Visualizing heterogeneous dipole fields by terahertz light coupling in individual nano-junctions
Richard H. J. Kim, Joong M. Park, Samuel Haeuser, Chuankun Huang, Di Cheng, Thomas Koschny, Jin‐Su Oh, Cameron Kopas, Hilal Cansizoglu, Kameshwar K. Yadavalli, J. Mutus, Lin Zhou, Liang Luo, Matthew J. Kramer, Jigang Wang
Abstract The fundamental challenge underlying superconducting quantum computing is to characterize heterogeneity and disorder that lead to local electric field concentration, charge scattering, dissipation and ultimately decoherence. It is particularly challenging to probe deep sub-wavelength electric field distribution under electromagnetic wave coupling at individual nano-junctions and correlate them with structural imperfections from interface and boundary, ubiquitous in Josephson junctions used in transmon qubits. A major obstacle lies in the fact that conventional microscopy tools are incapable of measuring {\em simultaneous} at nanometer and terahertz, ``nano-THz” scales, which often associate with frequency-dependent charge scattering in nano-junctions. Here we directly visualize interface nano-dipole near-field distribution of individual Al/AlO$_{x}$/Al junctions used in transmon qubits. Our THz nanoscope images show a remarkable asymmetry across the junction in electromagnetic wave-junction coupling response that manifests as ``hot" vs ``cold" cusp spatial electrical field structures and correlates with defected boundaries from the multi-angle deposition processes in JJ fabrication inside qubit devices. The asymmetric nano-dipole electric field contrast also correlates with distinguishing, ``overshoot" frequency dependence that characterizes the charge scattering and dissipation at nanoscale, hidden in responses from topographic, structural imaging and spatially-averaged techniques. The scheme can be extended to guide qubit nano-fabrication for ultimately optimizing qubit coherence times.
Abstract The fundamental challenge underlying superconducting quantum computing is to characterize heterogeneity and disorder that lead to local electric field concentration, charge scattering, dissipation and ultimately decoherence. It is particularly challenging to probe deep sub-wavelength electric field distribution under electromagnetic wave coupling at individual nano-junctions and correlate them with structural imperfections from interface and boundary, ubiquitous in Josephson junctions used in transmon qubits. A major obstacle lies in the fact that conventional microscopy tools are incapable of measuring {\em simultaneous} at nanometer and terahertz, nano-THz” scales, which often associate with frequency-dependent charge scattering in nano-junctions. Here we directly visualize interface nano-dipole near-field distribution of individual Al/AlO$_{x}$/Al junctions used in transmon qubits. Our THz nanoscope images show a remarkable asymmetry across the junction in electromagnetic wave-junction coupling response that manifests as hot" vs cold" cusp spatial electrical field structures and correlates with defected boundaries from the multi-angle deposition processes in JJ fabrication inside qubit devices. The asymmetric nano-dipole electric field contrast also correlates with distinguishing, overshoot" frequency dependence that characterizes the charge scattering and dissipation at nanoscale, hidden in responses from topographic, structural imaging and spatially-averaged techniques. The scheme can be extended to guide qubit nano-fabrication for ultimately optimizing qubit coherence times.
Correlating superconducting qubit performance with advanced materials analysis is a key strategy for improving coherence. Existing diagnostics for key properties, such as dielectric loss, structural discontinuity, and interface heterogeneity, often rely on destructive electron microscopy or low-throughput millikelvin measurements. Here, we demonstrate noninvasive terahertz (THz) nano-imaging/spectroscopy of encapsulated niobium transmon qubits as a high-throughput proxy for performance evaluation. We identify large variations in sidewall near-field signals, implicating sidewall loss and discontinuity as major coherence limiters, and also use THz hyperspectral line scans to probe dielectric responses and field participation at Al junction interfaces.
