Integrated circuit technology enables the scaling of circuit complexity and functionality while maintaining manufacturability and reliability. Integration is expected to play an important role in quantum information technologies, including in the highly demanding task of producing the classical signals to control and measure quantum circuits at scales needed for fault-tolerant quantum computation. Here, we experimentally characterize the cryogenic performance of a miniaturized photonic integrated circuit fabricated by a commercial foundry that downconverts classical optical signals into microwave signals. The circuit consists of waveguide-integrated germanium PIN photodiodes packaged using a scalable photonic wire bonding approach to a multi-channel optical fiber array that provides the optical excitation. We find the peak optical-to-microwave conversion response to be ∼150 ± 13 mA/W in the O-band at 4.2 K, well below the temperature the circuit was designed for and tested at in the past, for two different diode designs. The second diode design operates to over 6 GHz of 3 dB bandwidth, making it suitable for controlling quantum circuits, with improvements in bandwidth and response expected from improved packaging. The demonstrated miniaturization and integration offers new perspectives for wavelength-division multiplexed control of microwave quantum circuits and scalable processors using light delivered by optical fiber arrays.
Integrated circuit technology enables the scaling of circuit complexity and functionality while maintaining manufacturability and reliability. Integration is expected to play an important role in quantum information technologies, including in the highly demanding task of producing the classical signals to control and measure quantum circuits at scales needed for fault-tolerant quantum computation. Here, we experimentally characterize the cryogenic performance of a miniaturized photonic integrated circuit fabricated by a commercial foundry that downconverts classical optical signals into microwave signals. The circuit consists of waveguide-integrated germanium PIN photodiodes packaged using a scalable photonic wire bonding approach to a multi-channel optical fiber array that provides the optical excitation. We find the peak optical-to-microwave conversion response to be ∼150 ± 13 mA/W in the O-band at 4.2 K, well below the temperature the circuit was designed for and tested at in the past, for two different diode designs. The second diode design operates to over 6 GHz of 3 dB bandwidth, making it suitable for controlling quantum circuits, with improvements in bandwidth and response expected from improved packaging. The demonstrated miniaturization and integration offers new perspectives for wavelength-division multiplexed control of microwave quantum circuits and scalable processors using light delivered by optical fiber arrays.
Quantum devices present the potential for unparalleled computing and communications capabilities; however, the cryogenic temperatures required to successfully control and read out many qubit platforms can prove to be very challenging to scale. Recently, there has emerged an interest in using microwave photonics to deliver control signals down to ultracold stages via optical fiber, thereby reducing thermal load and facilitating dense wavelength multiplexing. Photodetectors can then convert this optical energy to electrical signals for qubit control. The fidelity of the quantum operations of interest therefore depend heavily upon the characteristics of the photodiode, yet experimental demonstrations of fiber-coupled photodetection systems at low temperatures are relatively few in number, leaving important open questions regarding how specific detectors may perform in real-world cryogenic settings. In this work, we examine a highly linear modified uni-traveling carrier photodiode (MUTC-PD) under C-band illumination (1530–1565 nm) at three temperature regimes (300 K, 80 K, and ∼4 K) and multiple bias conditions. Our findings of reduced responsivity but preserved bandwidth are consistent with previous studies, while our saturation tests suggest a variety of potential applications for MUTC-PDs in cryogenic microwave photonics with and without electrical bias. Overall, our results should provide a valuable foundation for the continued and expanding use of this detector technology in quantum information processing.
Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling technology for these systems, integrating quantum memories with efficient electrical and optical interfaces in a compact and scalable platform. Packaging these hybrid chips into deployable modules while maintaining low optical loss and resiliency to temperature cycling is a central challenge to their practical use. We demonstrate a packaging method for PICs using surface grating couplers and angle-polished fiber arrays that is robust to temperature cycling, offers scalable channel count, applies to a wide variety of PIC platforms and wavelengths, and offers pathways to automated high-throughput packaging. Using this method, we show optically and electrically packaged quantum memory modules integrating all required qubit controls on chip, operating at millikelvin temperatures with <3 dB losses achievable from fiber to quantum memory for the TE 0 mode at a wavelength of 737 nm.
