A core challenge for superconducting quantum computers is to scale up the number of qubits in each processor without increasing noise or cross-talk. Distributed quantum computing across small qubit arrays, known as chiplets, can address these challenges in a scalable manner. We propose a chiplet architecture over microwave links with potential to exceed monolithic performance on near-term hardware. Our methods of modeling and evaluating the chiplet architecture bridge the physical and network layers in these processors. We find evidence that distributing computation across chiplets may reduce the overall error rates associated with moving data across the device, despite higher error figures for transfers across links. Preliminary analyses suggest that latency is not substantially impacted, and that at least some applications and architectures may avoid bottlenecks around chiplet boundaries. In the long-term, short-range networks may underlie quantum computers just as local area networks underlie classical datacenters and supercomputers today.
A core challenge for superconducting quantum computers is to scale up the number of qubits in each processor without increasing noise or cross-talk. Distributed quantum computing across small qubit arrays, known as chiplets, can address these challenges in a scalable manner. We propose a chiplet architecture over microwave links with potential to exceed monolithic performance on near-term hardware. Our methods of modeling and evaluating the chiplet architecture bridge the physical and network layers in these processors. We find evidence that distributing computation across chiplets may reduce the overall error rates associated with moving data across the device, despite higher error figures for transfers across links. Preliminary analyses suggest that latency is not substantially impacted, and that at least some applications and architectures may avoid bottlenecks around chiplet boundaries. In the long-term, short-range networks may underlie quantum computers just as local area networks underlie classical datacenters and supercomputers today.
Abstract: This study investigates photonic-interconnected quantum chiplets as a modular hardware pathway for scalable and networked quantum computing. The central problem is that monolithic quantum processors face compounding constraints in yield, wiring density, cryogenic routing, interconnect loss, calibration complexity and non-local connectivity. Photonic interconnection offers a technically plausible route to divide a large quantum computer into smaller processors while preserving quantum communication across modules through fibre links, photonic switches, optical transduction or integrated photonic interposers. The paper develops an academically rigorous framework that connects quantum-chiplet architecture, photonic integration, quantum error correction, control latency and manufacturability. It uses secondary real-data anchors from recent public demonstrations and a transparent engineering analysis to evaluate whether modular photonic networking can satisfy requirements for distributed logical qubits, entanglement generation and fault-tolerant operation. Results indicate that photonic chiplets can reduce scaling penalties relative to a monolithic wiring strategy when interconnect loss, feed-forward latency and module yield are jointly optimized. The study concludes that photonic-interconnected chiplets are not a minor packaging improvement but a possible architectural transition comparable to the movement from single-die classical processors to heterogeneous chiplet systems. The strongest contribution is a system-level evaluation model that links physical photonic performance with computer-architecture metrics and identifies the practical thresholds that must be met for Nature-level experimental validation. Keywords quantum computing chips, photonic chiplets, modular quantum computing, quantum interconnects, distributed quantum processors, silicon photonics, quantum networking, fault-tolerant quantum computing, optical interposers, quantum error correction, entanglement routing, wafer-scale quantum manufacturing, cryogenic control, quantum architecture, quantum hardware scalability
Fixed-frequency transmon quantum computers (QCs) have advanced in coherence times, addressability, and gate fidelities. Unfortunately, these devices are restricted by the number of on-chip qubits, capping processing power and slowing progress toward fault-tolerance. Although emerging transmon devices feature over 100 qubits, building QCs large enough for meaningful demonstrations of quantum advantage requires overcoming many design challenges. For example, today’s transmon qubits suffer from significant variation due to limited precision in fabrication. As a result, barring significant improvements in current fabrication techniques, scaling QCs by building ever larger individual chips with more qubits is hampered by device variation. Severe device variation that degrades QC performance is referred to as a defect. Here, we focus on a specific defect known as a frequency collision. When transmon frequencies collide, their difference falls within a range that limits two-qubit gate fidelity. Frequency collisions occur with greater probability on larger QCs, causing collision-free yields to decline as the number of on-chip qubits increases. As a solution, we propose exploiting the higher yields associated with smaller QCs by integrating quantum chiplets within quantum multi-chip modules (MCMs). Yield, gate performance, and application-based analysis show the feasibility of QC scaling through modularity. Our results demonstrate that chiplet architectures, relative to monolithic designs, benefit from average yield improvements ranging from 9.6 – 92.6 × for ≲5 qubit machines. In addition, our simulations explore the design space of chiplet systems and discover configurations that demonstrate average two-qubit gate infidelity reductions that are at best 0.815 × their monolithic counterpart. Finally, we observe that carefully-selected modular systems achieve fidelity improvements on a range of benchmark circuits.
