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IEICE Technical Report; IEICE Tech. Rep.

10 kA/cm2 Nb Processを用いた SFQ浮動小数点乗算器の50 GHzでの動作評価

泰浩 島村, 世樹 貝沼, 史滋 宮岡, 裕希 山梨, 信行 吉川, 朗 藤巻, 一義 高木, 直史 高木

Published Jul 15, 2010• 0 citations
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Submicron Nb/AlOx/Nb junctions having high critical current density of more than 20 kA/cm2are required for realizing single-flux-quantum (SFQ) circuits operating at a high speed of more than 100 GHz. We have developed a 20 kA/cm2process having submicron circular junctions. 1000-serially-connected circular shape junctions having six different diameters of 0.5 μm, 0.564 μm, 0.7 μm, 0.9 μm, 1.1 μm, and 1.3 μm have been designed. The 0.564 μm junction is designed to be 50 μA with critical current density of 20 kA/cm2, which is a minimum current value of a target SFQ circuit design. We totally fabricated 12 wafers with the 20 kA/cm2process. The 1σ spread of critical currents (Ic) depending on junction sizes and the run-to-run reproducibility of critical current densities are reported as a summary of these fabrications. We obtained Icscattering of 1σ≤ 2% even in the minimum circular junction of 0.25 μm2in several fabrication runs.

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The specific capacitance Cs of Nb/AlOx/Nb Josephson tunnel junction has been measured by means of the superconducting quantum interference device (SQUID) resonance technique. We have investigated the junctions with critical current densities Jc in the range of 0.1–18 kA/cm2 and found that 1/Cs linearly depends on a logarithm of Jc. This suggests that the barrier thickness is moderately uniform in the junction area and increases continuously during growth. The results also show that increasing Jc reduces time constants of the junction.
Submicron Nb/AlOx/Nb junctions having high critical current density of more than 20 kA/cm2are required for realizing single-flux-quantum (SFQ) circuits operating at a high speed of more than 100 GHz. We have developed a 20 kA/cm2process having submicron circular junctions. 1000-serially-connected circular shape junctions having six different diameters of 0.5 μm, 0.564 μm, 0.7 μm, 0.9 μm, 1.1 μm, and 1.3 μm have been designed. The 0.564 μm junction is designed to be 50 μA with critical current density of 20 kA/cm2, which is a minimum current value of a target SFQ circuit design. We totally fabricated 12 wafers with the 20 kA/cm2process. The 1σ spread of critical currents (Ic) depending on junction sizes and the run-to-run reproducibility of critical current densities are reported as a summary of these fabrications. We obtained Icscattering of 1σ≤ 2% even in the minimum circular junction of 0.25 μm2in several fabrication runs.