Abstract Superconducting integrated circuits have demonstrated a tremendous potential to realize integrated quantum computing processors. However, the downside of the solid-state approach is that superconducting qubits suffer strongly from energy dissipation and environmental fluctuations caused by atomic-scale defects in device materials. Further progress towards upscaled quantum processors will require improvements in device fabrication techniques, which need to be guided by novel analysis methods to understand and prevent mechanisms of defect formation. Here, we present a technique to analyse individual defects in superconducting qubits by tuning them with applied electric fields. This provides a spectroscopy method to extract the defects’ energy distribution, electric dipole moments, and coherence times. Moreover, it enables one to distinguish defects residing in Josephson junction tunnel barriers from those at circuit interfaces. We find that defects at circuit interfaces are responsible for about 60% of the dielectric loss in the investigated transmon qubit sample. About 40% of all detected defects are contained in the tunnel barriers of the large-area parasitic Josephson junctions that occur collaterally in shadow evaporation, and only ≈ ≈ 3% are identified as strongly coupled defects, which presumably reside in the small-area qubit tunnel junctions. The demonstrated technique provides a valuable tool to assess the decoherence sources related to circuit interfaces and to tunnel junctions that is readily applicable to standard qubit samples.
In superconducting transmon qubits, macroscopic characterization is the primary method for probing performance metrics, such as relaxation T1 and dephasing T2 times, resonance frequency, and quality factor. While these measurements can aid our understanding of the dielectric loss of a transmon, they do not allow us to characterize the structural and chemical inhomogeneity of the interfaces which directly impacts this energy loss. These fundamental materials problems must be studied using transmission electron microscopy (TEM) to provide insight into these defects across different qubit interfaces at an atomic scale. In this contribution, we will examine qubits, such as those shown in Figure 1, fabricated at Fermi National Accelerator Laboratory (SQMS Center) [1]. The qubit devices consist of superconducting metal base layers, typically sputter deposited Nb or Ta, and Al/AlOx/Al junctions, where the AlOx barrier is roughly 3nm in thickness and prepared through in-situ oxidation [2]. Characterizing this system prior to its integration within a superconducting radio frequency cavity establishes a baseline for the system, allowing us to isolate fabrication-induced defects before they manifest in performance degradation during quantum measurements. With the samples and fabrication process well known on a macroscopic scale, we study the atomic structure and chemistry of different heterointerfaces within the Josephson junction (JJ) of the transmon qubit and between the sapphire substrate and Nb resonator pads to identify potential defects contributing to the decoherence for qubits constructed with particular geometries. To resolve these defects, atomic-resolution imaging, energy-dispersive X-ray spectroscopy (EDS), and electron-energy loss spectroscopy (EELS) are performed using the JEOL-ARM200CF, an aberration-corrected scanning transmission electron microscope (STEM). Figure 2 provides a clear image of the stacked layers formed as the JJ, but with the addition of a platinum and carbon protective coating added during the focus ion beam (FIB) milling process to preserve pristine Al/AlOx/Al interfaces. 4D-STEM approaches, such as ptychography, orientation mapping and nanoscale diffraction will be employed to further study the layered interfaces and defects in real space and reciprocal space. These techniques can also provide insight into any damage that incurs during lamella preparation using the FIB [3]. Magnetic field-free atomic resolution imaging, differential phase contrast mapping, and monochromated EELS can be achieved using the new MARS-MONO STEM (JEM-Z200MF) without inducing current fluctuations or magnetic field related distortions [4]. By integrating this work across the functional interfaces of the transmon qubits and their different geometries, we will identify possible structural and chemical defects which limit device performance using our multi-modal approach [5]. SQMS fabricated transmon qubits fabricated on HEMEX sapphire substrate imaged via a) ZEISS optical microscope, b) SEM and c) EDS. TEM image of Josephson Junction layered interface at on JEOL-ARM200CF on the ClearView camera with a 200kV accelerating voltage.
Abstract Tunneling defects in disordered materials form spurious two-level systems which are a major source of decoherence for micro-fabricated quantum devices. For superconducting qubits, defects in tunnel barriers of submicrometer-sized Josephson junctions couple strongest to the qubit, which necessitates optimization of the junction fabrication to mitigate defect formation. Here, we investigate whether defects appear predominantly at the edges or deep within the amorphous tunnel barrier of a junction. For this, we compare defect densities in differently shaped Al/AlO x /Al Josephson junctions that are part of a Transmon qubit. We observe that the number of detectable junction-defects is proportional to the junction area, and does not significantly scale with the junction’s circumference, which proposes that defects are evenly distributed inside the tunnel barrier. Moreover, we find very similar defect densities in thermally grown tunnel barriers that were formed either directly after the base electrode was deposited, or in a separate deposition step after removal of native oxide by Argon ion milling.
