Cryogenic III-V and Nb electronics integrated on silicon for large-scale quantum computing platforms
Jaeyong Jeong, Seong Kwang Kim, Yoon‐Je Suh, Ji-Sung Lee, Joonyoung Choi, Bong Ho Kim, Bong Ho Kim, Juhyuk Park, Joonsup Shim, Nahyun Rheem, C. Lee, Younjung Jo, Dae‐Myeong Geum, Seung‐Young Park, Sanghyeon Kim, Sanghyeon Kim
Quantum computers now encounter the significant challenge of scalability, similar to the issue that classical computing faced previously. Recent results in high-fidelity spin qubits manufactured with a Si CMOS technology, along with demonstrations that cryogenic CMOS-based control/readout electronics can be integrated into the same chip or die, opens up an opportunity to break out the challenges of qubit size, I/O, and integrability. However, the power consumption of cryogenic CMOS-based control/readout electronics cannot support thousands or millions of qubits. Here, we show that III–V two-dimensional electron gas and Nb superconductor-based cryogenic electronics can be integrated with Si and operate at extremely low power levels, enabling the control and readout for millions of qubits. Our devices offer a unity gain cutoff frequency of 601 GHz, a unity power gain cutoff frequency of 593 GHz, and a low noise indication factor $$\left(\sqrt{{I}_{{{\rm{D}}}}}\, {g}_{{{{\rm{m}}}}}^{-1}\right)$$ of $$0.21\sqrt{{{{\rm{Vmm}}}}}\scriptstyle\sqrt{{S}^{-1}}$$ at 4 K using more than 10 times less power consumption than CMOS. The power consumption of control/readout electronics remains a limiting factor for large-scale quantum computers. Here, the authors demonstrate III–V semiconductor and Nb superconductor-based cryogenic electronics integrated on silicon for large-scale quantum computing systems.
Quantum computers now encounter the significant challenge of scalability, similar to the issue that classical computing faced previously. Recent results in high-fidelity spin qubits manufactured with a Si CMOS technology, along with demonstrations that cryogenic CMOS-based control/readout electronics can be integrated into the same chip or die, opens up an opportunity to break out the challenges of qubit size, I/O, and integrability. However, the power consumption of cryogenic CMOS-based control/readout electronics cannot support thousands or millions of qubits. Here, we show that III–V two-dimensional electron gas and Nb superconductor-based cryogenic electronics can be integrated with Si and operate at extremely low power levels, enabling the control and readout for millions of qubits. Our devices offer a unity gain cutoff frequency of 601 GHz, a unity power gain cutoff frequency of 593 GHz, and a low noise indication factor (IDgm−1) of 0.21VmmS−1 at 4 K using more than 10 times less power consumption than CMOS. The power consumption of control/readout electronics remains a limiting factor for large-scale quantum computers. Here, the authors demonstrate III–V semiconductor and Nb superconductor-based cryogenic electronics integrated on silicon for large-scale quantum computing systems.
Quantum computing promises to revolutionize our lives, achieving unprecedented computational powers and unlocking new possibilities in drug discovery, chemical simulations and cryptography. The fundamental unit of computation of a quantum computer is the quantum bit (qubit). It can be implemented in a number of technologies, such as superconducting qubits, spin qubits, photonic systems, trapped ions and NV-centers. Solid-state superconducting qubits and spin qubits seem to be the most promising ones, as shown by the recent demonstration of quantum supremacy with a superconducting qubit processor. Such quantum processors, to operate in the quantum regime, require very low temperatures around 10 mK, and they are hence kept inside dilution fridges. The electronics required to read out and control such processors is typically realized by discrete components or bulky scientific instruments at room temperature wired into the dilution fridge. Such approach is only feasible until few (< 100) qubits are handled, but it is not scalable for million-qubit processors required for fault-tolerant operation. In this thesis, readout and control electronics is proposed to be integrated and operated directly at cryogenic temperatures, in close proximity with the qubits and potentially even co-integrated. CMOS technology is advocated for its scalability, compactness and low prototyping cost, to create a comprehensive cryo-CMOS class of fully-integrated transceivers to read out and control solid-state qubits. In particular, the thesis focuses on cryo-CMOS radio-frequency integrated circuits for the readout of silicon quantum computers, looking to integrate the whole readout system, from the quantum layer to the room temperature user interface. Cryogenic CMOS devices are explored first, to lay the foundations of integrated circuit design. The realization of quantum dots in standard CMOS technology is explored as a platform to realize solid-state qubit arrays, demonstrating functionality at 50 mK and good reproducibility. Moreover, the operation of integrated transistors at 50 mK and 4.2 K is explored to understand their basic cryogenic functionality, through characterization and modeling. Then also integrated passives, such as capacitors, inductors and transformers, are studied and modeled at cryogenic temperatures. Then, a fully-integrated readout platform spanning across all the blocks needed for dispersive readout is proposed. A fully-integrated matrix of quantum dots with radio-frequency gate-based readout capabilities is demonstrated along with time- and frequency-multiplexing. This quantum-classical circuit shows all the features for a scalable approach and is the core of the platform following it. A cryogenic CMOS circulator based on a new all-pass filter architecture is demonstrated, to be used as integrated replacement for current bulky counterparts; it allows power reduction, insertion loss and bandwidth enhancement with respect to state-of-the-art integrated circulators. The rest of the front-end is also explored with dedicated test multiplexers, a low noise-amplifier and an oscillator, that are finally merged in a single fully-integrated low-noise receiver with frequency synthesizer operating at 3.5 K for scalable multiplexed readout of silicon qubits. The platform presented in this thesis, across temperature boundaries, carries all the features required for future scalable silicon quantum computing platforms and could therefore form their core.
