We describe the development of a novel silicon quantum bit (qubit) device architecture that involves using materials that are compatible with a Sandia National Laboratories (SNL) 0.35 mum complementary metal oxide semiconductor (CMOS) process intended to operate at 100 mK. We describe how the qubit structure can be integrated with CMOS electronics, which is believed to have advantages for critical functions like fast single electron electrometry for readout compared to current approaches using radio frequency techniques. Critical materials properties are reviewed and preliminary characterization of the SNL CMOS devices at 4.2 K is presented.
We describe the development of a novel silicon quantum bit (qubit) device architecture that involves using materials that are compatible with a Sandia National Laboratories (SNL) 0.35 mum complementary metal oxide semiconductor (CMOS) process intended to operate at 100 mK. We describe how the qubit structure can be integrated with CMOS electronics, which is believed to have advantages for critical functions like fast single electron electrometry for readout compared to current approaches using radio frequency techniques. Critical materials properties are reviewed and preliminary characterization of the SNL CMOS devices at 4.2 K is presented.
Solid-state quantum computers require classical electronics to control and readout individual qubits and to enable fast classical data processing [1-3]. Integrating both subsystems at deep cryogenic temperatures [4], where solid-state quantum processors operate best, may solve some major scaling challenges, such as system size and input/output (I/O) data management [5]. Spin qubits in silicon quantum dots (QDs) could be monolithically integrated with complementary metal-oxide-semiconductor (CMOS) electronics using very-large-scale integration (VLSI) and thus leveraging over wide manufacturing experience in the semiconductor industry [6]. However, experimental demonstrations of integration using industrial CMOS at mK temperatures are still in their infancy. Here we present a cryogenic integrated circuit (IC) fabricated using industrial CMOS technology that hosts three key ingredients of a silicon-based quantum processor: QD arrays (arranged here in a non-interacting 3x3 configuration), digital electronics to minimize control lines using row-column addressing and analog LC resonators for multiplexed readout, all operating at 50 mK. With the microwave resonators (6-8 GHz range), we show dispersive readout of the charge state of the QDs and perform combined time- and frequency-domain multiplexing, enabling scalable readout while reducing the overall chip footprint. This modular architecture probes the limits towards the realization of a large-scale silicon quantum computer integrating quantum and classical electronics using industrial CMOS technology.
Abstract The most promising quantum algorithms require quantum processors that host millions of quantum bits when targeting practical applications1. A key challenge towards large-scale quantum computation is the interconnect complexity. In current solid-state qubit implementations, an important interconnect bottleneck appears between the quantum chip in a dilution refrigerator and the room-temperature electronics. Advanced lithography supports the fabrication of both control electronics and qubits in silicon using technology compatible with complementary metal oxide semiconductors (CMOS)2. When the electronics are designed to operate at cryogenic temperatures, they can ultimately be integrated with the qubits on the same die or package, overcoming the ‘wiring bottleneck’3–6. Here we report a cryogenic CMOS control chip operating at 3 kelvin, which outputs tailored microwave bursts to drive silicon quantum bits cooled to 20 millikelvin. We first benchmark the control chip and find an electrical performance consistent with qubit operations of 99.99 per cent fidelity, assuming ideal qubits. Next, we use it to coherently control actual qubits encoded in the spin of single electrons confined in silicon quantum dots7–9 and find that the cryogenic control chip achieves the same fidelity as commercial instruments at room temperature. Furthermore, we demonstrate the capabilities of the control chip by programming a number of benchmarking protocols, as well as the Deutsch–Josza algorithm10, on a two-qubit quantum processor. These results open up the way towards a fully integrated, scalable silicon-based quantum computer.
