arXiv:2610.41890
Control-Noise Trade-offs in Industrially Integrated ${}^{28}\mathrm{Si}/\mathrm{SiGe}$ Spin-1/2 Qubits
Leon C. Camenzind, Ik Kyeong Jin, Yi-Hsien Wu, Akito Noiri, Kenta Takeda, Takashi Nakajima, Takashi Kobayashi, Giordano Scappucci, Seigo Tarucha
Abstract
Scaling silicon spin qubits to fault-tolerant processors requires semiconductor foundry integration, yet it remains unclear how industrial fabrication and dense device integration affect qubit control and noise. Here we study ${}^{28}\mathrm{Si}/\mathrm{SiGe}$ electron spin-1/2 qubits fabricated using Intel's industry-compatible 300 mm process and incorporating micromagnets for electrically driven spin resonance, using a high-performance device fabricated in the RIKEN research cleanroom as a reference. Primitive $π/2$-gate fidelities reach the 99.99% level in the Intel devices, which also exhibit longer idle coherence, weaker low-frequency correlations and reduced qubit-to-qubit variability across several measured characteristics. In the present Intel devices, the micromagnets are integrated inline with the back-end-of-line (BEOL) contact routing, with their separation from the quantum well set through the vertical stack design. Relative to the reference, their larger separation contributes to weaker longitudinal and transverse magnetic-field gradients. The weaker longitudinal gradient suppresses the conversion of charge noise into qubit-frequency fluctuations, whereas the weaker transverse gradient reduces electrically driven spin-resonance efficiency and makes drive-dependent errors relevant at lower Rabi frequencies. Additional BEOL routing and metal levels required for two-dimensional arrays make such placement decisions increasingly consequential when scaling. These results establish an integration-level control-noise trade-off linking micromagnet placement within densely routed layouts to achievable gate performance, while very high-fidelity operation remains possible in industrially fabricated devices.
AI Summary
The paper examines how micromagnet placement within industrial interconnect stacks affects the balance between electrical spin control and noise sensitivity in $^{28}\mathrm{Si}/\mathrm{SiGe}$ qubits. It compares two three-qubit devices fabricated using Intel’s industry-compatible 300 mm process with a five-qubit academic reference, using coherence measurements, frequency-noise spectroscopy, inter-qubit cross-spectra, randomized benchmarking (RB), and microwave-power-dependent measurements. The industrial devices have larger micromagnet–quantum-well separation and weaker simulated transverse gradients: $0.4$–$0.5\,\mathrm{mT/nm}$ versus approximately $1.15\,\mathrm{mT/nm}$. Reaching a 1 MHz Rabi frequency requires 7.7 dB higher median nominal microwave power. Weaker longitudinal gradients reduce charge-to-frequency-noise conversion: median Hahn-echo coherence is approximately $200\,\mu\mathrm{s}$ versus $70\,\mu\mathrm{s}$, and CPMG coherence at 1024 pulses is $3.88\pm0.09$ ms versus $1.49\pm0.31$ ms. Sensor-referred charge noise is comparable, indicating reduced susceptibility rather than a quieter charge environment. Weaker low-frequency inter-qubit correlations and occupation-dependent dephasing are interpreted as evidence for predominantly uncorrelated residual nuclear-spin noise. RB-derived primitive $\pi/2$ fidelities reach approximately 99.99% in industrial devices and 99.999% in the reference. Industrial-device errors rise at lower Rabi frequencies; spin-lock and off-resonant CPMG measurements support microwave-induced noise as a limitation beyond measured detuning shifts. The comparison involves few devices with differing geometries, heterostructures, operating points, and cryogenic setups; microwave powers are not calibrated in situ. Nuclear-noise attribution remains interpretive, and irradiation-duration differences prevent separating frequency-dependent noise from time-dependent heating or fluctuator activation. The proposed scaling constraint concerns micromagnet placement, not industrial fabrication intrinsically.
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- 28 pages, 4 main figures and 5 extended data figures