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arXiv:2502.19927 · Applied Physics Letters

Low crosstalk modular flip-chip architecture for coupled superconducting qubits

Soeren Ihssen, Simon Geisert, Gabriel Jaumà, Patrick Winkel, Martin Spiecker, Nicolas Zapata, Nicolas Gosling, Patrick Paluch, M. Pino, Thomas J.G. Reisinger, Wolfgang Wernsdorfer, Juan José García‐Ripoll, Ioan M. Pop

Published Mar 1, 2025• 3 citations
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Abstract

We present a flip-chip architecture for an array of coupled superconducting qubits, in which circuit components reside inside individual microwave enclosures. In contrast to other flip-chip approaches, the qubit chips in our architecture are electrically floating, which guarantees a simple, fully modular assembly of capacitively coupled circuit components, such as qubit, control, and coupling structures as well as reduced crosstalk between the components. We validate the concept with a chain of three nearest neighbor coupled generalized flux qubits in which the center qubit acts as a frequency-tunable coupler. Using this coupler, we demonstrate a transverse coupling on/off ratio≈50, zz−crosstalk ≈0.7 kHz between resonant qubits and isolation between the qubit enclosures>60 dB.

DOI
10.1063/5.0245667

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We present a flip-chip architecture for an array of coupled superconducting qubits, in which circuit components reside inside individual microwave enclosures. In contrast to other flip-chip approaches, the qubit chips in our architecture are electrically floating, which guarantees a simple, fully modular assembly of capacitively coupled circuit components, such as qubit, control, and coupling structures as well as reduced crosstalk between the components. We validate the concept with a chain of three nearest neighbor coupled generalized flux qubits in which the center qubit acts as a frequency-tunable coupler. Using this coupler, we demonstrate a transverse coupling on/off ratio≈50, zz−crosstalk ≈0.7 kHz between resonant qubits and isolation between the qubit enclosures>60 dB.
We use a floating tunable coupler to mediate interactions between qubits on separate chips to build a modular architecture. We demonstrate three different designs of multichip tunable couplers using vacuum-gap capacitors or superconducting indium-bump bonds to connect the coupler to a microwave line on a common substrate and then connect to the qubit on the next chip. We show that the zero-coupling condition between qubits on separate chips can be achieved in each design and that the relaxation rates for the coupler and qubits are not noticeably affected by the extra circuit elements. Finally, we demonstrate two-qubit gate operations with fidelity at the same level as qubits with a tunable coupler on a single chip. Using one or more indium bonds does not degrade qubit coherence or impact the performance of two-qubit gates.
We present design results of scalable superconducting quantum circuits using the flip-chip assembly. In order to achieve the longest relaxation time (T1T_{1}T1​) of a qubit possible, gap between two chips in flip-chip assembly is determined to be 12 μm where low surface dielectric loss from two-level system (TLS) defects can be achieved while maintaining large readout coupling strength between two chips in the flip-chip assembly. Superconducting transmon qubit design is then optimized to have a target anharmonicity of 200 MHz and to have the longerT1T_{1}T1​in consideration of surface energy participation ratios of TLS defects within the compact footprint. To achieve strong coupling strength but low qubit to qubit crosstalk (ZZ) for fast and high fidelity multi-qubit gates, direct coupler and compact multi-path coupler designs for coupling qubits are compared by numerically solving Hamiltonian of the coupled two qubits. Monte-Carlo simulation results on the yield rate of the extended circuits indicate that low manufacturing errors are required.
We have proposed and experimentally verified a tunable interqubit coupling scheme for large-scale integration of superconducting qubits. The key feature of the scheme is the insertion of connecting pads between the qubit and tunable coupling element. In such a way, the distance between two qubits can be increased considerably to a few millimeters, leaving enough space for arranging control lines, readout resonators, and other necessary structures. The increased interqubit distance provides more wiring space for the flip-chip process and reduces crosstalk between qubits and from control lines to qubits. We use the term tunable coupler with capacitively connecting pad (TCCP) to name the tunable coupling part that consists of a transmon coupler and capacitively connecting pads. With the different placement of connecting pads, different TCCP architectures can be realized. We have designed and fabricated a few multiqubit devices in which TCCP is used for coupling. The measured results show that the performance of the qubits coupled by TCCP, such as T1{T}_{1}T1​ and T2{T}_{2}T2​, was similar to that of traditional transmon qubits without TCCP. Meanwhile, our TCCP also exhibited a wide tunable range of the effective coupling strength and a low residual ZZZZZZ interaction between the qubits by properly tuning parameters on the design. Finally, we successfully implemented an adiabatic controlled-ZZZ gate with TCCP. Furthermore, by introducing TCCP, we also discuss the realization of the flip-chip process and tunable coupling qubits between different chips.
In recent years, several architectures have been proposed for implementing two-qubit operations on fluxonium superconducting qubits. A particularly promising approach, which was demonstrated experimentally by Refs. [1,2], employs a transmon superconducting qubit as a tunable coupler between the fluxonium qubits. These experiments have shown that the transmon coupler enables fast, high-fidelity two-qubit operations while suppressing unwanted ZZ crosstalk between the fluxonium qubits. In this work, we numerically study the scalability of this architecture. We find that, when trivially scaling this architecture, crosstalk from spectator qubits limits the gate fidelity to below 90%. We show that these spectator errors can be reduced to below 10−410^{-4}10−4 by reducing the coupling strength and by dynamically tuning transmons that are not used for a two-qubit operation to an off position. We further investigate the resilience of the operation to direct capacitive coupling between the transmon couplers and to microwave crosstalk.
Quantum processors require a signal-delivery architecture with high addressability (low crosstalk) to ensure high performance already at the scale of dozens of qubits. Signal crosstalk causes inadvertent driving of quantum gates, which will adversely affect quantum gate fidelities in scaled-up devices. Here, we demonstrate packaged flip-chip superconducting quantum processors with signal-crosstalk performance competitive with those reported in other platforms. For capacitively coupled qubit-drive lines, we find on-resonant crosstalk better than − 27 dB (average − 37 dB). For inductively coupled magnetic-flux-drive lines, we find less than 0.13% direct-current flux crosstalk (average 0.05%). These observed crosstalk levels are adequately small and indicate a decreasing trend with increasing distance, which is promising for further scaling up to larger numbers of qubits. We discuss the implications of our results for the design of a low-crosstalk on-chip signal-delivery architecture, including the influence of a shielding tunnel structure, potential sources of crosstalk, and estimation of crosstalk-induced qubit-gate error in scaled-up quantum processors. Published by the American Physical Society 2024
The strong anharmonicity and high coherence times inherent to fluxonium superconducting circuits are beneficial for quantum information processing. In addition to requiring high-quality physical qubits, a quantum processor needs to be assembled in a manner that minimizes crosstalk and decoherence. In this paper, we report on fluxonium qubits packaged in a flip-chip architecture, where a classical control and readout chip is bump bonded to the quantum chip, forming a multichip module. The modular approach allows for improved connectivity between the qubits and control and readout elements, and separate fabrication processes. We characterize the coherence properties of the individual fluxonium qubits, demonstrate high-fidelity single-qubit gates with 6-ns microwave pulses (without DRAG), and identify the main decoherence mechanisms to improve on the reported results.