Integration and low power consumption of cryogenic amplifiers, which are essential for reading out quantum qubits, are inevitable issues for scaling up quantum information processing systems. Although cryogenic probers play an important role in this development, measurement solutions using impedance tuners are not available due to the long high frequency wiring for thermal insulation. In this paper we propose a new probe head structure with high thermal insulation. We eliminate metal heat conduction by using electromagnetic coupling between planar resonant circuits. In addition to evaluating the transmission characteristics of the prototype probe head at room temperature, we experimentally assess its thermal stability under conditions with a significant thermal gradient. This technique enables shorter high-frequency lines in cryogenic probers by providing the probe head itself with thermal insulating properties.
Integration and low power consumption of cryogenic amplifiers, which are essential for reading out quantum qubits, are inevitable issues for scaling up quantum information processing systems. Although cryogenic probers play an important role in this development, measurement solutions using impedance tuners are not available due to the long high frequency wiring for thermal insulation. In this paper we propose a new probe head structure with high thermal insulation. We eliminate metal heat conduction by using electromagnetic coupling between planar resonant circuits. In addition to evaluating the transmission characteristics of the prototype probe head at room temperature, we experimentally assess its thermal stability under conditions with a significant thermal gradient. This technique enables shorter high-frequency lines in cryogenic probers by providing the probe head itself with thermal insulating properties.
Since superconducting quantum computers use microwave signals to control and readout their qubits, microwave transmission lines and circuits that can be used under cryogenic conditions are required. For microwave transmission lines, thermal insulation is essential to enhance wiring density and to prevent parasitic heating that can lead to increased computational errors. Thus, here we design and characterize a scalable, thermally insulated microwave transmission line. The transmission line designed for superconducting qubit readout at 5 GHz band achieves both thermal insulation and low loss, by employing resonator-based impedance matching in a microstripline structure. A flexible cable including eight planar transmission lines was designed, fabricated and characterized using S-parameter measurement, demonstrating low crosstalk below 40dB and signal attenuation of -23.5±0.07dB; this coincides with electromagnetic simulations. These microwave properties remained stable across a wide temperature range from room temperature down to 4 K, including steep gradients. The integration of chip attenuators further reduces thermal noise and protects sensitive cryogenic components. Our approach offers a promising solution for compact, high-density microwave wiring using flat cables under thermal gradients, necessary for large scale quantum computing.
Integrated semiconductor circuits operating at cryogenic temperatures can play a crucial role in scaling quantum computing architectures based on trapped-ion and superconducting qubits. Other technologies, such as low-temperature detectors, can also benefit significantly from these circuits. These applications demand high-frequency, cryogenic temperature measurement systems for the thorough characterization of semiconductor components and circuits. This work presents a customizable, high-frequency, fast, and reliable cryogenic measurement setup for measurement temperatures ranging from room temperature to 4.2 K. It features up to two dc probes or two ground-signal-ground probes for frequencies of up to 67 GHz, which can be configured in a 180° or 90° configuration. In addition, up to 48 BeCu wires configured as twisted pairs provide supply and control signals. Furthermore, up to four rf connections can be mounted directly to a printed circuit board. The setup features an optical microscope in the vacuum chamber to position the probes, which is further utilized by a machine vision algorithm, allowing the detection of pads and automatic positioning of the probes over the pads. The hardware is located in a 550 × 500 × 500 mm3 large vacuum chamber with two independent pulse tube cryocoolers with cooling powers of up to 0.9 and 0.4 W at 4.2 K. Exemplary room temperature and cryogenic S-parameter, transient frequency (fT), time-domain, capacitance-voltage, and dc measurements of single transistors and integrated circuits fabricated by Infineon are presented, demonstrating the system's measurement capability for quantum computing and other applications.
