Hardware Integration for Scalable Quantum Computing: Architectures, Control, and Manufacturing Challenges

Chuck Easttom

Dipan Kumar Das, Padmaja Patnaik, Sudip Kumar Das +2 more

The integration of semiconductor technologies with quantum computing hardware holds immense promise in revolutionizing computation paradigms. This abstract delves into the pivotal role semiconductor materials play in advancing quantum computing hardware, focusing on their fabrication, implementation, and scalability. Silicon quantum dots emerge as frontrunners in this landscape, offering a robust platform for qubit realization. Through lithography, ion implantation, and etching processes, semiconductor-based qubits demonstrate remarkable potential for scalability and manufacturability. This abstract navigates through the fundamentals of quantum computing, elucidating the principles of qubits and quantum gates. It explores the historical evolution of semiconductor technologies in quantum computing hardware, highlighting silicon as a promising substrate for quantum dot-based architectures. Challenges such as coherence times and error rates are scrutinized alongside potential solutions.

哲夫 小寺, Tetsuo Kodera, 浩介 堀部 +3 more

Thananchai Inang, Kritsada Janmathong, Nonchanutt Chudpooti +4 more

The transition of quantum technologies from laboratory-scale demonstrations to fault-tolerant and deployable systems is increasingly limited by the classical–quantum hardware interface. Although microwave subsystems for several leading quantum-computing platforms have been reviewed previously, the RF-to-terahertz hardware requirements that enable cross-platform maturation remain less systematically addressed. This article critically reviews RF-to-terahertz hardware for quantum technologies, focusing on cryogenic integration, high-density interconnects, and fabrication bottlenecks. Recent experimental efforts from the electronics engineering community are analyzed to identify shared limitations in low-temperature device modeling, thermal management, signal integrity, low-noise amplification, passive microwave structures, control and readout electronics, microwave-to-optical transduction, and scalable packaging. Competing approaches are assessed against common engineering criteria including RF and noise performance, bandwidth, power dissipation and thermal load, integration density, calibration complexity, fabrication reproducibility, and maturity toward scalable deployment. The review argues that future progress is no longer governed only by the optimization of individual components, but by the co-design of materials, devices, interconnects, control architectures, measurement chains, and manufacturing processes. In this framework, scalability, miniaturization, integration density, and reproducibility become central metrics for quantum hardware development. By synthesizing developments across quantum computing, sensing, communication, and networking platforms, this review provides a component-level roadmap for RF, microwave, terahertz, and electronics engineers working toward scalable, manufacturable, and interoperable quantum technology systems.

Ganiyat Abiodun Salawu, Bright Glen

Quantum computing is increasingly seen as a disruptive technology capable of expanding the computational limits of advanced manufacturing systems within the emerging Industry 5.0 framework. By utilizing quantum mechanical principles such as superposition, entanglement, and quantum parallelism, quantum computation enables new approaches to solving complex optimization, simulation, and data-intensive problems that are challenging or impractical for classical computers. This paper offers a comprehensive and critical review of the potential impacts of quantum computing on advanced manufacturing, focusing on intelligent production planning, supply chain optimization, materials discovery, predictive maintenance, and human–machine collaboration, key aspects of Industry 5.0. The originality of this review lies in its integrated analysis of quantum computing alongside artificial intelligence, digital twins, and cyber–physical systems, highlighting how these technologies, when combined, improve decision-making speed, process efficiency, and sustainability. Despite these opportunities, the integration of quantum computing into Industry 5.0 systems faces critical challenges, including hardware limitations, algorithm scalability, data security concerns, workforce readiness, and the complexity of integrating quantum solutions with existing industrial infrastructures. The role of hybrid quantum-classical architectures is examined as a feasible and transitional approach for near-term manufacturing applications. By critically assessing both technological strengths and practical constraints, this review positions quantum computing as a promising enabler of resilient, human-centered, and sustainable manufacturing ecosystems. The insights aim to assist researchers, industry players, and policymakers in strategically managing the integration of quantum technologies as manufacturing systems advance toward Industry 5.0.