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IEICE Technical Report; IEICE Tech. Rep.

Fabrication of three-dimensional superconducting tunnel junctions

Go Fujii, Masahiro Ukibe, Shigetomo Shiki, M. Ohkubo

Published Oct 8, 2014• 0 citations
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Superconducting junctions are widely used in a multitude of applications ranging from quantum information science and sensing to solid-state cooling. Traditionally, such devices must be fabricated on flat substrates using standard lithographic techniques. In this study, we demonstrate a highly versatile method that allows for superconducting junctions to be fabricated on a more complex topography. It is based on maskless direct laser writing and two-photon lithography, which allows writing in 3D space. We show that high-quality normal metal–insulator–superconductor tunnel junctions can be fabricated on top of a 20-μm-tall three-dimensional topography. Combined with conformal resist coating methods, this technique could allow sub-micron device fabrication on almost any type of topography in the future.
For high-quality superconducting tunnel junctions (STJs), it is necessary to reduce leakage current as much as possible. We describe the fabrication of niobium STJs using the selective niobium (Nb) etching process and various ways to minimize the leakage current. The experiment shows that the leakage current mainly comes from shorts in the tunnel barrier layer rather than those around the junction edges. Through systematic analysis of the thin film stress, surface morphology and modified junction structures, we fabricate high-quality Nb STJs with a gap voltage of 2.8 mV and a leakage current at 1 mV as low as 8.1% and 0.023% at 4.2 K and 0.3 K, respectively.