Fast feedback from cryogenic electrical characterization measurements is key for the development of scalable quantum computing technology. At room temperature, high-throughput device testing is accomplished with a probe-based solution, where electrical probes are repeatedly positioned onto devices for acquiring statistical data. In this work, we present a probe station that can be operated from room temperature down to below 2 K. Its small size makes it compatible with standard cryogenic measurement setups with a magnet. A large variety of electronic devices can be tested. Here, we demonstrate the performance of the prober by characterizing silicon fin field-effect transistors as a host for quantum dot spin qubits. Such a tool can massively accelerate the design-fabrication-measurement cycle and provide important feedback for process optimization toward building scalable quantum circuits.
Abstract Superconducting quantum computers require microwave control lines running from room temperature to the mixing chamber of a dilution refrigerator. Adding more lines without preliminary thermal modeling to make predictions risks overwhelming the cooling power at each thermal stage. In this paper, we investigate the thermal load of SC-086/50-SCN-CN semi-rigid coaxial cable, which is commonly used for the control and readout lines of a superconducting quantum computer, as we increase the number of lines to a quantum processor. We investigate the makeup of the coaxial cables, verify the materials and dimensions, and experimentally measure the total thermal conductivity of a single cable as a function of the temperature from cryogenic to room temperature values. We also measure the cryogenic DC electrical resistance of the inner conductor as a function of temperature, allowing for the calculation of active thermal loads due to Ohmic heating. Fitting this data produces a numerical thermal conductivity function used to calculate the static heat loads due to thermal transfer within the wires resulting from a temperature gradient. The resistivity data is used to calculate active heat loads, and we use these fits in a cryogenic model of a superconducting quantum processor in a typical Bluefors XLD1000-SL dilution refrigerator, investigating how the thermal load increases with processor sizes ranging from 100 to 225 qubits. We conclude that the theoretical upper limit of the described architecture is approximately 200 qubits. However, including an engineering margin in the cooling power and the available space for microwave readout circuitry at the mixing chamber, the practical limit is approximately 140 qubits.
Cryogenic systems are essential to many modern scientific and technological applications, including MRI superconducting magnets, particle accelerators, astrophysical detectors and quantum computing platforms, all of which operate at temperatures well below 120 K. In this framework, accurate temperature monitoring is, therefore, critical. However, conventional Resistance Temperature Detectors (RTDs) suffer from significant limitations in cryogenic environments, such as wiring complexity, power dissipation, limited low-temperature operation and large footprint, which restrict their integration in increasingly complex cryogenic infrastructures. Superconducting devices offer a promising alternative due to their high sensitivity at low temperatures, low power dissipation and compatibility with integrated quantum technologies. Inspired by Microwave Kinetic Inductance Detectors (MKIDs), this work investigates superconducting microwave resonators as minimally invasive, frequency-multiplexed cryogenic thermometers operating below 12 K. In particular, strategies to tune and enhance temperature sensitivity are explored by studying the effects of the superconducting thin-film thickness and surface nanostructuring. The first part of the study examines NbTi(N) planar resonators with thicknesses ranging from 20 nm to 150 nm, where temperature sensing is based on the temperature dependence of the kinetic inductance. S-shaped split-ring resonators resonating near 1.1 GHz are inductively coupled to a coplanar transmission line and characterized under cryogenic conditions. A clear trade-off between temperature sensitivity and quality factor is observed: thinner films achieve higher sensitivity, up to approximately 19 MHz/K for 20 nm thick devices, while the quality factor, typically exceeding 10^4, is found to degrade when the thickness is reduced. This trade-off leads to an optimal temperature resolution, with sub-microkelvin noise-equivalent temperature (NET) values. In particular, a minimum NET of (0.53±0.09) µK/Hz^(1/2) at 4.2 K is achieved for a 100 nm thick resonator, which is also exploited to study low-frequency temperature fluctuations in liquid helium. In the second part, a possible approach to enhance the temperature sensitivity, through surface nanostructuring, is investigated. Arrays of nanogaps are patterned in high-current regions of a 1.3 GHz resonator, in order to locally suppress superconductivity, reduce the critical temperature of the film and, therefore, accentuate the slope of the temperature-sensitive curve. These weak-links are realized by partially etching a 100 nm NbTi film, to leave 20-30 nm thick remaining nanogaps. Measurements reveal a significant increase in temperature sensitivity, reaching values as high as up to (62±1) MHz/K, which correspond to one order-of-magnitude improvement over non-nanostructured devices. Although this enhancement comes with increased noise-equivalent temperature, the results demonstrate the feasibility of engineering superconducting weak links to improve RF cryogenic thermometry and provide a solid foundation for future optimization. In reason of the achieved results, such an approach could find successful applications for a sub-µK high-resolution cryogenic temperature monitoring, specifically for integrated quantum architectures, further benefiting from the frequency-multiplexing that naturally arises from the multiple allocation of different superconducting microwave resonators.
