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Bulletin of the American Physical Society

Flip Chip Packaging for Superconducting Quantum Computers

Adel A. Elsherbini, Javier Falcon, Jeanette M. Roberts, Román Caudillo, Stefano Poletto, Ye Seul Nam, David J. Michalak, Lester F. Lampert, Zachary Yoscovits, Joe Saucedo, Alessandro Bruno, James S. Clarke, L. DiCarlo

Published Mar 8, 2018• 0 citations
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This paper describes a novel multi-metal layered interconnect-based heterogeneous integration approach for developing a reworkable superconducting qubit package. Various microbump options, including gold, tin, indium, and tin indium, were used to achieve the desired flip-chip configurations. As a case study, we demonstrate a reworkable cryogenic superconducting qubit package capable of interconnecting up to 32 microwave lines. The flip-chip package configurations show low (below 30 dB @ RT) nearest-neighbor crosstalk up to 10 GHz. Initial qubit measurements at low temperatures (~10 mK) show qubit lifetime T1> 100 μs (Q > 2M), which is comparable to the planar versions measured in our standard Al wirebonded package. Keywords—qubit, heterogeneous integration, interconnect, flip-chip, crosstalk.
Using a multi-layered printed circuit board, we propose a 3D architecture suitable for packaging superconducting chips, especially chips that contain two-dimensional qubit arrays. In our proposed architecture, the center strips of the buried coplanar waveguides protrude from the surface of a dielectric layer as contacts. Since the contacts extend beyond the surface of the dielectric layer, chips can simply be flip-chip packaged with on-chip receptacles clinging to the contacts. Using this scheme, we packaged a multi-qubit chip and performed single-qubit and two-qubit quantum gate operations. The results indicate that this 3D architecture provides a promising scheme for scalable quantum computing.