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Technical digest - International Electron Devices Meeting/Technical digest

Packaging and integration challenges in a superconducting-qubit-based quantum computer

Marissa Giustina

Published Dec 11, 2021• 2 citations
Publisher

Abstract

Realization of a fault-tolerant error-corrected quantum computer based on superconducting microwave qubits places unique demands on devices, packaging, and system integration. We present an overview of some near-term system challenges in scaling up device IO, with a specific focus on device packaging.
DOI
10.1109/iedm19574.2021.9720513

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