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Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)

Miniaturized Crossed Beam Optical Dipole Trap for Compact Atom-Based Quantum Sensors

Marc Christ, Conrad Zimmermann, Oliver Anton, Markus Krutzik

Published Jun 26, 2023• 0 citations
Publisher

Abstract

Cold atomic quantum sensors rely on the generation, manipulation, and detection of atomic quantum gases and are well proven within laboratory environments. For many applications in the areas of sensing, timekeeping and fundamental physics, these setups need to be realized as mobile and field compatible, miniaturized devices. However, this is still a major technological challenge.

DOI
10.1109/cleo/europe-eqec57999.2023.10232254

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Cold atomic quantum sensors rely on the generation, manipulation, and detection of atomic quantum gases and are well proven within laboratory environments. For many applications in the areas of sensing, timekeeping and fundamental physics, these setups need to be realized as mobile and field compatible, miniaturized devices. However, this is still a major technological challenge.
Employing compact quantum sensors in field or in space (e.g., small satellites) implies demanding requirements on components and integration technologies. Within our work on integrated sensors, we develop miniaturized, ultra-stable optical setups for optical cooling and trapping of cold atomic gases. Besides challenging demands on alignment precision, and thermo-mechanical durability, we specifically address ultra-high vacuum (UHV) compatibility of our integration technologies and optical components. A prototype design of an UHV-compatible, crossed beam optical dipole trap setup and its application within a cold atomic quantum sensor is described. First qualification efforts on adhesive micro-integration technologies are presented. These tests are conducted in application-relevant geometries and material combinations common for micro-integrated optical setups. Adhesive aging will be investigated by thermal cycling or gamma radiation exposure. For vacuum compatibility testing, a versatile UHV testing system is currently being set up, enabling residual gas analysis and measurement of total gas rates down to 5•10-10mbar l/s at a base pressure of 10-11 mbar, exceeding the common ASTM E595 test.
Employing compact quantum sensors in field or in space (e.g., small satellites) implies demanding requirements on components and integration technologies. Within our work on integrated sensors, we develop miniaturized, ultra-stable optical setups for optical cooling and trapping of cold atomic gases. Besides challenging demands on alignment precision, and thermo-mechanical durability, we specifically address ultra-high vacuum (UHV) compatibility of our integration technologies and optical components. A prototype design of an UHV-compatible, crossed beam optical dipole trap setup and its application within a cold atomic quantum sensor is described. First qualification efforts on adhesive micro-integration technologies are presented. These tests are conducted in application-relevant geometries and material combinations common for micro-integrated optical setups. Adhesive aging will be investigated by thermal cycling or gamma radiation exposure. For vacuum compatibility testing, a versatile UHV testing system is currently being set up, enabling residual gas analysis and measurement of total gas rates down to 5•10-10mbar l/s at a base pressure of 10-11 mbar, exceeding the common ASTM E595 test.
Cold atom based quantum sensors require robust and miniaturized optical systems for applications on mobile platforms. A micro-integrated optical system (volume ∼25 mL) for trapping and manipulation of neutral atoms is presented. This setup focuses and precisely overlaps two high power laser beams (1064 nm, up to 2W total, wR = 34 µm) launched via a single-mode, polarization maintaining optical fiber, thereby realizing a crossed beam optical dipole trap (ODT). Adhesive bonding is qualified in application relevant geometries and material systems of micro-integrated optical systems for application on mobile platforms or space. Fused silica test blocks (bond area 2 × 4 mm2 ) are bonded with four different adhesives on silicon wafers. Theses samples are aged by thermal cycling (up to −55 °C to 150 °C) and/or gamma-radiation (10 000 mSv) and subsequently the bond strength is evaluated by die shear testing according to MIL-STD-883L. The influence of the environmental aging on the bond strength is presented, the failure mode and the influence of fillets discussed. In addition, the effects of plasma cleaning on the bond strength in this geometry is presented.
Laser cooled atoms have proven transformative for precision metrology, playing a pivotal role in state-of-the-art clocks and interferometers and having the potential to provide a step-change in our modern technological capabilities. To successfully explore their full potential, laser cooling platforms must be translated from the laboratory environment and into portable, compact quantum sensors for deployment in practical applications. This transition requires the amalgamation of a wide range of components and expertise if an unambiguously chip-scale cold atom sensor is to be realized. We present recent developments in cold-atom sensor miniaturization, focusing on key components that enable laser cooling on the chip-scale. The design, fabrication, and impact of the components on sensor scalability and performance will be discussed with an outlook to the next generation of chip-scale cold atom devices.