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Technology on Protecting Josephson circuits from Magnetic Flux Trapping and Its Application for Josephson 4-Kbit RAMs

Shuichi Nagasawa, Hideaki Numata, Shuichi Tahara

Published Jan 22, 1997• 0 citations
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We developed an Nb-based fabrication process for single flux quantum (SFQ) circuits in a Japanese government project that began in September 2002 and ended in March 2007. Our conventional process, called the Standard Process (SDP), was improved by overhauling all the process steps and routine process checks for all wafers. Wafer yield with the improved SDP dramatically increased from 50% to over 90%. We also developed a new fabrication process for SFQ circuits, called the Advanced Process (ADP). The specifications for ADP are nine planarized Nb layers, a minimum Josephson junction (JJ) size of 1×1μm, a line width of 0.8μm, a JJ critical current density of 10kA/cm2, a 2.4Ω Mo sheet resistance, and vertically stacked superconductive contact holes. We fabricated an eight-bit SFQ shift register, a one million SQUID array and a 16-kbit RAM by using the ADP. The shift register was operated up to 120GHz and no short or open circuits were detected in the one million SQUID array. We confirmed correct memory operations by the 16-kbit RAM and a 5.7 times greater integration level compared to that possible with the SDP.

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Quantized values of magnetic flux trapped in a superconducting loop enable a new type of passive phase shifting elements. These elements can be incorporated into digital Josephson circuits making their design compact. We have proven the functionality of such phase shifters fabricated in conventional Nb/Al trilayer technology. We report on the successful low speed operation of a rapid single flux quantum toggle flip-flop circuit with the integrated passive pi-phase shifting element.

IEEE Transactions on Applied Superconductivity•Jun 1, 2007•22 citations

Applications of Josephson Electronics in Digital Systems

John X. Przybysz

Springer eBooks•Jan 1, 2000•1 citation
We developed an Nb-based fabrication process for single flux quantum (SFQ) circuits in a Japanese government project that began in September 2002 and ended in March 2007. Our conventional process, called the Standard Process (SDP), was improved by overhauling all the process steps and routine process checks for all wafers. Wafer yield with the improved SDP dramatically increased from 50% to over 90%. We also developed a new fabrication process for SFQ circuits, called the Advanced Process (ADP). The specifications for ADP are nine planarized Nb layers, a minimum Josephson junction (JJ) size of 1×1μm, a line width of 0.8μm, a JJ critical current density of 10kA/cm2, a 2.4Ω Mo sheet resistance, and vertically stacked superconductive contact holes. We fabricated an eight-bit SFQ shift register, a one million SQUID array and a 16-kbit RAM by using the ADP. The shift register was operated up to 120GHz and no short or open circuits were detected in the one million SQUID array. We confirmed correct memory operations by the 16-kbit RAM and a 5.7 times greater integration level compared to that possible with the SDP.
We have designed a 16 kbit superconducting latching/SFQ hybrid (SLASH) RAM, which enables high-frequency clock operation up to 10 GHz. The 16 kbit SLASH RAM consists of four 4 × 4 matrix arrays of 256 bit RAM blocks, block decoders, latching block drivers, latching block senses, impedance matched lines and the powering circuits. The 256 bit RAM block is composed of a 16 × 16 matrix array of vortex transitional memory cells, latching drivers, SFQ NOR decoders and latching sense circuits. We have also designed and implemented an SFQ NOR decoder that is composed of magnetically coupled multi-input OR gates and RSFQ inverters.