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Ultra-thin film NbN depositions for HEB heterodyne mixer on Si-substrates

Sascha Krause, Vincent Desmaris, Alexey Pavolotsky, Denis Meledin, Victor Y. Belitsky, Eckhard Pippel

Published Jan 1, 2013• 0 citations
OpenAlex

Abstract

The key of improving hot-electron bolometer (HEB) mixer performance lies inevitably in the quality of ultra-thin NbN films itself. This work presents a thorough investigation of crucial process parameters of NbN films deposited by means of reactive DC-sputtering on Si-substrates at elevated temperatures up to 750°C.The polycrystalline NbN films with thickness of 4 to 10nm were characterized by DC resistivity measurements, ellipsometry and high resolution transmission electron microscopy (HRTEM) in order to confirm thickness and film structure. Since the macroscopic properties such as critical temperature, thickness as well as the transition width to the superconducting state are directly linked to HEB mixer noise temperature and IF bandwidth, a set of experiments were conducted to enhance aforementioned properties. We considered deposition temperature, RF biasing, nitrogen and argon partial and total pressure during deposition as major process variable parameters. Careful optimization of the deposition conditions allowed setting up a process resulting in high-quality NbN ultra-thin films with thickness of 5.5nm exhibiting Tc of 10.5K. Moreover, the transition width could be kept as low as 1.4K. The produced films were stored at ambient conditions and re-characterized over a period of 4 month without measurable degradation.

