The next step in building quantum computers is to develop hardware architectures that allow scalability without sacrificing coherence. Future designs seem headed toward multilayered circuits with embedded three-dimensional structures and superconducting coatings. The authors demonstrate a multilayered integrated quantum circuit, combining a micromachined microwave cavity resonator with a superconducting qubit. They address the mechanism of coupling and its control, engineering considerations that affect coherence times, and challenges in fabrication such as superconductor bonding.
The next step in building quantum computers is to develop hardware architectures that allow scalability without sacrificing coherence. Future designs seem headed toward multilayered circuits with embedded three-dimensional structures and superconducting coatings. The authors demonstrate a multilayered integrated quantum circuit, combining a micromachined microwave cavity resonator with a superconducting qubit. They address the mechanism of coupling and its control, engineering considerations that affect coherence times, and challenges in fabrication such as superconductor bonding.
Abstract As experimental quantum information processing (QIP) rapidly advances, an emerging challenge is to design a scalable architecture that combines various quantum elements into a complex device without compromising their performance. In particular, superconducting quantum circuits have successfully demonstrated many of the requirements for quantum computing, including coherence levels that approach the thresholds for scaling. However, it remains challenging to couple a large number of circuit components through controllable channels while suppressing any other interactions. We propose a hardware platform intended to address these challenges, which combines the advantages of integrated circuit fabrication and the long coherence times achievable in three-dimensional circuit quantum electrodynamics. This multilayer microwave integrated quantum circuit platform provides a path towards the realisation of increasingly complex superconducting devices in pursuit of a scalable quantum computer.
We present a device demonstrating a lithographically patterned transmon integrated with a micromachined cavity resonator. Our two-cavity, one-qubit device is a multilayer microwave integrated quantum circuit (MMIQC), comprising a basic unit capable of performing circuit-QED (cQED) operations. We describe the qubit-cavity coupling mechanism of a specialized geometry using an electric field picture and a circuit model, and finally obtain specific system parameters using simulations. Fabrication of the MMIQC includes lithography, etching, and metallic bonding of silicon wafers. Superconducting wafer bonding is a critical capability that is demonstrated by a micromachined storage cavity lifetime 34.3μs, corresponding to a quality factor of 2 million at single-photon energies. The transmon coherence times are T1=6.4μs, and T2Echo=11.7μs. We measure qubit-cavity dispersive coupling with rate χqμ/2π=−1.17MHz, constituting a Jaynes-Cummings system with an interaction strength g/2π=49MHz. With these parameters we are able to demonstrate cQED operations in the strong dispersive regime with ease. Finally, we highlight several improvements and anticipated extensions of the technology to complex MMIQCs.
Build quantum computers using superconducting qubits and microwave cavity technology Creating qubits with sufficiently long coherence times remains one of the central challenges in building practical quantum computers. Quantum Computing with Superconducting Qubits and Cavities unites the latest advances in superconducting qubits, ultra-high-Q microwave cavities, and cavity–transmon architectures that are emerging as one of the leading platforms for scalable, fault-tolerant quantum computing. By combining conceptual insight with practical implementation, the book equips readers to understand not only how these systems work, but why they are at the forefront of the quantum technology revolution. The book explores quantum computation using bosonic modes, Fock states, qudits, quantum memories, and modern bosonic error-correcting codes including cat, binomial, and GKP encodings. Fundamental concepts are developed through clear physical explanations, while rigorous mathematical treatments are introduced where needed to provide a deeper understanding. Dedicated reviews of the underlying principles of quantum physics make the material accessible to newcomers without sacrificing the depth expected by researchers and practicing engineers. Quantum Computing with Superconducting Qubits and Cavities also includes: Design principles and operation of superconducting transmon qubits integrated with high-coherence microwave cavities for scalable quantum architectures. Bosonic quantum error-correction strategies that dramatically extend coherence and move quantum computing closer to fault-tolerant operation. Applications of quantum computing, including integer factoring, database searching, quantum chemistry, condensed-matter physics, and materials science simulations beyond the reach of classical computers. Materials science, fabrication methods, and surface treatments that continue to drive record improvements in qubit and cavity coherence. The global race toward quantum computing, including major international investments and the rapidly expanding role of superconducting quantum technologies. Written for physicists, materials scientists, electrical engineers, computer scientists, graduate students, and researchers entering quantum information science, this book provides both the theoretical foundation and the practical knowledge needed to engage with one of the fastest-growing fields in modern science and engineering.