A fault tolerant scalable quantum computer requires more than 1000 Qubits to perform real time state correction and to improve the Qubit coherence time. The dense wiring connections required between the quantum processor placed at a 100 mK temperature and the room temperature control and readout electronics serve as a limiting factor in this system. Qubit control and readout electronics operating at 4 K temperature, placed closer to a quantum processor inside the dilution refrigerator avoids the dense wiring connections to room temperature electronics, and hence, serve as a potential solution to realize a scalable quantum computer. However, with no CMOS process technology models available at cryogenic temperatures, the design of a fully integrated, ultra-low power Qubit control and readout electronics at a sub-1 mW power consumption proves to be extremely challenging. In recent years, there has been a huge rise in interest among the research communities to understand and solve the device and circuit level challenges at deep cryogenic temperatures. This paper presents an overview of the recently published active and passive device nonidealities, circuit design challenges and solutions, and the future research directions in the Qubit control and readout electronics operating at deep cryogenic temperatures.
Abstract The most promising quantum algorithms require quantum processors that host millions of quantum bits when targeting practical applications1. A key challenge towards large-scale quantum computation is the interconnect complexity. In current solid-state qubit implementations, an important interconnect bottleneck appears between the quantum chip in a dilution refrigerator and the room-temperature electronics. Advanced lithography supports the fabrication of both control electronics and qubits in silicon using technology compatible with complementary metal oxide semiconductors (CMOS)2. When the electronics are designed to operate at cryogenic temperatures, they can ultimately be integrated with the qubits on the same die or package, overcoming the ‘wiring bottleneck’3–6. Here we report a cryogenic CMOS control chip operating at 3 kelvin, which outputs tailored microwave bursts to drive silicon quantum bits cooled to 20 millikelvin. We first benchmark the control chip and find an electrical performance consistent with qubit operations of 99.99 per cent fidelity, assuming ideal qubits. Next, we use it to coherently control actual qubits encoded in the spin of single electrons confined in silicon quantum dots7–9 and find that the cryogenic control chip achieves the same fidelity as commercial instruments at room temperature. Furthermore, we demonstrate the capabilities of the control chip by programming a number of benchmarking protocols, as well as the Deutsch–Josza algorithm10, on a two-qubit quantum processor. These results open up the way towards a fully integrated, scalable silicon-based quantum computer.
Large-scale quantum computing holds promise for exponentially faster computation speed to address currently unsolvable problems. Nevertheless, biasing, driving and reading numerous physical qubits operating at cryogenic temperature remains an on-going challenge. In particular, the integration of cryogenic control and readout ICs appears mandatory to overcome the wiring bottleneck [1]–[3]. In this regard, the promising higher operating temperature (up to 1K) of silicon semiconductor qubits offers a more substantial cryogenic power budget, which could enable addressing larger qubit arrays with integrated cryogenic CMOS electronics. In the context of 100,000 qubits at 1K, the maximum power consumption allowed by cooling capability is about 1W within a compact footprint of just a few cm2, defining targets of2/qubit footprint. Focusing on the readout IC, the semiconductor-qubit coherence time also imposes a typical3.
Solid-state quantum computers require classical electronics to control and readout individual qubits and to enable fast classical data processing [1-3]. Integrating both subsystems at deep cryogenic temperatures [4], where solid-state quantum processors operate best, may solve some major scaling challenges, such as system size and input/output (I/O) data management [5]. Spin qubits in silicon quantum dots (QDs) could be monolithically integrated with complementary metal-oxide-semiconductor (CMOS) electronics using very-large-scale integration (VLSI) and thus leveraging over wide manufacturing experience in the semiconductor industry [6]. However, experimental demonstrations of integration using industrial CMOS at mK temperatures are still in their infancy. Here we present a cryogenic integrated circuit (IC) fabricated using industrial CMOS technology that hosts three key ingredients of a silicon-based quantum processor: QD arrays (arranged here in a non-interacting 3x3 configuration), digital electronics to minimize control lines using row-column addressing and analog LC resonators for multiplexed readout, all operating at 50 mK. With the microwave resonators (6-8 GHz range), we show dispersive readout of the charge state of the QDs and perform combined time- and frequency-domain multiplexing, enabling scalable readout while reducing the overall chip footprint. This modular architecture probes the limits towards the realization of a large-scale silicon quantum computer integrating quantum and classical electronics using industrial CMOS technology.
In the pursuit of quantum computing, solid-state quantum systems, particularly superconducting ones, have made remarkable advancements over the past two decades. However, achieving fault-tolerant quantum computing for next-generation applications necessitates the integration of several million qubits, which presents significant challenges in terms of interconnection complexity and latency that are currently unsolvable with state-of-the-art room-temperature control and readout electronics. Recently, cryogenic integrated circuits (ICs), including CMOS radio-frequency ICs and rapid-single-flux-quantum-logic ICs, have emerged as potential alternatives to room-temperature electronics. Unlike their room-temperature counterparts, these ICs are deployed within cryostats to enhance scalability by reducing the number and length of transmission lines. Additionally, operating at cryogenic temperatures can suppress electronic noise and improve qubit control fidelity. However, for CMOS ICs specifically, circuit design uncertainties arise due to a lack of reliable models for cryogenic field effect transistors as well as issues related to severe fickle noises and power dissipation at cryogenic temperatures. This paper provides a comprehensive review of recent research on both types of cryogenic control and readout ICs but primarily focuses on the more mature CMOS technology. The discussion encompasses principles underlying control and readout techniques employed in cryogenic CMOS ICs along with their architectural designs; characterization and modeling approaches for field effect transistors under cryogenic conditions; as well as fundamental concepts pertaining to rapid single flux quantum circuits.