Challenges
Datasets
Workspaces
Papers
Discussions
Leaderboard
Log inSign up
Challenges
Datasets
Workspaces
Papers
Discussions
Leaderboard
Blog
Job Board
Q3AS

© 2026 Aqora Quantum S.A.S.

TermsPrivacyLegal Notice

arXiv:1111.3541 · Applied Physics Letters

Etching suspended superconducting tunnel junctions from a multilayer

Hung Q. Nguyen, Laëtitia Pascal, Zhihui Peng, O. Buisson, B. Gilles, Clemens B. Winkelmann, H. Courtois

Published Jun 18, 2012• 16 citations
arXivHTMLPDF

Abstract

A method to fabricate large-area superconducting hybrid tunnel junctions with a suspended central normal metal part is presented. The samples are fabricated by combining photo-lithography and chemical etch of a superconductor—insulator—normal metal multilayer. The process involves few fabrication steps, is reliable and produces extremely high-quality tunnel junctions. Under an appropriate voltage bias, a significant electronic cooling is demonstrated. We analyze semi-quantitatively the thermal behavior of a typical device.

DOI
10.1063/1.4729779

Related papers

Superconducting tunnel junction fabrication on three-dimensional topography based on direct laser writing

Samuli Heiskanen, Ilari J. Maasilta

Superconducting junctions are widely used in a multitude of applications ranging from quantum information science and sensing to solid-state cooling. Traditionally, such devices must be fabricated on flat substrates using standard lithographic techniques. In this study, we demonstrate a highly versatile method that allows for superconducting junctions to be fabricated on a more complex topography. It is based on maskless direct laser writing and two-photon lithography, which allows writing in 3D space. We show that high-quality normal metal–insulator–superconductor tunnel junctions can be fabricated on top of a 20-μm-tall three-dimensional topography. Combined with conformal resist coating methods, this technique could allow sub-micron device fabrication on almost any type of topography in the future.

arXiv:2009.09749•Applied Physics Letters•Dec 7, 2020•3 citations

Single-charge devices with ultrasmall Nb∕AlOx∕Nb trilayer Josephson junctions

R. Dolata, Hansjorg Scherer, Alexander B Zorin +1 more

Josephson junction transistors and 50-junction arrays with linear junction dimensions from 200nm down to 70nm were fabricated from standard Nb∕AlOx∕Nb trilayers. The fabrication process includes electron beam lithography, dry etching, anodization, and planarization by chemical-mechanical polishing. The samples were characterized at temperatures down to 25mK. In general, all junctions are of high quality and their I-U characteristics show low leakage currents and high superconducting energy gap values of Δ≈1.35meV. The characteristics of the transistors and arrays exhibit some features in the subgap area, associated with tunneling of Cooper pairs, quasiparticles, and their combinations due to the redistribution of the bias voltage between the junctions. Total island capacitances of the transistor samples ranged from 1.5fF to 4fF, depending on the junction sizes. Devices made of junctions with linear dimensions below 100nm×100nm demonstrate a remarkable single-electron behavior in both superconducting and normal state. We also investigated the area dependence of the junction capacitances for transistor and array samples.

arXiv:cond-mat/0410288•Journal of Applied Physics•Feb 4, 2005•37 citations

Fabrication of High-Quality Josephson Junctions Based on Nb|Al-AlN|NbN

Artem M. Chekushkin, Lyudmila V. Filippenko, Fominskiy M. Yu. +1 more

A description of the fabrication technology of high-quality tunnel SIS junctions is presented, with following characteristics: energy gap in superconductors Vg=3.2-3.4 mV, tunnel current density up to J 35 kA/cm2, quality factor Rj/Rn (ratio of subgap resistance to normal-state resistance) up to 30, junction area up to 1 μm2. The SIS junctions are integrated into the NbTiN|SiO2|Al microstrip line. Keywords: superconducting devices, superconductor--insulator--superconductor tunnel junction, plasma etching.

