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Liquid metal offers fluid replacement of quantum chip interconnects

Chris Patrick

Published Jun 26, 2024• 0 citations
Publisher

Abstract

Gallium alloy interconnects could enable non-destructive replacement of broken qubits in superconducting quantum computers without sacrificing performance.
DOI
10.1063/10.0026595

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Building a modular architecture with superconducting quantum computing chips is one of the means to achieve qubit scalability, allowing the screening, selection, replacement, and integration of individual qubit modules into large quantum systems. However, the nondestructive replacement of modules within a compact architecture remains a challenge. Liquid metals, specifically gallium alloys, can be alternatives to solid-state galvanic interconnects. This is motivated by their self-healing, self-aligning, and other desirable fluidic properties, potentially enabling the nondestructive replacement of modules at room temperatures, even after operating the entire system at millikelvin regimes. In this study, we present coplanar waveguide resonators (CPWRs) interconnected by gallium alloy droplets, achieving high internal quality factors up to nearly one million and demonstrating performance on par with the continuous solid-state CPWRs. Leveraging the desirable fluidic properties of gallium alloys at room temperature and their compact design, we envision a modular quantum system enabled by liquid metals.
Modular architectures are a promising route toward scalable superconducting quantum processors, but finite fabrication yield and the lack of high quality temporary interconnects impose fundamental limitations on system size. Here, we demonstrate chip-scale liquid-metal interconnects that show promise for plug-and-play superconducting quantum circuits by enabling non-destructive module replacement while maintaining high microwave performance. Using gallium-based liquid metals, we realize high-quality inter-module signal and ground interconnects, comparable in performance to conventional coplanar waveguide resonators. We illustrate consistent device characteristics across three thermal cycles between room temperature and 15 mK, as well as the ability to reform superconducting connections following module replacement. A width-dependent resonance frequency shift reveals a significant kinetic inductance fraction, which we attribute to the presence of βββ-phase tantalum as confirmed by X-ray characterization. Finally, we investigate power-dependent loss mechanisms and observe high-power dissipative nonlinearities qualitatively consistent with a readout-power heating model. These results establish liquid metals as viable chip-scale interconnects for reconfigurable, modular superconducting quantum systems.
Superconducting quantum computers are rapidly reaching scales where bottlenecks to scaling arise from the practical aspects of the fabrication process. To improve quantum computer performance, implementation technology that guarantees the scalability of the number of qubits is essential. Increasing the degrees of freedom in routing by 2.5-dimensional implementation is important for realizing circuit scalability. We report an implementation technology to overcome the scaling bottlenecks using a reliable connection qubit with a demonstration of quantum annealing. The method comprises interconnection based on quantum annealing using a superconducting flux qubit, precise coupling status control, and flip-chip bonding. We perform experiments and simulations with a proof-of-concept demonstration of qubit coupling via interconnection using a flux qubit. The coupling status is strictly controllable by quantum annealing. A low-temperature flip-chip bonding technology is introduced for the 2.5-dimensional interconnection. The superconducting flux qubit, formed across two different chips via bumps, is demonstrated for the first time to show a state transition like that in a conventional qubit. The quantum annealing flux qubit and flip-chip bonding enable new interconnections between qubits. A perspective on the possibility of applying this technology to the connection between gate-type qubits is described.