Superconducting circuits are important technological tools that have found various applications, notably hypothetical future superconducting quantum computers. Scaling such systems further is, however, proving challenging because of thermal heat load and space constraints in cryostats. One way of improving the scalability of such systems would be to resort to optical fibers for controlling the circuits in cryostats, as well as mediating long-distance interaction between them while preserving quantum coherence. Such a strategy relies on building a coherent interface between GHz frequencies and optical frequencies. This interface, referred to as "microwave-optical transducer", would need to exhibit high photon conversion efficiencies and very low added noise, ideally less than a quantum, in a cryogenic environment. Since the prospects of weaving networks of optically connected superconducting quantum processors have now attracted the attention of the scientific community for more than a decade, very efficient transducers have already been proposed and realized. However, despite their impressive performances against selected metrics, often equivalent to optimizing the on-chip conversion efficiency alone, none of the approaches pursued so far really solved the qubit interconnection problems in ways that could be applied to large-scale systems in the near future. The aim of this thesis was to develop transduction approaches that would ultimately enable optical driving of superconducting circuits and quantum state transfer between microwave and optical frequencies, while at the same time ensuring good scalability, both in terms of wafer manufacturability and integration in cryogenic environments. Integrated photonic circuits based on silicon nitride appeared as a promising platform, as silicon nitride is a CMOS-certified material, has a transparency window compatible with optical fibers and lacks two photon absorption. Realizing the coupling between microwave and optical frequencies in a way similar to what is done in optomechanics is desirable, because the field of optomechanics has seen the establishement of techniques that enable control of the low frequency degree of freedom at the quantum mechanical level, including ground state cooling, control of the susceptibility by dynamical backaction, quantum state transfer and entanglement. The heterogeneous integration of nonlinear crystalline thin films, such as lithium niobate and lithium tantalate, onto silicon nitride photonic circuitry endows it with an electro-optic activity that emulates the optomechanical interaction, while offering an inherent access to the microwave degree of freedom. However, material nonlinearities, including photorefraction, charge screening, and hysteresis, introduce complications that motivate exploring alternative approaches. Here, alongside an electro-optic implementation, a transducer that leverages the interaction of bulk acoustic resonances excited by micro-electromechanical systems with whispering-gallery-like modes of microresonators is presented. Coherent transduction between microwave and optical fields is demonstrated, and optomechanical dynamical backaction is observed. The transducers fast bandwidth, compatibility with multiplexing and ability to down-convert microwaves suggest interesting prospects, particularly upon further improvements of the optomechanical coupling.
Optically linked solid-state quantum memories such as color centers in diamond are a promising platform for distributed quantum information processing and networking. Photonic integrated circuits (PICs) have emerged as a crucial enabling technology for these systems, integrating quantum memories with efficient electrical and optical interfaces in a compact and scalable platform. Packaging these hybrid chips into deployable modules while maintaining low optical loss and resiliency to temperature cycling is a central challenge to their practical use. We demonstrate a packaging method for PICs using surface grating couplers and angle-polished fiber arrays that is robust to temperature cycling, offers scalable channel count, applies to a wide variety of PIC platforms and wavelengths, and offers pathways to automated high-throughput packaging. Using this method, we show optically and electrically packaged quantum memory modules integrating all required qubit controls on chip, operating at millikelvin temperatures with < 3dB losses achievable from fiber to quantum memory.
Quantum devices have the potential to revolutionize applications in computing, communications, and sensing; however, current state-of-art resources must operate at extremely low temperatures, making the routing of microwave control and readout signals challenging to scale. Interest in microwave photonic solutions to this problem has grown in recent years, in which control signals are delivered to the cold stage via optical fiber, where they are converted to electrical signals through photodetection. Overall link performance depends strongly on the characteristics of the photodiode, yet detailed measurements of many detector properties remain lacking at cold temperatures. In this work, we examine and compare the performance of a modified uni-traveling carrier photodiode (MUTC-PD) at both room (300 K) and liquid nitrogen (80 K) temperatures, focusing in particular on responsivity, bandwidth, and linearity. In line with previous work, we find a sharp reduction in responsivity at 1550 nm as temperature decreases, while RF bandwidth remains steady. Interestingly, our linearity tests reveal that the RF output saturates more quickly at 80 K, suggesting reduced linearity with lower temperature, the cause of which is still under investigation. Our results should help contribute to the understanding and future design of highly linear cryogenic quantum links.
Solid-state quantum computers require classical electronics to control and readout individual qubits and to enable fast classical data processing [1-3]. Integrating both subsystems at deep cryogenic temperatures [4], where solid-state quantum processors operate best, may solve some major scaling challenges, such as system size and input/output (I/O) data management [5]. Spin qubits in silicon quantum dots (QDs) could be monolithically integrated with complementary metal-oxide-semiconductor (CMOS) electronics using very-large-scale integration (VLSI) and thus leveraging over wide manufacturing experience in the semiconductor industry [6]. However, experimental demonstrations of integration using industrial CMOS at mK temperatures are still in their infancy. Here we present a cryogenic integrated circuit (IC) fabricated using industrial CMOS technology that hosts three key ingredients of a silicon-based quantum processor: QD arrays (arranged here in a non-interacting 3x3 configuration), digital electronics to minimize control lines using row-column addressing and analog LC resonators for multiplexed readout, all operating at 50 mK. With the microwave resonators (6-8 GHz range), we show dispersive readout of the charge state of the QDs and perform combined time- and frequency-domain multiplexing, enabling scalable readout while reducing the overall chip footprint. This modular architecture probes the limits towards the realization of a large-scale silicon quantum computer integrating quantum and classical electronics using industrial CMOS technology.