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High-contrast saturated absorption resonance observed in a MEN'S vapor cell under the two-frequency light excitation

Petersen, Michael, Rodolphe Boudot, Grégoire Coget, Nicolas Passilly, Vincent N. Maurice, Christophe Gorecki, Denis V. Brazhnikov

Published Sep 17, 2018• 0 citations
OpenAlex

Abstract

Modern quantum technologies require the development of highly-sensitive, compact and even miniaturized, low-power consumption and high-performance devices, including atomic clocks, lasers or sensors. These instruments are to date often based on the use of chip-size diode lasers and microfabricated (MEMS) cells filled with alkali-atom vapors.

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Modern quantum technologies require the development of highly-sensitive, compact and even miniaturized, low-power consumption and high-performance devices, including atomic clocks, lasers or sensors. These instruments are to date often based on the use of chip-size diode lasers and microfabricated (MEMS) cells filled with alkali-atom vapors.
Microfabricated (MEMS) alkali vapor cells are at the core of high-precision integrated atomic quantum sensors and devices [1], such as microwave and optical clocks, or magnetometers. The first chip-scale atomic device was a microwave atomic clock based on coherent population trapping [2]. It has offered in its industrial and commercialized version an ultra-low size-power -instability budget, impacting a plethora of industrial and scientific applications. Nevertheless, the short-term stability of these clocks is usually limited at about 10−10 at 1 s. Hot vapor MEMS-based optical frequency standards constitute a new generation of miniaturized clocks, with enhanced stability. These references keep the benefit of using wafer-scalable and mass-producible vapor cells while preventing ultra-high vacuum technologies and laser cooling. Among the transitions explored, the 6S1/2 → 7P1/2 near-UV transition of Cs atom was used to demonstrate an optical reference with a stability of 2.1 × 10−13 at 1 s and averaging down to a few 10−14 [3]. However, this reference was based on a 5 cm-long glass-blown cell, not compliant with the advent of a fully-miniaturized and low-power optical clock. In this work [4], we present the characterization of sub-Doppler resonances detected in a microfabricated cell by probing, in a simple saturated absorption configuration, the Cs atom 6S1/2 → 7P1/2 transition at 459 nm. The impact of the laser intensity and cell temperature on the sub-Doppler resonance is experimentally investigated. Optimal values are identified for the development of a near-UV microcell-stabilized frequency reference. Detection noise measurements are also reported, predicting a short-term stability in the 10−13 range at 1 s. Tests of cells with embedded getters are under progress for improved purity of the cell inner atmosphere and narrowing of the resonance.
Chip-scale atomic devices combine elements of precision atomic spectroscopy, silicon micromachining, and advanced diode laser technology to create compact, low-power, and manufacturable instruments with high precision and stability. Microfabricated alkali vapor cells are at the heart of most of these technologies, and the fabrication of these cells is discussed in detail. We review the design, fabrication, and performance of chip-scale atomic clocks, magnetometers, and gyroscopes and discuss many applications in which these novel instruments are being used. Finally, we present prospects for future generations of miniaturized devices, such as photonically integrated systems and manufacturable devices, which may enable embedded absolute measurement of a broad range of physical quantities.
We describe recent progress in the development of millimeter-scale instruments based on alkali atom vapor cells implemented with microfabrication techniques. Because of their small size and correspondingly low power requirements, these "chip-scale" atomic clocks and magnetometers have the potential to bring atomically precise instrumentation to portable, battery-operated systems such as GPS receivers, remote sensors and wireless communication devices. In addition, wafer-level processing and assembly potentially allows for very low cost per instrument if high volumes are produced.