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IEEE Transactions on Magnetics

All refractory Josephson tunnel junctions fabricated by reactive ion etching

Alexandre Shoji, S. Kosaka, Fujitoshi Shinoki, Masahiro Aoyagi, Hisao Hayakawa

Published May 1, 1983• 60 citations
Publisher

Abstract

We have developed a novel process for fabricating all refractory Josephson tunnel junctions whose base and counter electrodes are composed of (Nb-NbN) double-layered films. In this process, tunnel junctions have been isolated using a reactive ion etching from a junction sandwich which had been formed on an entire silicon wafer, and also the reactive ion etching has been used for patterning electrodes and insulation layers in devices. Fabricated junctions have yielded good tunneling characteristics with excellent uniformity and reproducibility. The maximum critical current density was widely changed from 300 A/cm2to 8 kA/cm2. All refractory single flux quantum(SFQ) memory cells in a 32×32 arrangement have been integrated with a 2.5 μm minimum linewidth on a chip using this process, and an SFQ cell in the memory array has been successfully operated. The maximum deviation of critical currents in the memory array was measured to be ±6.5%.

DOI
10.1109/tmag.1983.1062292

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We have developed a novel process for fabricating all refractory Josephson tunnel junctions whose base and counter electrodes are composed of (Nb-NbN) double-layered films. In this process, tunnel junctions have been isolated using a reactive ion etching from a junction sandwich which had been formed on an entire silicon wafer, and also the reactive ion etching has been used for patterning electrodes and insulation layers in devices. Fabricated junctions have yielded good tunneling characteristics with excellent uniformity and reproducibility. The maximum critical current density was widely changed from 300 A/cm2to 8 kA/cm2. All refractory single flux quantum(SFQ) memory cells in a 32×32 arrangement have been integrated with a 2.5 μm minimum linewidth on a chip using this process, and an SFQ cell in the memory array has been successfully operated. The maximum deviation of critical currents in the memory array was measured to be ±6.5%.
All hard Josephson tunnel junctions, whose base and counter electrodes are composed of double-layered niobium nitride (NbN) and niobium (Nb) films, have been successfully fabricated by isolating a junction sandwich formed on a whole silicon wafer with a reactive ion etching technique. The reactive ion etching technique has been used for patterning both base and counterelectrodes, and self-aligning definition of junction areas has been performed. The fabricated junctions show good quality single-particle tunneling characteristics and excellent uniformity in critical currents.
A novel process suitable for fabricating superconducting circuitry based on the all refractory material NbN is described. In this process, an in-situ trilayer film composed of NbN/MgO/NbN is used to fabricate Josephson tunnel junctions. Reactive ion etching processes are used to delineate devices and pattern insulators and metallizations. Fabricated junctions have yielded good tunneling characteristics with reasonable current density uniformity and reproducibility. Devices with gap voltages close to 5mV have been achieved for high quality junctions. In addition to the trilayer, there are two wiring layers, two resistor depositions, and two insulation layers, constituting a full NbN based fabrication technology. Using this process, we fabricated and successfully tested thin film DC SQUID and time domain reflectometer (TDR) circuits. Preliminary measurements suggest that the critical temperature of these circuits is well within the operating temperature of commercial two-stage closed cycle refrigerators.
A novel process suitable for fabrication superconducting circuitry based on the all refactory material NbN is described. In this process, and in-situ trilayer film composed of NbN/MgO/NbN is used to fabricate Josephson tunnel junctions. Reactive ion etching processes are used to delineate devices and pattern insulators and metallizations. Fabricated junctions have yielded good tunneling characteristics with reasonable current density uniformity and reproducibility. Devices with gap voltages close to 3mV have been achieved for high quality junctions (Vm 20 mV). In addition to the trilayer, there are two wiring layers, two resistor depositions, and two insulation layers, constituting a full NbN based fabrication technology. Using this process, we fabricated and successfully tested thin film DC SQUID and time domain reflectometer (TDR) circuits. Preliminary measurements suggest that the critical temperature of these circuits is well within the operating temperature of commercial two-stage closed cycle refrigerators. (Author)
All refractory Josephson loop logic circuits for a 1Kbit SFQ memory have been developed. The circuit fabircation technology, using NbN/Nb double layered junction formation and reactive ion etching(RIE)with a 2.5μm minimum feature size and 1.5μm overlay registration, has been utilized. A highly selective and anisotropic RIE process has been performed, in which a CCl2F2+ Ne gas mixture has been used as etching gases. The experimental circuit consists of address decoders and line drivers, which are based on the principle of current steering in superconducting loops. The decoder and driver were successfully operated with the gate current margin of ±18% and ±14%, respectively. The decoder internal delay time was measured to be about 1.5 ns. It is revealed that these circuits have a satisfactory preformance to be used in the 1Kbit SFQ memory.
We have developed a new integration method for Josephson tunnel junctions based on high Tc superconducting compound materials such as NbN. In this method, a sputtered ZnO film has been employed as a resist mask which can be used in high substrate temperatures during the film deposition. It has been found that fine patterns of the refractory superconducting film can be obtained by this method and the patterning processes have no interference with other integration processes. We have applied this method to patterning base electrode of NbN and formed high quality NbN-oxide-Pb Josephson tunnel junctions by using an rf plasma oxidation. The fabricated junctions have been found to have a relatively large gap ( ∼ 4.0 mV ) and low current leak in the subgap region, and to be quite stable for thermal cyclings and storage. We have also fabricated quantum interference memory devices by integrating these junctions and the operation has been successfully demonstrated.