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Bulletin of the American Physical Society

Scaling up package I/O for superconducting qubits

Steven J. Weber, Danna Rosenberg, Jovi Miloshi, John Cummings, James D. Krieger, Sam Alterman, David Conway, Rabindra Nath Das, Cyrus F. Hirjibehedin, David K. Kim, Elizabeth J. Kowalski, Benjamin Lienhard, Alexander J. Melville, Bethany M. Niedzielski, John Rokosz, Wayne H. Woods, Jonilyn Yoder, Andrew J. Kerman, William D. Oliver

Published Mar 6, 2019• 0 citations
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Solid-state qubits with transition frequencies in the microwave regime, such as superconducting qubits, are at the forefront of quantum information processing.However, high-fidelity, simultaneous control of superconducting qubits at even a moderate scale remains a challenge, partly due to the complexities of packaging these devices.Here, we present an approach to microwave package design focusing on material choices, signal line engineering, and spurious mode suppression.We describe design guidelines validated using simulations and measurements used to develop a 24-port microwave package.Analyzing the qubit environment reveals no spurious modes up to 11 GHz.The material and geometric design choices enable the package to support qubits with lifetimes exceeding 350 μs.The microwave package design guidelines presented here address many issues relevant for near-term quantum processors.
Packages capable of supporting large arrays of high-coherence superconducting qubits are vital for the realisation of fault-tolerant quantum computers and the necessary high-throughput metrology required to optimise fabrication and manufacturing processes. We present a wafer-scale packaging architecture supporting over 500 qubits on a single 3-inch die. The package is engineered to suppress parasitic RF modes, and to mitigate material loss through simulation-informed design while managing differential thermal contraction to ensure robust operation at millikelvin temperatures. System-level heat-load calculations from a large wiring payload show this package may be operated in commercial dilution refrigerators. Measurements of the qubits loaded into the package show median T1T_1T1​, T2e∼100 μT_{2e} \sim 100~μT2e​∼100 μs ($\sim$100 qubits) alongside readout with median fidelity of 97.5% (54 qubits) and a median qubit temperature of 36 mK (54 qubits). These results validate the performance of these packages and demonstrate that large-scale integration can be achieved without compromising device performance. Finally, we highlight the utility of these packages as a tool for high throughput feedback on qubit figures of merit over large sample sizes, allowing identification of performance outliers in the tails of the coherence distribution, a critical capability for informing fabrication and manufacture of high-quality quantum qubits and quantum processors.