The development of quantum computers, capable of surpassing classical computing in solving specific complex problems, hinges on breakthroughs in materials science, precision device fabrication, and the optimization of quantum architectures [1]. Among the leading candidates for quantum computation, superconducting qubits, particularly those based on transmon designs, have shown promising advances with coherence times reaching hundreds of microseconds [2]. However, to fully unlock the potential of scalable quantum computing, further enhancements in coherence are necessary. The intricate structure-coherence relationship within these devices, especially at critical interfaces such as metal-air, metal-dielectric, and metal-substrate in Josephson junctions (JJs), poses a significant challenge due to the potential for two-level-system loss channels. Here, we detail our pioneering efforts to understand these structure-coherence relationships utilizing advanced electron microscopy techniques. Focusing on the Al-AlOx and Al-Si substrate interfaces in Josephson Junctions, we employ a combination of low-loss and core-loss electron energy loss spectroscopy (EELS) and four-dimensional scanning transmission electron microscopy (4D-STEM) conducted at room and ultra-low temperatures (sub-6 K). This approach allows for an unprecedented examination of the chemical composition, bonding environments, and nanoscale structures of key surfaces and interfaces critical to the quantum coherence. Figure 1 presents a typical superconducting architecture at the chip level; each superconducting qubit consists of a Josephson Junction in parallel with an ultra-low-loss capacitor to create a resonant structure in the 3-6GHz range. JJs are highlighted in the area boxed in Fig. 1A and can be observed in detail in Fig. 1B. Lamella cross-sections (as shown in Fig. 1C) were prepared using a dual-beam focused ion beam (FIB) FEI-SEM Helios Nanolab. The lift-off was performed using 30 kV Ga+ ions, and the final cleaning step was carried out at 2 kV to remove surface damage on the area of interest, resulting in a final sample thickness of 50-100 nm. Transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM) data were collected on a probe-corrected JEOL ARM200 S/TEM operating at 200 kV. The convergent angle for ADF-STEM imaging was 25 mrad. Electron energy loss spectra (EELS) were acquired at 200 kV using a Gatan GIF Quantum on a K2 pixelated detector. Data processing (background subtraction, plural scattering removal, and signal mapping) was conducted using Gatan GMS software. Four-dimensional STEM (4D-STEM) data were collected by a K3 and STELA cameras. The convergent angles were 0.5-1.5 mrad, and the camera length was 6-10 cm. The step size was 5-10 Å. Merging microscopic insights with electrical data and theoretical frameworks, we aim to reveal how atomic-scale irregularities affect coherence times. Our results highlight key decoherence mechanisms in superconducting qubits and suggest specific improvements for qubit design and manufacturing. By linking electron microscopy findings to device performance, we outline strategies to reduce decoherence, essential for achieving reliable quantum computing. This work bridges materials science and quantum engineering, driving efforts in making scalable quantum computers forward [3]. A) Microscopic view of a superconducting transmon qubit, highlighting its symmetric design with central island and capacitor pads. B) SEM image of a JJ displaying their Al top and bottom contacts. C) STEM image of a JJ showing its key components and interfaces: Al top and bottom contact, AlOx tunnel barrier, Si substrate and Al-Si interface. A) EELS chemical maps of two interfaces, Al/Al and Al/Si using K-edges of oxygen, aluminum and silicon of a Josephson junction. It is possible to detect a formation of oxides at both interfaces. Plots showing Al and Si K-edge at 1560 eV and 1839 eV, respectively, and the ELNES are shown on the right side (Scale bar in A – 20 nm). B) Analysis of the disordered Al phases at the interfaces utilizing ePDF.
The investigation of novel electronic phases in low-dimensional quantum materials demands for the concurrent development of measurement techniques that combine surface sensitivity with high spatial resolution and high measurement accuracy. We propose a new quantum sensing imaging modality based on superconducting charge qubits to study dissipative charge carrier dynamics with nanometer spatial and high temporal resolution. Using analytical and numerical calculations we show that superconducting charge qubit microscopy (SCQM) has the potential to resolve temperature and resistivity changes in a sample as small as ΔT≤0.1mK and Δρ≤1⋅104Ω⋅cm, respectively. Among other applications, SCQM will be especially suited to study the microscopic mechanisms underlying resistive phase transition, such as the superconductor-insulator-transition in twisted bilayer graphene, to investigate novel topological boundary modes found in higher order topological insulators and to optimize the transport properties of nano- and mesoscopic devices.