubit parameters tuned and verified using the Lumped Oscillator Model (LOM) and Energy Participation Ratio (EPR) methods. The design achieves good parameter convergence with relative tuning error rates (Δ%) below 0.05% after 15 adaptive passes and approximately 50,000 solved mesh elements, yielding an Energy Participation Ratio (EPR) of 91.8 % for the chip substrate (Silicon). Furthermore, the study includes a theoretical comparison between two fundamental qubit-qubit coupling schemes. A key contribution of this work lies in systematically analyzing how geometric variations in qubit design affect critical quantum parameters such as qubit frequencies, anharmonicities, coupling strengths, and dispersive shifts - thereby offering a comprehen-sive, simulation-driven framework for early-stage quantum chip prototyping.
This work presents a comprehensive analytical and simulation-based study of superconducting quantum chip architectures, spanning both 2D planar and 3D-integrated designs. We first design and simulate a planar quantum chip layout using Qiskit Metal, which is imported into Ansys HFSS (High Frequency Structure Simulator) to construct a 3D model and perform electromagnetic simulations. A detailed analysis using Driven Modal, Eigenmode, Magnetostatic, and Q3D Capacitance Extraction solvers ensures our simulations accurately reflect physical behavior. The results are validated against analytical models from microwave engineering. pyEPR (Python Energy Participation Ratio) is used to extract key quantum metrics, including eigenfrequencies, quality factors, decoherence times, anharmonicity, cross-Kerr interactions, and participation ratios. Building on this planar design, we extend our study to a 3D-integrated flip-chip architecture featuring two superconducting qubits fabricated on separate high-resistivity silicon substrates. Using HFSS and analytical modeling, we show that detuned qubits maintain stable eigenfrequencies, quality factors, decoherence times, anharmonicity, and cross-Kerr interactions over varying substrate separation values. However, the introduction of dielectric loss tangents reduces quality factors which degrades coherence times and introduces an additional dephasing. These findings highlight the potential of 3D quantum integration, given minimal material imperfections.The planar and 3D designs together form a cohesive investigation into next-generation quantum hardware, with the 2D layout currently taped-out and under fabrication.
This work presents a combined analytical and simulation-based study of a 3D-integrated quantum chip architecture. We model a flip-chip-inspired structure by stacking two superconducting qubits fabricated on separate high-resistivity silicon substrates through a dielectric interlayer. Utilizing rigorous Ansys High-Frequency Structure Simulator (HFSS) simulations and analytical models from microwave engineering, we evaluate key quantum metrics such as eigenfrequencies, Q-factors, decoherence times, anharmonicity, cross-Kerr, participation ratios, and qubit coupling energy to describe the performance of the quantum device as a function of integration parameters. The integration parameters include the thickness and the quality of the dielectric interlayer. For detuned qubits, these metrics remain mostly invariant with respect to the substrate separation. However, introducing dielectric interlayer loss decreases the qubit quality factor, which consequentially degrades the relaxation time of the qubit. It is found that for the structure studied in this work, the stacked chip distance can be as small as 0.5 mm. These findings support the viability of 3D quantum integration as a scalable alternative to planar architectures, while identifying key limitations in qubit coherence preservation due to lossy interlayer materials.
We propose SPICE-Q, a SPICE-inspired design-technology co-optimization framework for superconducting quantum processors. Rather than replacing tools such as HFSS, Qiskit Metal, pyEPR, SQcircuit, SQuADDS, scqubits, or QuTiP, SPICE-Q aims to connect them through a unified, traceable data chain spanning process rules, layout, electromagnetic simulation, energy-participation-ratio and circuit quantization, Hamiltonian extraction, noise analysis, cryogenic test, and manufacturing feedback. The central mapping is from process and PDK constraints to layout geometry, electromagnetic modes, equivalent circuit parameters, effective Hamiltonians, and finally metrics such as frequency, coupling, anharmonicity, decoherence, readout performance, and yield. This flow must capture Josephson-junction variability, transmon frequency allocation, resonator and Purcell constraints, coupler crosstalk, microwave routing, 3D interconnects, material/interface loss, package modes, and wafer-scale process statistics. By introducing standardized model interfaces, statistical parameter models, model cards, version governance, and closed-loop calibration from cryogenic and fabrication data, SPICE-Q frames superconducting quantum-chip design as an engineering workflow rather than a collection of isolated simulations. We argue that scalable and fault-tolerant quantum processors will require such a continuous model chain from device physics and electromagnetic fields to quantum dynamics, noise, manufacturability, and system-level yield.
