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Engineering

Microfabricated Atomic Vapor Cells with Multi-Optical Channels Based on an Innovative Inner-Sidewall Molding Process

Mingzhi Yu, Yao Chen, Yongliang Wang, Xiangguang Han, Guoxi Luo, Libo Zhao, Yanbin Wang, Yintao Ma, Shun Lu, Ping Yang, Qijing Lin, Kaifei Wang, Zhuangde Jiang

Published Nov 1, 2023• 22 citations
Publisher

Abstract

Existing microfabricated atomic vapor cells have only one optical channel, which is insufficient for supporting the multiple orthogonal beams required by atomic devices. In this study, we present a novel wafer-level manufacturing process for fabricating multi-optical-channel atomic vapor cells and an innovative method for batch processing the inner sidewalls of millimeter glass holes to meet optical channel requirements. Surface characterization and transmittance tests demonstrate that the processed inner sidewalls satisfy the criteria for an optical channel. In addition, the construction of an integrated processing platform enables multilayer non-isothermal anode bonding, the filling of inert gases, and the recovery and recycling of noble gases. Measurements of the absorption spectra and free-induction decay signals of xenon-129 (129Xe) and xenon-131 (131Xe) under different pump-probe schemes demonstrate the suitability of our vapor cell for use in atomic devices including atomic gyroscopes, dual-beam atomic magnetometers, and other optical/atomic devices. The proposed micromolding technology has broad application prospects in the field of optical-device processing.