Quantum computing promises an exponential speed-up of computation compared to what is nowadays achievable with classical computers. In this way, it enables the evaluation of more complex models and the breaching of current security algorithms. For the operation of a quantum system, many questions remain to be answered. Currently, there are several quantum technologies that promise to be both reliable and scalable, two features required for large scale quantum operations. Common to all technologies is the operating temperature that needs to be close to absolute zero, i.e. below 100 mK, to suppress environment noise and allow the quantum properties to become 'visible'. In order for any quantum processor to be operated, a so-called quantum-classical interface is required for the quantum bit (qubit) read-out and control. This interface consists of various electronic blocks, such as analog-to-digital converters, digital-to-analog converters, mixers, amplifiers and a digital controller. Especially the analog blocks require effort to meet the noise and stability constraints as not to disturb the very sensitive qubits and allow reading of the tiny signals. As the qubits live in extremely deep-cryogenic temperatures, long wires interface the cryogenic with the room temperature environment, where most of the electronics is situated. However, for a scalable system, heat injection becomes a serious problem, with many wires between 300 K and sub-Kelvin. Furthermore, such amount of interconnects is challenging to mechanically place in a dilution refrigerator. Therefore, in this work, we propose to implement the electronics not at room temperature, but at a temperature much closer to the qubits, for example at 4 K. This not only reduces significantly the wiring between room temperature and the qubits, but we can also benefit from lower electronic noise at such a temperature. The operation of conventional electronics almost 200°C below its normal temperature range is not trivial as device properties alter significantly and most circuits no longer operate as intended. In CMOS processes, the main technology in the integrated electronics world, the behaviour of the transistors, required for the implementation of any circuit, deviates considerably at low temperatures. The transistor's threshold voltage goes up, the mobility increases and the subthreshold slope becomes steeper, to name just a few of these deviations. Although there are improvements in performance, there are also some counter effects, and characterization of the transistors is needed to observe the changes. Once devices are characterized at such low temperatures, new models can be built and circuits can be simulated and adapted to operate properly at cryogenic temperatures. Luckily, there are various commercially available devices that can already withstand the chills of cold. We demonstrated various commercially available devices, such as a field-programmable gate array (FPGA) implemented in a 28 nm CMOS process, to be operating without major concerns at 4~K. Its properties alter only slightly, within 5 to 10%, and all tested circuit implementations, working at 300~K, also worked at 4 K. We combined both commercially available devices, that operate 200 K below their specified temperature range, with custom designed CMOS circuits to implement a cryogenic read-out platform for spin qubits. This system comprises amplifiers, an ADC, an FPGA, voltage regulators and a clock generator. It allows to amplify the tiny signal from the qubits and digitize it directly in the FPGA in order to process the data locally at 4~K. This system is one of the first systematic attempts at operating a part of the quantum-classical interface at cryogenic temperatures and forms the basis for future systems comprising the complete electronic interface for qubits to operate at such low temperatures. One of the main problems to tackle for cryogenic electronic systems is their power consumption. Power budgets are simply limited to roughly 1 or 2 Watts at 4 K and exponentially lower at deeper cryogenic temperatures, thus limiting the size of large-scale electronic systems. Our approach of combined commercial and custom circuits will have to be steadily replaced by a single (custom) technology that meets both power and scalability constraints. One of the best candidates is CMOS, a technology that the industry has relied upon for several decades and benefits from many optimizations thanks to Moore's law.