Quantum computing promises to revolutionize our lives, achieving unprecedented computational powers and unlocking new possibilities in drug discovery, chemical simulations and cryptography. The fundamental unit of computation of a quantum computer is the quantum bit (qubit). It can be implemented in a number of technologies, such as superconducting qubits, spin qubits, photonic systems, trapped ions and NV-centers. Solid-state superconducting qubits and spin qubits seem to be the most promising ones, as shown by the recent demonstration of quantum supremacy with a superconducting qubit processor. Such quantum processors, to operate in the quantum regime, require very low temperatures around 10 mK, and they are hence kept inside dilution fridges. The electronics required to read out and control such processors is typically realized by discrete components or bulky scientific instruments at room temperature wired into the dilution fridge. Such approach is only feasible until few (< 100) qubits are handled, but it is not scalable for million-qubit processors required for fault-tolerant operation. In this thesis, readout and control electronics is proposed to be integrated and operated directly at cryogenic temperatures, in close proximity with the qubits and potentially even co-integrated. CMOS technology is advocated for its scalability, compactness and low prototyping cost, to create a comprehensive cryo-CMOS class of fully-integrated transceivers to read out and control solid-state qubits. In particular, the thesis focuses on cryo-CMOS radio-frequency integrated circuits for the readout of silicon quantum computers, looking to integrate the whole readout system, from the quantum layer to the room temperature user interface. Cryogenic CMOS devices are explored first, to lay the foundations of integrated circuit design. The realization of quantum dots in standard CMOS technology is explored as a platform to realize solid-state qubit arrays, demonstrating functionality at 50 mK and good reproducibility. Moreover, the operation of integrated transistors at 50 mK and 4.2 K is explored to understand their basic cryogenic functionality, through characterization and modeling. Then also integrated passives, such as capacitors, inductors and transformers, are studied and modeled at cryogenic temperatures. Then, a fully-integrated readout platform spanning across all the blocks needed for dispersive readout is proposed. A fully-integrated matrix of quantum dots with radio-frequency gate-based readout capabilities is demonstrated along with time- and frequency-multiplexing. This quantum-classical circuit shows all the features for a scalable approach and is the core of the platform following it. A cryogenic CMOS circulator based on a new all-pass filter architecture is demonstrated, to be used as integrated replacement for current bulky counterparts; it allows power reduction, insertion loss and bandwidth enhancement with respect to state-of-the-art integrated circulators. The rest of the front-end is also explored with dedicated test multiplexers, a low noise-amplifier and an oscillator, that are finally merged in a single fully-integrated low-noise receiver with frequency synthesizer operating at 3.5 K for scalable multiplexed readout of silicon qubits. The platform presented in this thesis, across temperature boundaries, carries all the features required for future scalable silicon quantum computing platforms and could therefore form their core.
A systematic research on the development of cryogenic complementary metal-oxide semiconductor (cryo-CMOS) circuits, for implementing the required control electronics to manipulate the quantum bit (qubit) state, is performed over the last few years. Scalability constitutes a key term regarding the evolution of quantum computing from theory to practical application and CMOS technology has been proven to be a promising candidate for implementing the coveted scalable next-generation quantum computers (QCs). Mixed-signal blocks, used for uniting the analog and digital domains, play a key role in the efficient functionality of the qubit control/readout system, thus there is an ever-increasing interest in their high-performance circuit realization. The critical challenge in this venture is to achieve efficient cryogenic operation at low temperatures, i.e., close to the qubit around 4 K, simultaneously keeping power requirements at low values. An overview and comparison of the cryo-CMOS Digital-to-Analog converter (DAC) and Analog-to-Digital converter (ADC) circuit implementations for quantum computing applications that heretofore have been proposed in the literature is presented in this work. A discussion on the challenges and future strategic steps that are henceforth required to proceed toward the development of a functional scalable quantum computer is also conducted.
We report on an industry-grade complementary metal-oxide semiconductor (CMOS)-compatible qubit fabrication approach using a CMOS pilot line, enabling a yield of functional devices that reaches 92.8%, with a resistance spread evaluated across the full wafer 200 mm in diameter of 12.4% and relaxation times T1 approaching $80\phantom{\rule{0.2em}{0ex}}\text{\ensuremath{\mu}}\mathrm{s}$. Furthermore, we conducted a comprehensive analysis of wafer-scale room-temperature (RT) characteristics collected from multiple wafers and fabrication runs, focusing on RT measurements and their correlation to low-temperature qubit parameters. From defined test structures, an across-wafer Josephson junction (JJ) area variation of 10.1% and oxide barrier variation of 7.2% was calculated. Additionally, from the room-temperature JJ characterization the qubit frequency can be derived at the wafer level by applying the Ambegaokar-Baratoff model before making low-temperature measurements. This sets the stage for precooldown wafer-level JJ evaluation and sorting. In particular, such early device characterization and validation are crucial for increasing the fabrication yield and qubit frequency targeting, which currently represent major scaling challenges. Furthermore, this enables the fabrication of large multichip quantum systems in the future. Our analysis highlights the great potential of CMOS-compatible industry-style fabrication of superconducting qubits for scalable quantum computing in a foundry pilot line cleanroom.
A systematic investigation of currently implemented cryogenic electronics for controlling and reading out spin qubits using complementary metal-oxide semiconductor (CMOS) technology is done. Scalability is the primary focus in developing these circuits, as enabling universal quantum computing requires increasing the number of qubits by several orders of magnitude. Low power dissipation is a main quality benchmark for cryogenic circuits that is being optimized. Next to that, the possibility of connecting multiple control signals to each qubit is a challenge for large qubit numbers. Depending on the placement of the electronics, different power budgets and connectivity options are available. These characteristics are used to discuss medium and long-term use-cases for existing designs and what future concepts and developments might be possible or necessary for full scalability on the example of spin qubit operation electronics.