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Triangular nanobeam fabrication strategy for quantum photonic network realization in bulk diamond

Igal Bayn, Sara Mouradian, Luozhou Li, Tim Schröder, Ophir Gaathon, Ming Chang Lu, Aaron Stein, Dirk Englund

Published Jan 1, 2014• 0 citations
Publisher

Abstract

A triangular nanobeam architecture for a bulk-diamond quantum photonic networks based on silicon masking and angular etching is proposed and implemented. Cavities with Q>3×103 are demonstrated. S-bent interconnects for realizing a mm-scale network are introduced.
DOI
10.1364/cleo_qels.2014.ff1k.4

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Diamond photonics provides an attractive architecture to explore room temperature cavity quantum electrodynamics and to realize scalable multi-qubit computing. Here, we review the present state of diamond photonic technology. The design, fabrication and characterization of a novel nanobeam cavity produced in a single crystal diamond are demonstrated. The present cavity design, based on a triangular cross-section, allows vertical confinement and better signal collection efficiency than that of slab-based nanocavities and eliminates the need for a pre-existing membrane. The nanobeam is fabricated by focused-ion-beam (FIB) patterning. The cavity is characterized by confocal photoluminescence. The modes display quality factors of Q ∼220 and deviate in wavelength by only ∼1.7 nm from the nitrogen-vacancy (NV − ) color center zero phonon line (ZPL). The measured results are found to be in good agreement with three-dimensional finite-difference-time-domain (FDTD) calculations. A more advanced cavity design with Q =22 000 is modeled, showing the potential for high- Q implementations using the triangular geometry. The prospects of this concept and its application in spin non-demolition measurement and quantum computing are discussed.
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Many quantum networking applications require efficient photonic interfaces to quantum memories which can be produced at scale and with high yield. Synthetic diamond offers unique potential for the implementation of this technology as it hosts color centers which retain coherent optical interfaces and long spin coherence times in nanophotonic structures. Here, we report a technique enabling wafer-scale processing of thin-film diamond that combines ion implantation and membrane liftoff, high-quality overgrowth, targeted color center implantation, and serial, high-throughput thermocompression bonding with yields approaching unity. The deterministic deposition of thin diamond membranes onto semiconductor substrates facilitates consistent integration of photonic crystal cavities with silicon-vacancy (SiV) quantum memories. We demonstrate reliable, strong coupling of SiVs to photons with cooperativities approaching 50. Furthermore, we show that photonic crystal cavities can be reliably fabricated across several membranes bonded to the same handling chip. Our platform enables modular fabrication where the photonic layer can be integrated with functionalized substrates featuring electronic control lines such as coplanar waveguides for microwave delivery. Finally, we implement passive optical packaging with sub-decibel insertion loss. Together, these advances pave the way to the scalable assembly of optically addressable quantum memory arrays which are a key building block for modular photonic quantum interconnects.
Quantum technologies promise secure communication networks and powerful new forms of information processing, but building these systems at scale remains a major challenge. Diamond is an especially attractive material for quantum devices because it can host atomic-scale defects that emit single photons and store quantum information with exceptional stability. However, fabricating the optical structures needed to control light in diamond typically relies on slow, bespoke processes that are difficult to scale. In this work, we introduce a manufacturing approach that brings diamond quantum photonics closer to industrial production. Instead of sequentially defining each device by lithography written directly on diamond, we fabricate high-precision silicon masks using commercial semiconductor foundries and transfer them onto diamond via microtransfer printing. These masks define large arrays of nanoscale optical structures, shifting the most demanding pattern-definition steps away from the diamond substrate, improving uniformity, yield, and throughput. Using this method, we demonstrate hundreds of diamond "quantum microchiplets" with improved optical performance and controlled interaction with quantum emitters. The chiplet format allows defective devices to be replaced and enables integration with existing photonic and electronic circuits. Our results show that high-quality diamond quantum devices can be produced using scalable, foundry-compatible techniques. This approach provides a practical pathway toward large-scale quantum photonic systems and hybrid quantum-classical technologies built on established semiconductor manufacturing infrastructure.
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