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SPIE Quantum Information Science, Sensing, and Computation

Enabling scalable fabrication of superconducting quantum technologies

Satyavolu S. Papa Rao

Published May 30, 2025• 0 citations
Publisher
DOI
10.1117/12.3069214

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Superconducting circuits incorporating Josephson elements represent a promising hardware platform for quantum technologies. Potential applications include scalable quantum computing, microwave quantum networks, and quantum-limited amplifiers. However, progress in Josephson junction–based quantum technologies is facing the ongoing challenge of minimizing loss channels. This is also true for parametric superconducting devices based on nonlinear Josephson resonators. In this work, we report on the fabrication and characterization of low-loss Josephson parametric devices operated in the GHz frequency range, showing record internal quality factors. Specifically, we achieve internal quality factors Q int significantly exceeding 10 5 for both Josephson parametric converters and Josephson parametric amplifiers in the single-photon regime by fitting the scattering data. We confirm the extracted Q int values by analyzing purity of squeezed vacuum states generated by these devices. These low-loss devices mark a significant step forward in realizing high-performance quantum circuits, enabling further advancements in superconducting quantum technologies.
Microwave-to-optical transduction bridges microwave photons used in superconducting quantum circuits and optical photons suitable for long-distance transmission, making it a key enabling technology for distributed quantum networks. Scalable implementation, however, requires device architectures that combine practical conversion performance with low fabrication complexity, whereas many existing approaches rely on heterogeneous material integration. Here, we demonstrate a co-localized microwave-to-optical transducer that integrates electrostatic excitation, mechanical mediation, and optical readout within a single optomechanical cavity. The electrostatic actuator is implemented using only a single metallization layer, reducing device complexity and avoiding the need for separate electromechanical and optomechanical resonators. This compact, fabrication-friendly architecture offers a practical route toward scalable integrated microwave photonics and future chip-scale microwave-to-optical interfaces for hybrid quantum systems.