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arXiv:1303.4071 · Applied Physics Letters

Improved superconducting qubit coherence using titanium nitride

Josephine B. Chang, Michael R. Vissers, Antonio D. Córcoles, Martin Sandberg, Jiansong Gao, David W. Abraham, Jerry M. Chow, Jay M. Gambetta, Mary Beth Rothwell, George A. Keefe, Matthias Steffen, David P. Pappas

Published Jul 1, 2013• 262 citations
arXivHTMLPDF

Abstract

We demonstrate enhanced relaxation and dephasing times of transmon qubits, up to ∼60 μs, by fabricating the interdigitated shunting capacitors using titanium nitride (TiN). Compared to qubits made with lift-off aluminum deposited simultaneously with the Josephson junction, this represents as much as a six-fold improvement and provides evidence that surface losses from two-level system (TLS) defects residing at or near interfaces contribute to decoherence. Concurrently, we observe an anomalous temperature dependent frequency shift of TiN resonators, which is inconsistent with the predicted TLS model.

DOI
10.1063/1.4813269

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•Jan 1, 2026•0 citations
We demonstrate enhanced relaxation and dephasing times of transmon qubits, up to ∼60 μs, by fabricating the interdigitated shunting capacitors using titanium nitride (TiN). Compared to qubits made with lift-off aluminum deposited simultaneously with the Josephson junction, this represents as much as a six-fold improvement and provides evidence that surface losses from two-level system (TLS) defects residing at or near interfaces contribute to decoherence. Concurrently, we observe an anomalous temperature dependent frequency shift of TiN resonators, which is inconsistent with the predicted TLS model.
Abstract Improving the coherence of superconducting qubits is a fundamental step towards the realization of fault-tolerant quantum computation. However, coherence times of quantum circuits made from conventional aluminum-based Josephson junctions are limited by the presence of microscopic two-level systems in the amorphous aluminum oxide tunnel barriers. Here, we have developed superconducting qubits based on NbN/AlN/NbN epitaxial Josephson junctions on silicon substrates which promise to overcome the drawbacks of qubits based on Al/AlOx/Al junctions. The all-nitride qubits have great advantages such as chemical stability against oxidation, resulting in fewer two-level fluctuators, feasibility for epitaxial tunnel barriers that reduce energy relaxation and dephasing, and a larger superconducting gap of ~5.2 meV for NbN, compared to ~0.3 meV for aluminum, which suppresses the excitation of quasiparticles. By replacing conventional MgO by a silicon substrate with a TiN buffer layer for epitaxial growth of nitride junctions, we demonstrate a qubit energy relaxation time $${T}_{1}=16.3\;{{\upmu }}{{{{{\rm{s}}}}}}$$ T 1 = 16.3 μ s and a spin-echo dephasing time $${T}_{2}=21.5\;{{\upmu }}{{{{{\rm{s}}}}}}$$ T 2 = 21.5 μ s . These significant improvements in quantum coherence are explained by the reduced dielectric loss compared to the previously reported $${T}_{1}\approx {T}_{2}\approx 0.5\;{{\upmu }}{{{{{\rm{s}}}}}}$$ T 1 ≈ T 2 ≈ 0.5 μ s of NbN-based qubits on MgO substrates. These results are an important step towards constructing a new platform for superconducting quantum hardware.
Abstract We present a transmon qubit fabrication technique that yields systematic improvements in T 1 relaxation times. We encapsulate the surface of niobium and prevent the formation of its lossy surface oxide. By maintaining the same superconducting metal and only varying the surface, this comparative investigation examining different capping materials, such as tantalum, aluminum, titanium nitride, and gold, as well as substrates across different qubit foundries demonstrates the detrimental impact that niobium oxides have on coherence times of superconducting qubits, compared to native oxides of tantalum, aluminum or titanium nitride. Our surface-encapsulated niobium qubit devices exhibit T 1 relaxation times 2–5 times longer than baseline qubit devices with native niobium oxides. When capping niobium with tantalum, we obtain median qubit lifetimes above 300 μs, with maximum values up to 600 μs. Our comparative structural and chemical analysis provides insight into why amorphous niobium oxides may induce higher losses compared to other amorphous oxides.