Physics of the Solid State•Jan 1, 2022•1 citation

TECHNOLOGIES FOR THE FABRICATION OF NANOSCALE SUPERCONDUCTING CIRCUITS

道生 渡部

Researches on the fabrication of ~ 0.1 × 0.1 μ m 2 superconductor–insulator–superconductor (SIS) Josephson junctions are reviewed. Today, a typical dimension is 1–10 μm for Josephson junctions in superconducting integrated circuits. These Josephson junctions are defined by well-established photolithographic technology with reactive ion etching (RIE), and for the superconductor, Nb is almost always used. The merits of Nb include the facts that the superconducting transition temperature Tc of Nb (9.2 K ) is higher than the boiling point of He (4.2 K ), and that Nb has excellent stability against thermal cycling between room temperature and liquid- He temperature. For the fabrication of ~ 0.1 × 0.1 μ m 2 junctions, on the other hand, there is a standard process with electron-beam lithography, shadow evaporation, and lift-off. This process works well for Al (Tc = 1.2 K ), however, it is not ideal for Nb . The scope of this brief review is the nanoscale junction with Nb electrodes. We will look at the efforts of optimizing the standard lift-off process for Nb , electron-beam-lithographic versions of the Nb Josephson-junction technology, focused-ion-beam (FIB) etching as a convenient alternative to electron-beam lithography and RIE, etc. In order to characterize nanoscale tunnel junctions, the single-charge transistor has been often fabricated. Therefore, a summary of its theoretical transport properties is also included.

Modern Physics Letters B•Apr 30, 2005•3 citations

Fabrication of high-quality submicron Nb/Al-AlO x /Nb tunnel junctions

Haifeng Yu, Cao Wen-Hui, Zhu Xiao-Bo +6 more

Nb/Al–AlO x /Nb tunnel junctions are often used in the studies of macroscopic quantum phenomena and superconducting qubit applications of the Josephson devices. In this work, we describe a convenient and reliable process using electron beam lithography for the fabrication of high-quality, submicron-sized Nb/Al–AlO x /Nb Josephson junctions. The technique follows the well-known selective Nb etching process and produces high-quality junctions with V m = 100 mV at 2.3 K for the typical critical current density of 2.2 kA/cm 2 , which can be adjusted by controlling the oxygen pressure and oxidation time during the formation of the tunnelling barrier. We present the results of the temperature dependence of the sub-gap current and in-plane magnetic-field dependence of the critical current, and compare them with the theoretical predictions.

Chinese Physics B•Aug 1, 2008•7 citations

Fabrication of High-Quality Niobium Superconducting Tunnel Junctions

Qinyin Xu, Chunhai Cao, Mengyue Li +6 more

For high-quality superconducting tunnel junctions (STJs), it is necessary to reduce leakage current as much as possible. We describe the fabrication of niobium STJs using the selective niobium (Nb) etching process and various ways to minimize the leakage current. The experiment shows that the leakage current mainly comes from shorts in the tunnel barrier layer rather than those around the junction edges. Through systematic analysis of the thin film stress, surface morphology and modified junction structures, we fabricate high-quality Nb STJs with a gap voltage of 2.8 mV and a leakage current at 1 mV as low as 8.1% and 0.023% at 4.2 K and 0.3 K, respectively.

