Comparative Study of the Bandwidth of Phonon-Cooled NbN Hot-Electron Bolometers in Submillimeter and Optical Wavelength Ranges
K. Ilin, Serguei Cherednichenko, Gregory N Gol'tsman +2 more
We report the results of the bandwidth measurements of NbN hot-electron bolometers, perfomied in the terahertz frequency domain at 140 GHz and 660 GHz and in time domain in the optical range at the wavelength of 395 nm.. Our studies were done on 3.5-nm-thick NbN films evaporated on sapphire substrates and patterned into ilin-size microbridges. In order to measure the gain bandwidth, we used two identical BWOs (140 or 660 GHz), one functioning as a local oscillator and the other as a signal source. The bandwidth we achieved was 3.5-4 GHz at 4.2 K with the optimal LO and DC biases. Time-domain measurements with a resolution below 300 fs were performed using an electro-optic sampling system, in the temperature range between 4.2 K to 9 K at various values of the bias current and optical power. The obtained response time of the NbN hot-electron bolometer to —100fs-wide Ti:sapphire laser pulses was about 27 ps, what corresponds to the 5.9 GHz gain bandwidth. Introduction The bandwidth of hot-electron bolometer (HEB) mixers has reached values which are record for bolometers. The gain bandwidth for phonon-cooled NbN HEB mixers of 4 GHz for 140 GHz and 650 GHz frequencies [1, 2] and the noise bandwidth of 8 GHz for 650 GHz [2] have been demonstrated. For diffusion-cooled Nb HEB mixers, the bandwidth has reached 6 GHz, when measured at 20--40 GHz [3]. However, there is a definite practical interest to even further extend the bandwidth of these devices. The possibilities of the HEB mixer technology in this direction are far from being exhausted. For example, the future of the NbN HEB technology requires that critical temperature Tc > 10 K and critical current density j c > 10 6 Akm at 4.2 K are simultaneously obtained for d < 3 nm-thick films M. The reduction of the optimal power of the local oscillator PLID below 100 nW leads to the decrease of the device length down to L < 0.2 pm, which, in turn, should bring an additional cooling channel for hot electrons—diffusion into metal contacts and a further bandwidth extension.
Softwaretechnik-Trends•Mar 1, 1998•0 citations