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Bulletin of the American Physical Society

Multilayer Microwave Integrated Quantum Circuits

Lev Krayzman, Chan U Lei, T. Brecht, Christopher J. Axline, Yiwen Chu, Luke Burkhart, Luigi Frunzio, Robert J. Schoelkopf

Published Mar 5, 2018• 0 citations
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We present a device demonstrating a lithographically patterned transmon integrated with a micromachined cavity resonator. Our two-cavity, one-qubit device is a multilayer microwave integrated quantum circuit (MMIQC), comprising a basic unit capable of performing circuit-QED (cQED) operations. We describe the qubit-cavity coupling mechanism of a specialized geometry using an electric field picture and a circuit model, and finally obtain specific system parameters using simulations. Fabrication of the MMIQC includes lithography, etching, and metallic bonding of silicon wafers. Superconducting wafer bonding is a critical capability that is demonstrated by a micromachined storage cavity lifetime $34.3~\mathrm{μs}$, corresponding to a quality factor of 2 million at single-photon energies. The transmon coherence times are $T_1=6.4~\mathrm{μs}$, and $T_2^{Echo}= 11.7~\mathrm{μs}$. We measure qubit-cavity dispersive coupling with rate $χ_{qμ}/2π=-1.17~$MHz, constituting a Jaynes-Cummings system with an interaction strength $g/2π=49~$MHz. With these parameters we are able to demonstrate cQED operations in the strong dispersive regime with ease. Finally, we highlight several improvements and anticipated extensions of the technology to complex MMIQCs.

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Microwave Electronics in Quantum Computers

Hiu Yung Wong

Springer eBooks•Jan 1, 2025•0 citations
We present a device demonstrating a lithographically patterned transmon integrated with a micromachined cavity resonator. Our two-cavity, one-qubit device is a multilayer microwave integrated quantum circuit (MMIQC), comprising a basic unit capable of performing circuit-QED (cQED) operations. We describe the qubit-cavity coupling mechanism of a specialized geometry using an electric field picture and a circuit model, and finally obtain specific system parameters using simulations. Fabrication of the MMIQC includes lithography, etching, and metallic bonding of silicon wafers. Superconducting wafer bonding is a critical capability that is demonstrated by a micromachined storage cavity lifetime 34.3 μs34.3~\mathrm{μs}34.3 μs, corresponding to a quality factor of 2 million at single-photon energies. The transmon coherence times are T1=6.4 μsT_1=6.4~\mathrm{μs}T1​=6.4 μs, and T2Echo=11.7 μsT_2^{Echo}= 11.7~\mathrm{μs}T2Echo​=11.7 μs. We measure qubit-cavity dispersive coupling with rate χqμ/2π=−1.17 χ_{qμ}/2π=-1.17~χqμ​/2π=−1.17 MHz, constituting a Jaynes-Cummings system with an interaction strength g/2π=49 g/2π=49~g/2π=49 MHz. With these parameters we are able to demonstrate cQED operations in the strong dispersive regime with ease. Finally, we highlight several improvements and anticipated extensions of the technology to complex MMIQCs.