Chinese Physics Letters•Aug 1, 2011•3 citations
A method to fabricate large-area superconducting hybrid tunnel junctions with a suspended central normal metal part is presented. The samples are fabricated by combining photo-lithography and chemical etch of a superconductor—insulator—normal metal multilayer. The process involves few fabrication steps, is reliable and produces extremely high-quality tunnel junctions. Under an appropriate voltage bias, a significant electronic cooling is demonstrated. We analyze semi-quantitatively the thermal behavior of a typical device.
Superconducting junctions are widely used in a multitude of applications ranging from quantum information science and sensing to solid-state cooling. Traditionally, such devices must be fabricated on flat substrates using standard lithographic techniques. In this study, we demonstrate a highly versatile method that allows for superconducting junctions to be fabricated on a more complex topography. It is based on maskless direct laser writing and two-photon lithography, which allows writing in 3D space. We show that high-quality normal metal–insulator–superconductor tunnel junctions can be fabricated on top of a 20-μm-tall three-dimensional topography. Combined with conformal resist coating methods, this technique could allow sub-micron device fabrication on almost any type of topography in the future.
Josephson junction transistors and 50-junction arrays with linear junction dimensions from 200nm down to 70nm were fabricated from standard Nb∕AlOx∕Nb trilayers. The fabrication process includes electron beam lithography, dry etching, anodization, and planarization by chemical-mechanical polishing. The samples were characterized at temperatures down to 25mK. In general, all junctions are of high quality and their I-U characteristics show low leakage currents and high superconducting energy gap values of Δ≈1.35meV. The characteristics of the transistors and arrays exhibit some features in the subgap area, associated with tunneling of Cooper pairs, quasiparticles, and their combinations due to the redistribution of the bias voltage between the junctions. Total island capacitances of the transistor samples ranged from 1.5fF to 4fF, depending on the junction sizes. Devices made of junctions with linear dimensions below 100nm×100nm demonstrate a remarkable single-electron behavior in both superconducting and normal state. We also investigated the area dependence of the junction capacitances for transistor and array samples.
A description of the fabrication technology of high-quality tunnel SIS junctions is presented, with following characteristics: energy gap in superconductors Vg=3.2-3.4 mV, tunnel current density up to J 35 kA/cm2, quality factor Rj/Rn (ratio of subgap resistance to normal-state resistance) up to 30, junction area up to 1 μm2. The SIS junctions are integrated into the NbTiN|SiO2|Al microstrip line. Keywords: superconducting devices, superconductor--insulator--superconductor tunnel junction, plasma etching.
Researches on the fabrication of ~ 0.1 × 0.1 μ m 2 superconductor–insulator–superconductor (SIS) Josephson junctions are reviewed. Today, a typical dimension is 1–10 μm for Josephson junctions in superconducting integrated circuits. These Josephson junctions are defined by well-established photolithographic technology with reactive ion etching (RIE), and for the superconductor, Nb is almost always used. The merits of Nb include the facts that the superconducting transition temperature Tc of Nb (9.2 K ) is higher than the boiling point of He (4.2 K ), and that Nb has excellent stability against thermal cycling between room temperature and liquid- He temperature. For the fabrication of ~ 0.1 × 0.1 μ m 2 junctions, on the other hand, there is a standard process with electron-beam lithography, shadow evaporation, and lift-off. This process works well for Al (Tc = 1.2 K ), however, it is not ideal for Nb . The scope of this brief review is the nanoscale junction with Nb electrodes. We will look at the efforts of optimizing the standard lift-off process for Nb , electron-beam-lithographic versions of the Nb Josephson-junction technology, focused-ion-beam (FIB) etching as a convenient alternative to electron-beam lithography and RIE, etc. In order to characterize nanoscale tunnel junctions, the single-charge transistor has been often fabricated. Therefore, a summary of its theoretical transport properties is also included.
Nb/Al–AlO x /Nb tunnel junctions are often used in the studies of macroscopic quantum phenomena and superconducting qubit applications of the Josephson devices. In this work, we describe a convenient and reliable process using electron beam lithography for the fabrication of high-quality, submicron-sized Nb/Al–AlO x /Nb Josephson junctions. The technique follows the well-known selective Nb etching process and produces high-quality junctions with V m = 100 mV at 2.3 K for the typical critical current density of 2.2 kA/cm 2 , which can be adjusted by controlling the oxygen pressure and oxidation time during the formation of the tunnelling barrier. We present the results of the temperature dependence of the sub-gap current and in-plane magnetic-field dependence of the critical current, and compare them with the theoretical predictions.
For high-quality superconducting tunnel junctions (STJs), it is necessary to reduce leakage current as much as possible. We describe the fabrication of niobium STJs using the selective niobium (Nb) etching process and various ways to minimize the leakage current. The experiment shows that the leakage current mainly comes from shorts in the tunnel barrier layer rather than those around the junction edges. Through systematic analysis of the thin film stress, surface morphology and modified junction structures, we fabricate high-quality Nb STJs with a gap voltage of 2.8 mV and a leakage current at 1 mV as low as 8.1% and 0.023% at 4.2 K and 0.3 K, respectively.