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International Conference on Power Engineering (ICPE)

A Study on Magnetic Interference of TEC Cooling System on Diamond Quantum Current Sensor

Xiaotong Li, Linlin Wang, Feihu Tao, Ximing Gao, Jiguang Zhao

Published Dec 5, 2025• 0 citations

Abstract

This paper investigates the thermal management and magnetic interference issues associated with the integration of thermoelectric cooling (TEC) systems into diamond quantum current sensors for power grid applications. With the increasing demand for advanced monitoring and control systems in modern power grids, quantum current sensors based on nitrogen-vacancy (NV) centers in diamonds offer significant potential due to their wide measurement range, high sensitivity, and excellent environmental adaptability. However, integrating these sensors into a compact System in Package (SiP) design introduces thermal challenges, particularly in managing the heat generated by the laser diode (LD). The TEC-based active cooling system, although compact and precise, generates magnetic interference that may impact sensor performance. Through finite element analysis (FEA) and experimental validation, the study reveals that the TEC causes significant magnetic interference, especially within 5 mm of its surface. A solution is proposed, positioning the TEC at a sufficient distance from the sensor to reduce magnetic interference to below 1 μT. Further analysis suggests that while reducing interference to sub-nanotesla levels requires a larger distance, this may reduce cooling efficiency and device integration. The findings provide valuable insights into the design of quantum current sensors with TECs, offering a balance between minimizing magnetic interference and maintaining system efficiency.

DOI: 10.1109/icpe68635.2025.11407688

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