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中国物理B:英文版

Integrated physics package of a chip-scale atomic clock

Li, Shao-liang, Xu, Jing, Zhang, Zhiqiang, Zhao, Lu-Bing, Long, Liang Liang, Wu, Ya-ming

Published Jan 1, 2014• 1 citation
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The physics package of a chip-scale atomic clock (CSAC) has been successfully realized by integrating vertical cavity surface emitting laser (VCSEL), neutral density (ND) filter, λ/4 wave plate, 87 Rb vapor cell, photodiode (PD), and magnetic coil into a cuboid metal package with a volume of about 2.8 cm 3 . In this physics package, the critical component, 87 Rb vapor cell, is batch-fabricated based on MEMS technology and in-situ chemical reaction method. Pt heater and thermistors are integrated in the physics package. A PTFE pillar is used to support the optical elements in the physics package, in order to reduce the power dissipation. The optical absorption spectrum of 87 Rb D1 line and the microwave frequency correction signal are successfully observed while connecting the package with the servo circuit system. Using the above mentioned packaging solution, a CSAC with short-term frequency stability of about 7 × 10 −10 τ −1/2 has been successfully achieved, which demonstrates that this physics package would become one promising solution for the CSAC.

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We introduce a miniaturized magnetic shield integrated into the physics package of a chip-scale atomic clock. The primary shield, which is formed by a stack of precision-machined high-permeability plates, compactly sits inside the package as it is designed to be the internal supporting frame. Further improved by a Kovar lid, the best frequency sensitivity to a longitudinal external field is 1.1(3) × 10 −11 / μ T, which is consistent with the measured shielding factor, while the transverse sensitivity is well below 10 −12 / μ T. The sealed unit on a chip carrier alone allows stable clock operation with a frequency instability of 4.8(2) × 10 −12 at 1000 s.

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The physics package of a chip-scale atomic clock (CSAC) has been successfully realized by integrating vertical cavity surface emitting laser (VCSEL), neutral density (ND) filter, λ/4 wave plate, 87 Rb vapor cell, photodiode (PD), and magnetic coil into a cuboid metal package with a volume of about 2.8 cm 3 . In this physics package, the critical component, 87 Rb vapor cell, is batch-fabricated based on MEMS technology and in-situ chemical reaction method. Pt heater and thermistors are integrated in the physics package. A PTFE pillar is used to support the optical elements in the physics package, in order to reduce the power dissipation. The optical absorption spectrum of 87 Rb D1 line and the microwave frequency correction signal are successfully observed while connecting the package with the servo circuit system. Using the above mentioned packaging solution, a CSAC with short-term frequency stability of about 7 × 10 −10 τ −1/2 has been successfully achieved, which demonstrates that this physics package would become one promising solution for the CSAC.
We introduce a miniaturized magnetic shield integrated into the physics package of a chip-scale atomic clock. The primary shield, which is formed by a stack of precision-machined high-permeability plates, compactly sits inside the package as it is designed to be the internal supporting frame. Further improved by a Kovar lid, the best frequency sensitivity to a longitudinal external field is 1.1(3) × 10 −11 / μ T, which is consistent with the measured shielding factor, while the transverse sensitivity is well below 10 −12 / μ T. The sealed unit on a chip carrier alone allows stable clock operation with a frequency instability of 4.8(2) × 10 −12 at 1000 s.