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Cryogenic Electronics and Quantum Information Processing

D. Scott Holmes

Published Nov 1, 2021• 20 citations
Publisher

Abstract

The goal of this International Roadmap for Devices and Systems (IRDS) chapter is to survey, catalog, and assess the status of technologies in the areas of cryogenic electronics and quantum information processing. Application drivers are identified for sufficiently developed technologies and application needs are mapped as a function of time against projected capabilities to identify challenges requiring research and development effort.

DOI
10.1109/irds54852.2021.00012

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The goal of this International Roadmap for Devices and Systems (IRDS) chapter is to survey, catalog, and assess the status of technologies in the areas of cryogenic electronics and quantum information processing. Application drivers are identified for sufficiently developed technologies and application needs are mapped as a function of time against projected capabilities to identify challenges requiring research and development effort.
The International Roadmap for Devices and Systems (IRDS) recently succeeded the International Technology Roadmap for Semiconductors (ITRS). The roadmap driver changed from scaling physical dimensions to application requirements and now includes a broader range of non-semiconductor technologies, such as superconductor electronics (SCE). We review current applications for SCE, ranging from development activities to small- scale commercial products. Computational accelerators within data centers and other future applications will require significant improvements in circuit density, complexity, functional capability, memory capacity, and data rates in and out of the cryogenic environment. As a first step, we propose to develop an application-driven roadmap for superconducting digital computing that will include key decisions to be made by the superconductor electronics community.
Cryogenic electronics will have a strong impact on our society through applications as Quantum Computing but also, space communication, and high performance computing Quantum computers, for instance, have the potential to radically advance our computational capability and are predicted to strongly impact fields such as medicine, chemistry, science and finance by allowing to solve computational problems that cannot readily be solved by classical computers The hardware implementations of quantum computers rely on various quantum bit (qubit) technologies, such as superconducting qubits, spin qubits and Majorana fermions All of these Qubits require cryogenic temperatures (<4K) to operate efficiently, and need, and restitute Analog-RF signals for their manipulation, and results respectively Thus, there is a need for cryogenic electronics with a large array of functionalities, operating under extremely low noise conditions with limited power budgets Achieving this will require enhanced understanding of existing transistor technologies, 3D integrated systems and novel nanoelectronic devices employing unique low-temperature effects With these new devices, new ultra-low noise, ultra-low power, and wide-band circuits and systems are emerging, preparing the next computing revolution In this Workshop we will explore state of art status of Quantum computing applications and their associated technology and circuits analog-RF platforms
For some time, work has been continuing within the U.S.A. on a "Technology Roadmap for the Superconducting Electronics Industry". A similar roadmap exercise is underway in Europe, and in Japan, recently announced research projects in superconductivity involved a detailed planning process. However, the U.S. Roadmap is not complete, and a consensus of industry opinion has not yet been reached on its recommendations. This manuscript should be regarded as a distillation of inputs from many sources, heavily weighted with the author's own prejudices. He suggests that a system level view of superconducting electronics technology should lead to revisions of today's research priorities. In particular, the importance of the cryocooler and cryopackage in each system has broad implications, even affecting the directions of materials and device research.
A key goal of research into quantum information processing is the development of technologies that are scaleable in complexity while allowing the mass manufacture of devices that promise transformative effects on information science. The demonstration that integrated photonics circuits could be made to perform operations that exploit the quantum nature of the photon has turned them into leading candidates for practical quantum information processing technologies. To fully achieve their promise, however, requires research from diverse fields. This focus issue provides a snapshot of some of the areas in which key advances have been made. We are grateful for the contributions from leading teams based around the globe and hope that the degree of progress being made in a challenging and exciting field is apparent from the papers published here.
The transition of quantum technologies from laboratory-scale demonstrations to fault-tolerant and deployable systems is increasingly limited by the classical–quantum hardware interface. Although microwave subsystems for several leading quantum-computing platforms have been reviewed previously, the RF-to-terahertz hardware requirements that enable cross-platform maturation remain less systematically addressed. This article critically reviews RF-to-terahertz hardware for quantum technologies, focusing on cryogenic integration, high-density interconnects, and fabrication bottlenecks. Recent experimental efforts from the electronics engineering community are analyzed to identify shared limitations in low-temperature device modeling, thermal management, signal integrity, low-noise amplification, passive microwave structures, control and readout electronics, microwave-to-optical transduction, and scalable packaging. Competing approaches are assessed against common engineering criteria including RF and noise performance, bandwidth, power dissipation and thermal load, integration density, calibration complexity, fabrication reproducibility, and maturity toward scalable deployment. The review argues that future progress is no longer governed only by the optimization of individual components, but by the co-design of materials, devices, interconnects, control architectures, measurement chains, and manufacturing processes. In this framework, scalability, miniaturization, integration density, and reproducibility become central metrics for quantum hardware development. By synthesizing developments across quantum computing, sensing, communication, and networking platforms, this review provides a component-level roadmap for RF, microwave, terahertz, and electronics engineers working toward scalable, manufacturable, and interoperable quantum technology systems.