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Frontiers in Physics

Design and fabrication of cryogenic multiplexing control chip

Rutian Huang, Yunfan Shi, Xiao Geng, Liangliang Yang, Jianshe Liu, Wei Chen

Published Nov 9, 2023• 0 citations
Publisher

Abstract

This paper presents a design and fabrication process of a cryogenic multiplexing control chip (MCC) for superconducting quantum computers. The working temperature of MCC can be 10 ∼ 30 mK, because it could be integrated with quantum processor in the same package. With a multiplexing ratio of 1:4 and designed working frequency 4–8 GHz, the MCC is a non-reciprocity device which consisted of bandpass filters and isolators, which are based on tunable inductor bridges (TIB). The MCC chip size is 6 × 6 mm2 and includes λ/2 coplanar waveguides resonators, superconducting quantum interference device arrays, capacitors, low pass filters, baluns and bias lines. Adopting self-aligned process of Josephson junctions, the fabrication of MCC constitutes four lithography masks. The modular design of MCC could facilitate the development of large-scale superconducting quantum computers.

DOI
10.3389/fphy.2023.1212642

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This paper presents a design and fabrication process of a cryogenic multiplexing control chip (MCC) for superconducting quantum computers. The working temperature of MCC can be 10 ∼ 30 mK, because it could be integrated with quantum processor in the same package. With a multiplexing ratio of 1:4 and designed working frequency 4–8 GHz, the MCC is a non-reciprocity device which consisted of bandpass filters and isolators, which are based on tunable inductor bridges (TIB). The MCC chip size is 6 × 6 mm2 and includes λ/2 coplanar waveguides resonators, superconducting quantum interference device arrays, capacitors, low pass filters, baluns and bias lines. Adopting self-aligned process of Josephson junctions, the fabrication of MCC constitutes four lithography masks. The modular design of MCC could facilitate the development of large-scale superconducting quantum computers.
This paper proposes a scheme and design of cryogenic multiplexing control chip (MCC) which enables one microwave cable to control many superconducting qubits. Designed based on adjustable inductor, MCC is a non-reciprocal device which generates microwave signals between 4 and 8 GHz and constructs XY control circuit to operate qubits. The effects of filters, isolators, power splitters, qubits and load impedance on MCC are analyzed in the frequency-domain simulation. And in time-domain simulation, the response time, Gaussian pulses, single-sideband, amplitude and frequency compensation of MCC are examined. The MCC can be integrated with the superconducting qubits on the same package at 20 mK temperature stage, and output specific microwave pulses used to drive the superconducting qubits without crosstalks. The MCC can greatly reduce the number of microwave control lines and is beneficial to the development of large-scale superconducting quantum processor.
Solid-state quantum computers require classical electronics to control and readout individual qubits and to enable fast classical data processing [1-3]. Integrating both subsystems at deep cryogenic temperatures [4], where solid-state quantum processors operate best, may solve some major scaling challenges, such as system size and input/output (I/O) data management [5]. Spin qubits in silicon quantum dots (QDs) could be monolithically integrated with complementary metal-oxide-semiconductor (CMOS) electronics using very-large-scale integration (VLSI) and thus leveraging over wide manufacturing experience in the semiconductor industry [6]. However, experimental demonstrations of integration using industrial CMOS at mK temperatures are still in their infancy. Here we present a cryogenic integrated circuit (IC) fabricated using industrial CMOS technology that hosts three key ingredients of a silicon-based quantum processor: QD arrays (arranged here in a non-interacting 3x3 configuration), digital electronics to minimize control lines using row-column addressing and analog LC resonators for multiplexed readout, all operating at 50 mK. With the microwave resonators (6-8 GHz range), we show dispersive readout of the charge state of the QDs and perform combined time- and frequency-domain multiplexing, enabling scalable readout while reducing the overall chip footprint. This modular architecture probes the limits towards the realization of a large-scale silicon quantum computer integrating quantum and classical electronics using industrial CMOS technology.
We have demonstrated superconducting interconnect technologies that enable a variety of flip-chip 3D integrated structures and packages compatible with high-coherence superconducting qubits. Superconducting indium micro-bumps and underbump metal (UBM) were used to join superconducting qubit chips to superconducting readout and control modules while maintaining high qubit coherence (T1, T2,echo> 20 μs) in the presence of capacitive and inductive coupling between the chips. Scanning electron microscope, X-ray, infrared and confocal microscopy were used to investigate the micro-structure, alignment accuracy, and parallelism of flip-chip qubits. The superconducting readout and control modules can accommodate both niobium and aluminum-based circuit and amplifier fabrication processes, including shadow-evaporated aluminum or Nb/Al-AlOx/Nb trilayer Josephson junctions (JJs). We present results for up to 16 active superconducting chips having trilayer junctions bonded to a passive superconducting module. The I-V characteristics and switching behavior were measured for flip-chip-connected JJ arrays with 40-20,000 JJs. Our approach maintained chip-level junction critical current and qubit coherence, demonstrating it to be a viable approach to building larger quantum computing systems. This paper also discusses packaging approaches to developing a quantum-to-classical interface in a cryogenic environment with multiple temperature stages.
Large-scale cryogenic quantum systems are constrained by an input-output bottleneck between room-temperature electronics and millikelvin stages, particularly in superconducting qubit platforms. This bottleneck is most acute for output lines, where bulky and expensive microwave components limit scalability. A promising approach for scalable characterization and testing is to perform signal multiplexing directly at the qubit plane. We demonstrate a cryogenic CMOS (cryoCMOS) RF multiplexer operating at 10 millikelvin with record-low static power consumption of 200 pW. The device provides < 2 dB insertion loss and > 30 dB isolation across DC-8 GHz. Direct connection to transmon qubits marginally affects coherence times in the range of 100 microseconds, enabling multiplexing of readout, flux and, in principle, XY drive lines. This work introduces cryoCMOS multiplexers as valuable tools for scalable, high-throughput cryogenic characterization and testing, and advances co-integrated quantum-classical control for future large-scale quantum processors.
There needs a large quantity of microwave devices like circulators, isolators and quantum noise limited amplifier in the development of scalable superconducting quantum computers. Traditional isolators and circulators have huge size and could induce a high thermal dissipation. This paper designs a kind of on-chip Isolator-Circulator-Isolator (ICI), which is able to act as isolator and circulator synchronous. The ICI is composed of tunable inductor bridge which based on an array of superconducting quantum interference devices (SQUID). It works on the frequency between 4 and 8 GHz, and operation temperature at 20 mK, with isolation exceeds 40 dB and insertion loss less than 3 dB.
Fault-tolerant superconducting quantum processors are limited by decoherence, limited connectivity, and the wiring burden at cryogenic temperatures. This review surveys superconducting “metamaterials”: circuits built from many repeating, deeply subwavelength building blocks (unit cells) that tailor dispersion, impedance, and bandgaps. By shaping the electromagnetic (and sometimes acoustic) environment of a qubit, these networks can suppress or enhance radiative decay and frequency shifts (Purcell and Lamb effects) and provide compact multimode structures for multiplexed control and photon-mediated coupling. We emphasize the practical trade-offs—added dielectric participation, fabrication disorder, and leakage through spurious chip/package modes—and the measurements needed to quantify them. The review summarizes design and tuning approaches (including Josephson/Superconducting Quantum Interference Device implementations), materials and fabrication limits, and mode-resolved benchmarks, and it highlights emerging directions such as topological lattices and engineered reservoirs while clearly separating demonstrations from proposals.