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Journal of Applied Physics

Stable performance Nb variable thickness microbridge type Josephson junctions: A reproducible fabrication technique

Junichi Kodama, Shigeki Hontsu, Heihachiro Hirai, Hisao Oka, Tadao Kato, Yaichiro Watakabe, Takaaki Kato

Published Jun 1, 1983• 6 citations
Publisher

Abstract

A novel method of fabrication, as described in the following, was developed that ensures a good reproducibility of the junction. Namely, poly-Si was deposited over a Si substrate whose surface had been previously thermally oxidized. The poly-Si overlaid surface was then thermally oxidized. The bridge configuration of the junction was microprocessed by means of electron beam lithography. The fabricated configuration served as a mask in depositing the Nb layer on the substrate by means of rf sputtering to conclude the fabrication of a microbridge Josephson junction. The final process of the formation of the variable thickness microbridge configuration was readily carried out by placing another properly shaped mask over the masking bridge or by forming an SiO2 layer over the poly-Si layer. The SiO2 layer was processed by selective plasma etching so that it would act as a mask over the bridge portion. The stabilization of the characteristics of the junction has been achieved due to the passivation which takes place during the heat treatment in atmosphere by forced oxidation of the Nb film surface and to the annealing of the film itself.

DOI
10.1063/1.332442

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IEEE Transactions on Magnetics•Mar 1, 1991•35 citations
A novel method of fabrication, as described in the following, was developed that ensures a good reproducibility of the junction. Namely, poly-Si was deposited over a Si substrate whose surface had been previously thermally oxidized. The poly-Si overlaid surface was then thermally oxidized. The bridge configuration of the junction was microprocessed by means of electron beam lithography. The fabricated configuration served as a mask in depositing the Nb layer on the substrate by means of rf sputtering to conclude the fabrication of a microbridge Josephson junction. The final process of the formation of the variable thickness microbridge configuration was readily carried out by placing another properly shaped mask over the masking bridge or by forming an SiO2 layer over the poly-Si layer. The SiO2 layer was processed by selective plasma etching so that it would act as a mask over the bridge portion. The stabilization of the characteristics of the junction has been achieved due to the passivation which takes place during the heat treatment in atmosphere by forced oxidation of the Nb film surface and to the annealing of the film itself.
A procedure is described for fabricating thin film Nb/Nb oxide/Pb-alloy Josephson tunnel junctions that satisfies the principal requirements for integrated circuit design and fabrication. A deposited Nb film, evaporated from an e-gun heated source, was patterned by chemical etching to form a base electrode. A junction was completed by plasma etching and plasma oxidizing the Nb junction area to form a tunnel barrier and by depositing a Pb alloy counterelectrode. Josephson tunnel junctions with Nb/Nb oxide/Pb-Au-In structures were prepared with low excess subgap currents in the current-voltage (I-V) curve and with reproducible and stable I-V characteristics. Variations in junction current density from run-run were ± 15%. Seven 3-junction interferomeeters out of a population of 50,000 were shorted (99.99% yield) for causes not immediately attributable to photoresist-related defects. No changes in Josephson current were detected after thermal cycling 17,000 interferometers 1,800 × between room temperature and 4.2°K, after storing them for 2 years at 5°C, or after annealing 5,000 interferometers for 4.5 hours at 70°C.
Several reactive dry etching methods; ion etching, sputter etching and plasma etching, were studied in order to fabricate a niobium variable-thickness type thin film bridge (VTB). Niobium was etched by CF4 reactive sputter etching with submicron accuracy and no significant influence on the superconducting transition temperature except very near the surface (<200 Å). The niobium VTB behaved as an S-S'-S bridge, and a reduced self-heating effect was realized by a variable-thickness geometry. The DC Josephson effect was observed in the temperature range without thermal hysteresis. The quality factor of the I c R n product obtained was at least 0.42 mV.
To realize antenna-coupled Josephson detectors for microwave and millimeter-wave radiation, planar-type Nb nanobridge Josephson junctions were fabricated. Nb thin films whose thickness, the root mean square roughness and the critical temperature were 20.0 nm, 0.109 nm and 8.4 K, respectively were deposited using a DC magnetron sputtering at a substrate temperature of 700°C. Nanobridges were obtained from the film using 80-kV electron beam lithography and reactive ion-beam etching in CF 4 (90%) + O2 (10%) gases. The minimum bridge area was 65 nm wide and 60 nm long. For the nanobridge whose width and length were less than 110 nm, an I-V characteristic showed resistively-shunted-junction behaviour near the critical temperature. Moreover, Shapiro steps were observed in the nanobridge with microwave irradiation at a frequency of 6 – 30 GHz. The Nb nanobridges can be used as detectors in the antenna-coupled devices.
We have developed a new integration method for Josephson tunnel junctions based on high Tc superconducting compound materials such as NbN. In this method, a sputtered ZnO film has been employed as a resist mask which can be used in high substrate temperatures during the film deposition. It has been found that fine patterns of the refractory superconducting film can be obtained by this method and the patterning processes have no interference with other integration processes. We have applied this method to patterning base electrode of NbN and formed high quality NbN-oxide-Pb Josephson tunnel junctions by using an rf plasma oxidation. The fabricated junctions have been found to have a relatively large gap ( ∼ 4.0 mV ) and low current leak in the subgap region, and to be quite stable for thermal cyclings and storage. We have also fabricated quantum interference memory devices by integrating these junctions and the operation has been successfully demonstrated.
A simple and robust process for fabricating low-Tc Josephson junction integrated circuits has been developed. The process is designed around the Nb/A1203-Al/Nb trilayer, and utilizes nine masking steps to form two separate levels of trilayer Josephson junctions, as well as resistors, capacitors, and transmission lines. Materials used for interlayer dielectrics and passivation layers are silicon dioxide and silicon nitride formed by Plasma Enhanced Chemical Vapor Deposition (PECVD). The PECVD equipment that we use yields a high deposition rate at moderate substrate temperatures. We see no degradation of the junction characteristics due to these depositions. The measured loss tangent of this dielectric at 10 GHz using a parallel plate technique is 4.44 x 10-4. The dielectric constant of this material is 5.1 in the range of 50 to 400 GHz, measured using an on-chip resonator capacitively coupled to a single shunted Josephson junction. The physical quality of the oxide has been investigated using a variety of tests and has proven to be excellent. We have successfully fabricated and tested a variety of simple circuits using this process technology. Much more complex circuits are currently under development (Fig. 1).
A simple and robust process for fabricating low-T/sub c/ Josephson junction integrated circuits has been developed. The process is designed around the Nb/Al/sub 2/O/sub 3/-Al/Nb trilayer, and utilized nine masking steps to form two separate levels of trilayer Josephson junctions, as well as resistors, capacitors, and transmission lines. Materials used for interlayer dielectrics and passivation layers are silicon dioxide and silicon nitride formed by plasma-enhanced chemical vapor deposition (PECVD). The PECVD equipment yields a high deposition rate at moderate substrate temperatures. No degradation of the junction characteristics due to these depositions is seen. The measured loss tangent of this dielectric at 10 GHz using a parallel plate technique is 4.44*10/sup -4/. The dielectric constant of this material is 5.1 in the range of 50 to 400 GHz, measured using an on-chip resonator capacitively coupled to a single shunted Josephson junction. The physical quality of the oxide has been investigated using a variety of tests and has proven to be excellent. A variety of simple circuits using this process technology have been fabricated and tested. More complex circuits are currently under development.