Dielectric loss is one of the major decoherence sources of superconducting qubits. Contemporary high-coherence superconducting qubits are formed by material systems mostly consisting of superconducting films on substrate with low dielectric loss, where the loss mainly originates from the surfaces and interfaces. Among the multiple candidates for material systems, a combination of titanium nitride (TiN\mathrm{Ti}\mathrm{N}TiN) film and sapphire substrate has good potential because of its chemical stability against oxidization and its high quality at interfaces. In this work, we report a TiN\mathrm{Ti}\mathrm{N}TiN film deposited onto sapphire substrate achieving low dielectric loss at the material interface. Through the systematic characterizations of a series of transmon qubits fabricated with identical batches of TiN\mathrm{Ti}\mathrm{N}TiN base layers but different geometries of qubit shunting capacitors with various participation ratios of the material interface, we quantitatively extract the loss-tangent value at the substrate-metal interface, which is smaller than $8.9\ifmmode\times\else\texttimes\fi{}{10}^{\ensuremath{-}4}$ in a 1-nm disordered layer, and a limiting quality factor of about 7.3 million. By optimizing the interface participation ratio of the two-dimensional (2D) transmon qubit, we reproducibly achieve a quality factor of 5.7 million on average. The best 2D qubits show lifetimes of up to $300\phantom{\rule{0.2em}{0ex}}\ensuremath{\mu}\mathrm{s}$ and quality factors achieving 8.1 million. We demonstrate that TiN\mathrm{Ti}\mathrm{N}TiN film on sapphire substrate is an ideal material system for high-coherence superconducting qubits. Our analyses further suggest that the interface dielectric loss around the Josephson-junction part of the circuit could be the dominant limitation of lifetimes for state-of-the-art transmon qubits.
This paper presents the fabrication and characterization of superconducting qubit components from titanium nitride (TiN) and aluminum nitride (AlN) layers to create Josephson junctions and superconducting resonators in an all-nitride architecture. Our methodology comprises a complete process flow for the fabrication of TiN/AlN/TiN junctions, characterized by scanning electron microscopy (SEM), atomic force microscopy (AFM), ellipsometry and DC electrical measurements. We evaluated the sputtering rates of AlN under varied conditions, the critical temperatures of TiN thin films for different sputtering environments, and the internal quality factors of TiN resonators in the few-GHz regime, fabricated from these films. Overall, this offered insights into the material properties critical to qubit performance. Measurements of the dependence of the critical current of the TiNIIIAlNIIITiN junctions yielded values ranging from 150μA\mu \mathbf{A}μAto 2μA\mu \mathbf{A}μA, for AlN barrier thicknesses up to ca. 5 nm, respectively. Our findings demonstrate advances in the fabrication of nitride-based superconducting qubit components, which may find applications in quantum computing technologies based on novel materials.
We assess independently the impact of high-temperature substrate annealing and metal deposition conditions on the coherence of transmon qubits in the standard 2D circuit-QED architecture. We restrict our study to devices made with aluminum interdigital capacitors on sapphire substrates. We record more than an order-of-magnitude improvement in the relaxation time of devices made with an annealed substrate, independent of whether a conventional evaporator or molecular beam epitaxy chamber was used to deposit the aluminum. We also infer similar levels of flux noise and photon shot noise through dephasing measurements on these devices. Our results indicate that substrate annealing plays a primary role in fabricating low-loss qubits, consistent with the hypothesis that substrate-air and substrate-metal interfaces are essential factors limiting the qubit lifetimes in superconducting circuits.
The coherence of superconducting quantum computers is severely limited by material defects that create parasitic two-level-systems (TLS). Progress is complicated by lacking understanding how TLS are created and in which parts of a qubit circuit they are most detrimental. Here, we present a method to determine the individual positions of TLS at the surface of a transmon qubit. We employ a set of onchip gate electrodes near the qubit to generate local DC electric fields that are used to tune the TLS’ resonance frequencies. The TLS position is inferred from the strengths at which TLS couple to different electrodes and comparing them to electric field simulations. We found that the majority of detectable surface-TLS was residing on the leads of the qubit’s Josephson junction, despite the dominant contribution of its coplanar capacitor to electric field energy and surface area. This indicates that the TLS density is significantly enhanced near shadow-evaporated electrodes fabricated by lift-off techniques. Our method is useful to identify critical circuit regions where TLS contribute most to decoherence, and can guide improvements in qubit design and fabrication methods.