DOI
10.1016/j.eng.2023.08.016

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Existing microfabricated atomic vapor cells have only one optical channel, which is insufficient for supporting the multiple orthogonal beams required by atomic devices. In this study, we present a novel wafer-level manufacturing process for fabricating multi-optical-channel atomic vapor cells and an innovative method for batch processing the inner sidewalls of millimeter glass holes to meet optical channel requirements. Surface characterization and transmittance tests demonstrate that the processed inner sidewalls satisfy the criteria for an optical channel. In addition, the construction of an integrated processing platform enables multilayer non-isothermal anode bonding, the filling of inert gases, and the recovery and recycling of noble gases. Measurements of the absorption spectra and free-induction decay signals of xenon-129 (129Xe) and xenon-131 (131Xe) under different pump-probe schemes demonstrate the suitability of our vapor cell for use in atomic devices including atomic gyroscopes, dual-beam atomic magnetometers, and other optical/atomic devices. The proposed micromolding technology has broad application prospects in the field of optical-device processing.
Abstract Microfabricated alkali vapor cells enable the miniaturization of atomic sensors, but require collective wafer-level integration of complex features. In many applications-including magnetometers, gyroscopes, magneto-optical traps, and fluorescence imaging-multiple optical accesses are needed to enhance performance. Yet, achieving this without compromising manufacturability remains challenging. In this work, we present a wafer-level fabrication approach that enables three orthogonal optical pathways in microfabricated alkali vapor cells, using fully scalable and collective processes. Our method relies on the thermal reflow of glass preforms, shaped by laser-assisted etching (LAE) and bonded between silicon frames. The relatively low surface roughness produced by LAE allows for effective reflow, which further smooths the surfaces without significantly compromising the optical planarity of the windows. This process results in multi-axis vapor cells featuring embedded, optics-grade lateral windows. We evaluate the device performance through both single-beam and dual-beam atomic magnetometry measurements. Magnetic sensitivities better than 200 fT Hz − 1 are demonstrated along each of the three orthogonal axes, confirming the potential of the approach for tri-axis magnetic field sensing at sub-picotesla resolution. This fabrication strategy opens new perspectives for versatile, high-performance atomic sensors, fully compatible with wafer-level integration and mass production.
We investigate the architecture of microfabricated vapor cells with reflective sidewalls for applications in chip scale atomic sensors. The optical configuration in operation is suitable for both one-beam and two-beam (pump & probe) schemes. In the miniaturized vapor cells, the laser beam is reflected twice by the aluminum reflectors on the wet etched 54.7° sidewalls to prolong the optical length significantly, thus resulting in a return reflectance that is three times that of bare silicon sidewalls. To avoid limitations faced in the fabrication process, a simpler, more universal and less constrained fabrication process of microfabricated vapor cells for chip scale atomic sensors with uncompromised performance is implemented, which also decreases the fabrication costs and procedures. Characterization measurements show that with effective sidewall reflectors, mm³ level volume and feasible hermeticity, the elongated miniature vapor cells demonstrate a linear absorption contrast improvement by 10 times over the conventional micro-electro-mechanical system (MEMS) vapor cells at ~50 °C in the rubidium D1 absorption spectroscopy experiments. At the operating temperature of ~90 °C for chip scale atomic sensors, a 50% linear absorption contrast enhancement is obtained with the reflective cell architecture. This leads to a potential improvement in the clock stability and magnetometer sensitivity. Besides, the coherent population trapping spectroscopy is applied to characterize the microfabricated vacuum cells with 46.3 kHz linewidth in the through cell configuration, demonstrating the effectiveness in chip scale atomic sensors.
The most appealing features of chip-scale quantum sensors are their capability to maintain extreme sensitivity while enabling large-scale batch manufacturing. This necessitates high-level integration and wafer-level fabrication of atomic vapor cells. In this paper, we describe a micromachining paradigm for wafer-level atomic vapor cells functionalized by CMOS-compatible non-magnetic heaters and temperature sensors and demonstrate several innovative applications. Leveraging standard micro-nanofabrication technology, the integrated vapor cells achieved an ultra-long optical access of 5 mm, nearly four time that of previously microfabricated vapor cells. The feasibility of the integrated atomic vapor cells fabrication process was verified by a consecutive 30-day aging test in a harsh environment (operating temperature of 473 K and vacuum of approximately 1 Pa). Benefiting from the ultra-long optical path, we observed several typical quantum effects, including the saturation absorption and spin fluctuations, a regime previously inaccessible with conventional micromachined vapor cells. Finally, a zero-field quantum magnetometry with an ultra-high magnetic sensitivity of 12 fT/Hz1/2 was also demonstrated. Our achievements broaden the potential applications of microfabricated atomic vapor cells and pave the way for scalable manufacturing of ultrasensitive, chip-scale quantum sensors.
Abstract Millimeter-scale atomic vapor cells can be accurately and economically batch-fabricated by anodically bonding silicon and glass wafers, enabling the manufacturing of miniature atomic clocks and quantum sensors. However, silicon’s high dielectric constant and conductive losses at millimeter wave frequencies limit its suitability for Rydberg-atom electrometry, which enables highly sensitive electric-field measurements by exploiting the extreme polarizability of Rydberg states in alkali atoms. To address this, we present an all-glass wafer-level microfabrication process that eliminates silicon, creating hermetically sealed vapor cells that are stable over long timelines with embedded cesium dispensers. Femtosecond laser machining precisely defines the cell geometry, and laser-activated alkali loading ensures reliable filling. We demonstrate long-term vacuum stability and robust Rydberg excitation through electromagnetically induced transparency measurements. We then use these cells to measure a 34 GHz millimeter wave field resonant with the 58D5/2→60P3/258{{\rm{D}}}_{5/2}\to 60{{\rm{P}}}_{3/2}58D5/2​→60P3/2​ 58 D 5 / 2 → 60 P 3 / 2 transition using Autler-Townes splitting and observe the expected linear dependence with field strength. This work demonstrates that the all-glass bonding approach offers a highly durable low-loss cell alternative for miniaturized millimeter wave and microwave quantum sensing, with the potential to flexibly incorporate a range of other dielectric and semiconductor materials and integrate with photonic and electronic technologies.
This paper demonstrates a new type of 3D alkali vapor cell with vertical sidewalls. We use anisotropic wet etching to prepare blind holes with vertical sidewalls on a (100) silicon wafer, and then complete the preparation of the alkali vapor cell through glass reflow and anodic bonding. The cell is a silicon-glass double-layer structure with a height of 1.7 mm, and the optical path is parallel to the silicon substrate. The 3D alkali vapor cell is suitable for both single - and multi-beam atomic sensors.
Microfabricated alkali vapor cells are key to enable miniature devices such as atomic clocks and optically pumped magnetometers with reduced size, weight, and power. Yet, more versatile fabrication methods are still needed to further expand their use cases. Here, we demonstrate an approach to collectively fill and seal microfabricated cesium cells using locally sealed microchannels patterned within one of the glass substrates comprising the cells. Unlike current methods that rely on wafer-level anodic bonding as the last sealing step, an approach based on local sealing opens the path to features so far limited to traditional glass-blown cells, including the ability to deposit temperature-sensitive antirelaxation coatings, reaching lower background gas pressure without an additional gettering material or filling with diverse atomic or molecular species.