Practical fault-tolerant quantum computation requires a large number of physical qubits, posing a major challenge for scaling up individual quantum processors. Distributed architectures offer a promising solution by interconnecting multiple processors through quantum networks. However, remote Bell-pair generation remains technically demanding, making it essential to assess computational performance under limited communication resources. In this work, we present a comprehensive resource analysis of distributed fault-tolerant quantum computation using superconducting processors connected by microwave or optical links. We show that even a single physical communication channel per node can substantially reduce the physical-qubit requirements per node under experimentally motivated, forward-looking microwave-link assumptions of a 1 MHz physical Bell-pair generation rate and 90% fidelity, although at the cost of a roughly tenfold increase in execution time. Conversely, reducing the execution-time overhead requires substantially greater communication resources, including higher Bell-pair fidelities and extensive multiplexing. These results demonstrate the potential feasibility of distributed fault-tolerant quantum computation with limited communication resources and provide a quantitative basis for balancing quantum-link performance, processor size, and execution time.
This work presents a conceptual architecture and technological roadmap for a scalable superconducting quantum computing platform based on modular design principles. Rather than introducing a new qubit technology, the proposal focuses on addressing critical engineering bottlenecks that currently limit the large-scale deployment of quantum processors, including wiring complexity, electromagnetic crosstalk, fabrication yield, and latency in error-correction feedback loops.The proposed framework introduces a modular hybrid architecture (“Quantum Mesh”), where medium-scale quantum chiplets containing 25–50 superconducting transmon qubits are interconnected through advanced 3D packaging and cryogenic infrastructure. This approach aims to improve manufacturing yield, reduce wiring density, and enable rack-level integration of quantum processing units while maintaining high gate fidelities and manageable thermal loads.A second central element of the proposal is the integration of a high-fidelity digital twin environment capable of simulating qubit dynamics, noise sources, control latency, and thermal constraints at nanosecond resolution. This predictive framework is intended to support hardware iteration cycles prior to fabrication, potentially accelerating design optimization and system validation.The document outlines a three-year development pathway targeting 100–200 physical qubits and several logical qubits using surface code error correction, followed by a longer-term scaling strategy toward quantum fabrics exceeding one thousand qubits. By combining modular quantum chiplets, partial cryogenic electronics, and predictive digital twin modeling, the proposed architecture explores a plausible industrial pathway toward large-scale quantum computing systems.
Quantum computing offers the potential to solve certain complex problems, yet, scaling monolithic processors remains a major challenge. Modular and distributed architectures are proposed to build large-scale quantum systems while bringing the security advantages of quantum communication. At present, this requires accurate and computationally efficient models of quantum links across different scales to advance system design and guide experimental prototyping. In this work, we review protocols and models for estimating latency, losses, and fidelity in quantum communication primitives relying on quantum state distribution via microwave photons. We also propose a scalable simulation framework to support the design and evaluation of future distributed quantum computing systems.
The path toward practical superconducting quantum processors requires the integration of a large number of high-performance qubits. Modular architectures could offer a way to address the scaling limitations of monolithic designs by partitioning a large quantum processor into physically separated modules, or chiplets, linked through long-range interconnects. In this context, although fluxonium qubits have emerged as a compelling platform for quantum computing due to their long coherence times and high-fidelity gates, existing coupling schemes remain restricted to qubits in close proximity on a single chip. This limitation inherently precludes the long-range interconnects essential for modular integration. In this work, we propose a long-range tunable coupler designed to interconnect fluxonium qubits separated by more than one centimeter, thereby supporting the realization of modular fluxonium quantum processors. Under realistic assumptions, the proposed coupler has the potential to achieve inter-module two-qubit gate performance, specifically sub-100-ns gates with intrinsic errors below 10−4, comparable to that of intra-module (intra-chiplet) gates, while enabling modular integration with low quantum crosstalk, a key requirement for scalable systems. We further discuss the integration of this coupler into modular fluxonium lattices and explore its feasibility for achieving the higher connectivity and longer coupling range required for complex quantum error correction codes. This work could contribute to the development of large-scale fluxonium quantum processors by bridging their demonstrated potential with modular scalability.