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•Jan 1, 2013•0 citations
The key of improving hot-electron bolometer (HEB) mixer performance lies inevitably in the quality of ultra-thin NbN films itself. This work presents a thorough investigation of crucial process parameters of NbN films deposited by means of reactive DC-sputtering on Si-substrates at elevated temperatures up to 750°C.The polycrystalline NbN films with thickness of 4 to 10nm were characterized by DC resistivity measurements, ellipsometry and high resolution transmission electron microscopy (HRTEM) in order to confirm thickness and film structure. Since the macroscopic properties such as critical temperature, thickness as well as the transition width to the superconducting state are directly linked to HEB mixer noise temperature and IF bandwidth, a set of experiments were conducted to enhance aforementioned properties. We considered deposition temperature, RF biasing, nitrogen and argon partial and total pressure during deposition as major process variable parameters. Careful optimization of the deposition conditions allowed setting up a process resulting in high-quality NbN ultra-thin films with thickness of 5.5nm exhibiting Tc of 10.5K. Moreover, the transition width could be kept as low as 1.4K. The produced films were stored at ambient conditions and re-characterized over a period of 4 month without measurable degradation.
Superconducting Hot-electron Bolometric (HE.B) mixers employing thin films ofNbN have become the devices of choice for heterodyne detection at tera,hertz frequen- cies. HEB mixers are inherently insensitive to the bandgap frequency of the superconducting material used in the device, in contrast to SIS mixers,. We have developed a fabrication pro- cess for thin NbN films at the National Institute of Standards and Technology in Boulder, CO. A two-fold approach can be taken. The first is to maximize the critical temperature of the superconducting device by growing thicker films at the expense of IF bandwidth, whereas the second approach focuses on maximizing the IF bandwidth at the expense of the critical tem- perature. So far, we have developed a film-deposition process utilizing our DC reactive mag- netron sputtering chamber. By current-biasing the RF plasma in a mixture of Ar and N2, while using a Nb target, we can control the film stoichiometry and produce films with thicknesses of 5 nm. The films are deposited on MgO substrates that are heated to about 800 °C during depo- sition. A typical critical temperature (TO is about 10 K and the transition width is very small (0.5 K). The films are evaluated by measuring their superconducting characteristics as well as their thickness and surface roughness by means of AFM analysis. Phonon-cooled HEB devices are fabricated from the films to study their performance as HEB mixers. The device fabrication process at UMass/Amherst involves lift-off lithography of the antenna (gold), and Reactive ion etching (R1E) or wet etching of the NbN. The I-V char- acteristics and noise temperatures of the devices were measured in order to determine their quality for PHEB applications.
The main focus of this work is the development of ultrathin NbN and NbTiN films. A reproducible and reliable deposition process for ultrathin NbN and NbTiN films for the use in phonon-cooled HEB devices was established. The ultrathin films were deposited on silicon (Si) substrates and on 2æm Si3N4 membranes by DC reactive magnetron sputtering. A method for the precise control of the nitrogen partial pressure by monitoring the target voltage has been introduced to deposit high quality, ultrathin NbN (3-4nm, Tc=8.5 K) and NbTiN (4-5nm, Tc=8K) films. Substrate heating of at least 600ʿC during the deposition is essential for the fabrication of ultrathin NbN and NbTiN films on Si substrates and Si3N4 membranes. The fabrication process required for HEB devices to be used in a quasi-optical mixer was developed. The ultrathin film was patterned by electron beam lithography (EBL), resulting in bolometer devices that measure areas of about 0.4 æm x 4 æm. The nature of the contact determines the interface transparency between the bolometer and the contact structure. Different cleaning processes have been performed and the influence on the contact resistance has been instigated. A better interface transparency gives less RF losses and could improve the HEB sensitivity and local oscillator (LO) requirement ...
We realized ultra thin NbN films sputtered grown on a 3C-SiC/Si substrate. The film with a thickness of 3.5-4.5 nm shows a 1', of 11.8 K, which is the highest I`, observed among ultra thin NbN films on different substrates. The high-resolution transmission electron microscopy (HRTEM) studies show that the film has a monocrystalline structure, confirming the epitaxial growth on the 3C-SiC. Based on a two-temperature model and input parameters from standard NbN films on Si, simulations predict that the new film can increase the IF bandwidth of a HEB mixer by about a factor of 2 in comparison to the standard films. In addition, we find standard NbN films on Si with a T c of 9.4 K have a thickness of around 5.5 nm, being thicker than expected (3.5 nm).
We report the fabrication and testing of hot electron bolometric mixers with an ultrathin NbN film as heterodyne receivers operating at terahertz frequencies. We found that the quality of the NbN strip is usually degraded by damage resulting from the fabrication process, and we developed a process for reducing such damage. We also fabricated HEB mixers with a new structure in order to study the IF bandwidth determined by the original quality of the NbN thin films. Investigations at 100 GHz revealed that the widest IF bandwidth of 2.0 GHz was obtained by a mixer based on a 2.8 nm-thick NbN film. An HEB mixer based on the 2.8 nm-thick NbN film was also fabricated and evaluated. The receiver noise temperature at 900 GHz was 780 K, the absorbed LO power was about 400 nW, and the conversion gain was -13 dB.
Hot-electron bolometer (HEB) mixers are a complex multi-layer thin film structure containing an ultra-thin superconducting film of NbN as a detecting element and a thick normal metal layer as an antenna structure. We have optimized the fabrication process starting with ultra-thin NbN films, Au films for antenna structures and their patterning using e-beam lithography and lift-off. The coupling between normal conducting antenna and NbN detector has been improved by introducing an intermediate NbN film to reduce proximity suppression of superconductivity in the detecting element. A critical temperature of about 9.5 K is reached for NbN films with a thickness between 5 nm and 6 nm. A twofold increase of the film thickness increases the critical temperature to 12 K. We have shown that a 20 nm thick buffer layer of NbN under a much thicker Au layer is sufficient to ensure a critical temperature of the bi-layer of 9 K. This value is close to the critical temperature of 5.5 nm thick HEB devices. The noise temperature of HEB mixer made using improved technology is about 800 K and was measured in a liquid cryogen free system with a quantum cascade laser as 2.5 THz local oscillator.
The key technology for low-noise THz receivers operating above 1 THz, lies inevitably in the employment niobium nitride superconductors with critical bulk temperature of 16-17K. The enhancement of HEB’s limited IF bandwidth has been a relevant topic for two decades and is associated with the quality, hence critical temperature, Tc, of the 3.5-6nm thin NbN films. This thesis revisits the concept of employing buffer-layers which have not been utilized yet to deposit NbN onto. As a result, state-of-the-art 5.5nm thin NbN films have been successfully deposited exhibiting Tc as high as 13.2K and RRR-figure-of-merit close to unity. These films show considerable potential for highly-integrated THz electronics.