Superconducting enclosures will be key components of scalable quantum computing devices based on circuit quantum electrodynamics. Within a densely integrated device, they can protect qubits from noise and serve as quantum memory units. Whether constructed by machining bulk pieces of metal or microfabricating wafers, 3D enclosures are typically assembled from two or more parts. The resulting seams potentially dissipate crossing currents and limit performance. In this letter, we present measured quality factors of superconducting cavity resonators of several materials, dimensions, and seam locations. We observe that superconducting indium can be a low-loss RF conductor and form low-loss seams. Leveraging this, we create a superconducting micromachined resonator with indium that has a quality factor of two million, despite a greatly reduced mode volume. Inter-layer coupling to this type of resonator is achieved by an aperture located under a planar transmission line. The described techniques demonstrate a proof-of-principle for multilayer microwave integrated quantum circuits for scalable quantum computing.
Microwave filtering for superconducting qubits is a key element of quantum computing technology, enabling high coherence and fast state detection. This work presents the design and implementation of novel microwave Purcell filters for superconducting quantum circuits, integrated within a multilayer printed circuit board (PCB). The off-chip design removes all filter components from the qubit substrate, reducing device complexity, improving layout footprint and allowing better scalability to large qubit counts. Each embedded filter can couple up to nine readout resonators, enabling efficient multiplexed readout. Electromagnetic simulations of the filter predict a thousand-fold improvement in qubit isolation from the readout port. The design was experimentally validated under cryogenic conditions in conjunction with a 35-qubit device, demonstrating compatibility of the PCB-based filter with high-coherence superconducting qubits. The comparison of the measured qubit median T1 of 84 μs with the expected radiative limit from electromagnetic simulations validated the presence of Purcell filtering in the system.
The superconducting quantum computer is an implementation of the quantum computer and a current leader the field in terms of performance and potential for scalability to large systems. Its two main components are the superconducting microwave resonator and the quantum bit (qubit). In Chapter 1, the concept of quantum computing is introduced, and the superconducting microwave resonator is explained in depth, along with a glimpse at the qubit and a description of two level system loss, the most prominent form of loss in low-power superconducting quantum circuits. Scalability is essential to the development of fault-tolerant quantum computing, as error correction requires a large array of quantum bits. The multilayer quantum circuit architecture is rising to the forefront as a solution to many of the scalability issues facing the field today. Chapter 2 summarizes some of these scalability issues, such as the suppression of unwanted modes and materials losses, and presents an overview of multilayer architectures applied to superconducting quantum circuits. The chapter further delves into indium bump bonding, an essential technique in multilayer circuit fabrication.In Chapter 3, we experimentally demonstrate a thermocompression bonding technology between on-chip indium thin films and apply it to capped superconducting devices. These devices can be used as a building block towards a more scalable architecture: the multilayer quantum circuit. We characterize the dc and microwave performance of these bonded devices at room temperature as well as cryogenic temperatures. At 10 mK, we find a small but significant dc bond resistance of 49.2μΩ cm2. A tunnel-capped, bonded device shows minimal microwave reflections and clean transmission up to 6.8 GHz compared to a similar uncapped device, demonstrating good performance. As a proof of concept, we fabricate and measure a set of tunnel-capped superconducting resonators, demonstrating marginal deterioration in resonator performance due to the bonding procedure. This work demonstrates that thermocompression bonding between thin on-chip indium films is a useful addition to the multilayer quantum circuit toolbox, and that this technique, when applied to form the tunnel-capped superconducting device, shows a promising step towards more scalable architectures. Indium is becoming ubiquitous in superconducting microwave circuits as it continues to be widely adopted as a bonding medium. However, the loss mechanisms in superconducting indium films have not been examined until now. In Chapter 4, we characterize microwave loss in indium and aluminium/indium thin films on silicon substrates by measuring superconducting coplanar waveguide resonators and estimating the main loss parameters at powers down to the sub-photon regime and at temperatures between 10 and 450 mK. We compare films deposited by thermal evaporation, sputtering, and molecular beam epitaxy. We study the effects of heating in vacuum and ambient atmospheric pressure as well as the effects of pre-deposition wafer cleaning using hydrofluoric acid. The microwave measurements are supported by thin film metrology including secondary-ion mass spectrometry. For thermally evaporated and sputtered films, we find that two-level states (TLSs) are the dominating loss mechanism at low photon number and temperature. Thermally evaporated indium is determined to have a TLS loss tangent due to indium oxide of∼5×10−5. The molecular beam epitaxial films show evidence of formation of a substantial indium-silicon eutectic layer, which leads to a drastic degradation in resonator performance.