The high kinetic inductance of niobium nitride (NbN) thin films can be used for an implementation of compact on-chip inductances in cryoelectronic circuits. Here, for the first time, we demonstrate the implementation of a hybrid superconducting technology that includes the fabrication of standard aluminum submicron Josephson junctions and the NbN atomic layer deposition process. As an example, we fabricated and characterized a single and array of Al Josephson junctions together with NbN interconnections. The main Al Josephson junction parameters as well as NbN superconducting properties are in a good agreement with the values obtained by our standard fabrication process. The combination of technological processes for the NbN layers with Al Josephson junction allows implementing a new generation of innovative superconducting devices for different applications.
The high kinetic inductance of niobium nitride (NbN) thin films can be used for an implementation of compact on-chip inductances in cryoelectronic circuits. Here, for the first time, we demonstrate the implementation of a hybrid superconducting technology that includes the fabrication of standard aluminum submicron Josephson junctions and the NbN atomic layer deposition process. As an example, we fabricated and characterized a single and array of Al Josephson junctions together with NbN interconnections. The main Al Josephson junction parameters as well as NbN superconducting properties are in a good agreement with the values obtained by our standard fabrication process. The combination of technological processes for the NbN layers with Al Josephson junction allows implementing a new generation of innovative superconducting devices for different applications.
Abstract Superconducting qubits are a promising quantum computing platform, but significant challenges remain, such as achieving sufficiently long and stable coherence times and precise control of circuit parameters. Further improvements in material processing are essential to overcome these challenges. This paper introduces our research on superconducting quantum circuit technology based on nitride superconductors, where the core technologies are epitaxial growth of titanium nitride (TiN) on silicon (Si) substrates and epitaxial Josephson junctions using niobium nitride (NbN), aluminum nitride (AlN), and magnesium oxide (MgO). We have established a fabrication process of NbN/AlN/NbN epitaxial junctions on Si (100) substrates using a TiN film as a buffer layer and are working on applying this process to superconducting qubits. We describe recent results on the effect of junction annealing and discuss the advantages and potential of epitaxial Josephson junctions for realizing large-scale superconducting quantum circuits.
A new structure of the base-electrode for Josephson devices have been developed in which niobium (Nb) and niobium nitride (NbN) films were sequentially sputtered to form a double-layered structure. Owing to this structure, it is possible not only to reduce the kinetic inductance of the base-electrode due to the small penetration depth of Nb film, but also to obtain good tunneling characteristics with a small subgap conductance due to the surface stability of NbN film. Single-flux-quantum (SFQ) memory cells with this structure have been fabricated and it has been observed that the kinetic inductance is much decreased comparing with that of the SFQ cell with a base-electrode of NbN single layer.
A novel process suitable for fabrication superconducting circuitry based on the all refactory material NbN is described. In this process, and in-situ trilayer film composed of NbN/MgO/NbN is used to fabricate Josephson tunnel junctions. Reactive ion etching processes are used to delineate devices and pattern insulators and metallizations. Fabricated junctions have yielded good tunneling characteristics with reasonable current density uniformity and reproducibility. Devices with gap voltages close to 3mV have been achieved for high quality junctions (Vm 20 mV). In addition to the trilayer, there are two wiring layers, two resistor depositions, and two insulation layers, constituting a full NbN based fabrication technology. Using this process, we fabricated and successfully tested thin film DC SQUID and time domain reflectometer (TDR) circuits. Preliminary measurements suggest that the critical temperature of these circuits is well within the operating temperature of commercial two-stage closed cycle refrigerators. (Author)
We developed a process for fabricating nitride superconductor-based superconducting qubits monolithically integrated with a single flux quantum (SFQ)-based readout and control circuits. Since we used a Josephson junction (JJ) made of an NbN/AlN/NbN tri-layer, including a critical current density (Jc) of 50 A/cm2as the suitable material for superconducting qubits and SFQ readout/control circuits operating at 20 mK, the JJs for both the qubits and the SFQ circuits could simultaneously be fabricated. The device structure was also composed of three superconductive layers, comprising two superconductive layers as wiring layers and other layers as the top ground plane. Then, we used a Pd film as the resistive layer, which is required as the shunt resistors and the bias resistors for the SFQ control circuits, followed by an investigation of the properties of NbN/AlN/NbN epitaxial junctions and evaluation of the sheet inductance of the base NbN and wiring NbTiN layer. Our results showed the successful fabrication of a JJ with a sufficiently low leakage current and aJcof around 50 A/cm2, which was close to the target value. Furthermore, the evaluated sheet inductance exceeded 1 pH, which was several times larger than the values obtained for Nb-integrated circuits.
The development of large-scale quantum processors benefits from superconducting qubits that can operate at elevated temperatures and be fabricated with scalable, foundry-compatible processes. Atomic layer deposition (ALD) is increasingly being adopted as an industrial standard for thin-film growth, particularly in applications requiring precise control over layer thickness and composition. Here, we report superconducting qubits based on NbN/AlN/NbN trilayers deposited entirely by ALD. By varying the number of ALD cycles used to form the AlN barrier, we achieve Josephson tunneling through barriers of different thicknesses, with critical current density spanning seven orders of magnitude, demonstrating the uniformity and versatility of the process. Owing to the high critical temperature of NbN, transmon qubits based on these all-nitride trilayers exhibit microsecond-scale relaxation times, even at temperatures above 300 mK. These results establish ALD as a viable low-temperature deposition technique for superconducting quantum circuits and position all-nitride ALD qubits as a promising platform for operation at elevated temperatures.
Aluminum Josephson junctions are the building blocks for the realization of superconducting quantum bits. Attention has been also paid to hybrid ferromagnetic Josephson junctions, which allow switching between different magnetic states, making them interesting for applications such as cryogenic memories, single-photon detectors, and spintronics. In this paper, we report on the fabrication and characterization of high-quality ferromagnetic Josephson junctions based on aluminum technology. We employed an innovative fabrication process inspired by niobium-based technology, allowing us to obtain very high-quality hybrid aluminum Josephson junctions; thus, supporting the use of ferromagnetic Josephson junctions in advanced quantum circuits. The fabrication process is described in detail and the main DC transport properties at low temperatures (current-voltage characteristic, critical current as a function of the temperature, and the external magnetic field) are reported. Here, we illustrate in detail the fabrication process, as well as the main DC transport properties at low temperatures (current-voltage characteristic, critical current as a function of the temperature, and the external magnetic field).