Designing a qubit architecture is one of the most critical challenges in achieving scalable and fault-tolerant quantum computing as the performance of a quantum computer is heavily dependent on the coherence times, connectivity and low noise environments. Superconducting qubits have emerged as a frontrunner among many competing technologies, primarily because of their speed of operations, relatively well-developed and offer a promising path toward scalability. Here, we address the challenges of optimizing superconducting qubit hardware through the development of a comprehensive theoretical framework that spans the entire process - from design to the calibration of hardware through quantum gate execution. We develop this framework in four key steps: circuit design, electromagnetic analysis, spectral analysis, and pulse sequencing with calibration. We first refine the qubit's core components - such as capacitance, Josephson junctions, and resonators - to set the foundation for strong performance. The electromagnetic analysis, using the Lumped Oscillator model, allows us to map out the capacitance matrix, ensuring that we minimize spectral dispersion while maximizing coherence times. Following this, we conduct spectral analysis to fine-tune the qubit's frequency spectrum and coherence properties, ensuring that the qubit parameters are optimized. Finally, we focus on pulse sequencing, including pulse-width optimization, DRAG optimization, and randomized benchmarking, to achieve high gate fidelity. We applied this framework to both Transmon and Fluxonium qubits, obtaining results that closely match those found in experimental studies. This work provides a detailed and practical approach to the design, optimization, and calibration of superconducting qubits, contributing to the broader effort to develop scalable quantum computing technologies.
Quantum chips form the foundational hardware for quantum computing, promising transformative impacts across optimization, secure communications, and artificial intelligence. This paper surveys five leading qubit implementations—superconducting circuits, neutral-atom arrays, trapped ions, photonic systems, and silicon-based quantum dots—highlighting their distinct operating principles, recent milestones, and inherent trade-offs. Superconducting platforms leverage mature microfabrication to achieve hundreds to thousands of qubits with rapid gate times but require millikelvin environments and face millisecond-scale coherence limits. Neutral-atom and ion-trap architectures offer exceptionally long coherence (seconds to hours) and high-fidelity operations, making them ideal for quantum memory and precision simulation, yet scaling remains constrained by control complexity. Photonic chips excel at room-temperature operation and quantum networking via entangled photons, though deterministic two-qubit gates and on-chip integration pose challenges. Silicon quantum dots promise CMOS compatibility and sub-microsecond spin coherence, but demand atomic-scale fabrication precision and advanced cryogenic control. We analyze the tension between qubit count, error rates, and engineering practicality, and discuss emerging solutions such as hybrid integration, advanced error-correction codes, and novel materials. Looking ahead, coordinated optimization across these platforms—combining fast superconducting processors, long-lived atomic memories, photonic interconnects, and scalable silicon arrays—will be critical to transition quantum chips from research prototypes to industrially viable systems that redefine computing, communications, and AI.
We present design results of scalable superconducting quantum circuits using the flip-chip assembly. In order to achieve the longest relaxation time (T1) of a qubit possible, gap between two chips in flip-chip assembly is determined to be 12 μm where low surface dielectric loss from two-level system (TLS) defects can be achieved while maintaining large readout coupling strength between two chips in the flip-chip assembly. Superconducting transmon qubit design is then optimized to have a target anharmonicity of 200 MHz and to have the longerT1in consideration of surface energy participation ratios of TLS defects within the compact footprint. To achieve strong coupling strength but low qubit to qubit crosstalk (ZZ) for fast and high fidelity multi-qubit gates, direct coupler and compact multi-path coupler designs for coupling qubits are compared by numerically solving Hamiltonian of the coupled two qubits. Monte-Carlo simulation results on the yield rate of the extended circuits indicate that low manufacturing errors are required.