We investigated full-epitaxial TiN/AlN/TiN Josephson junctions on MgO substrates for superconducting qubit applications. The critical temperature (TC) of TiN film is relatively low at around 5 K, but its lattice constant is about 0.424 nm, which is close to the lattice constant of MgO of 0.421 nm. TiN and AIN films were prepared by DC magnetron sputtering in a load-lock sputtering system with an ultra-high vacuum chamber. The deposition temperature was varied from ambient temperature to 1073 K. In XRD analysis, (200) peaks were observed in both the TiN single layer film and the TiN/AIN/TiN trilayer film. No other XRD peaks were observed in the single layer or trilayer films. The lattice constant of TiN was determined to be 0.4242 nm from XRD analysis, close to the value of 0.4212 nm for MgO. The 150 nm-thick single-layer TiN film on the MgO substrate showed a TCof 5.3 K and a resistivity of 3.5 μΩcm at 10 K. Based on these epitaxial TiN films, we fabricated TiN/AIN/TiN Josephson junctions and measured their current-voltage characteristics. At 1.9 K, the electrical parameters of junctions with JC= 50 A/cm2showed that the gap voltage and the ratio of Rsg/RNwere about 2.5 mV and 2.1, respectively.
We investigated full-epitaxial TiN/AlN/TiN Josephson junctions on MgO substrates for superconducting qubit applications. The critical temperature (TC) of TiN film is relatively low at around 5 K, but its lattice constant is about 0.424 nm, which is close to the lattice constant of MgO of 0.421 nm. TiN and AIN films were prepared by DC magnetron sputtering in a load-lock sputtering system with an ultra-high vacuum chamber. The deposition temperature was varied from ambient temperature to 1073 K. In XRD analysis, (200) peaks were observed in both the TiN single layer film and the TiN/AIN/TiN trilayer film. No other XRD peaks were observed in the single layer or trilayer films. The lattice constant of TiN was determined to be 0.4242 nm from XRD analysis, close to the value of 0.4212 nm for MgO. The 150 nm-thick single-layer TiN film on the MgO substrate showed a TCof 5.3 K and a resistivity of 3.5 μΩcm at 10 K. Based on these epitaxial TiN films, we fabricated TiN/AIN/TiN Josephson junctions and measured their current-voltage characteristics. At 1.9 K, the electrical parameters of junctions with JC= 50 A/cm2showed that the gap voltage and the ratio of Rsg/RNwere about 2.5 mV and 2.1, respectively.
This paper presents the fabrication and characterization of superconducting qubit components from titanium nitride (TiN) and aluminum nitride (AlN) layers to create Josephson junctions and superconducting resonators in an all-nitride architecture. Our methodology comprises a complete process flow for the fabrication of TiN/AlN/TiN junctions, characterized by scanning electron microscopy (SEM), atomic force microscopy (AFM), ellipsometry and DC electrical measurements. We evaluated the sputtering rates of AlN under varied conditions, the critical temperatures of TiN thin films for different sputtering environments, and the internal quality factors of TiN resonators in the few-GHz regime, fabricated from these films. Overall, this offered insights into the material properties critical to qubit performance. Measurements of the dependence of the critical current of the TiNIAlNITiN junctions yielded values ranging from 150μAto 2μA, for AlN barrier thicknesses up to ca. 5 nm, respectively. Our findings demonstrate advances in the fabrication of nitride-based superconducting qubit components, which may find applications in quantum computing technologies based on novel materials.
Abstract In this work, we report the electrical properties of NbN internally shunted Josephson junctions with NbN x barriers. Cross-sectional scanning transmission electron microscopy analysis shows that all layers have the same cubic structure; NbN/NbN x /NbN trilayers were epitaxially grown on MgO substrates. The resistivity of the NbN x films could be varied in the range of 1–104 mΩ cm by controlling both the N2 partial pressure and the deposition time during reactive sputtering. The temperature dependence of the critical current density (J c) and characteristic voltage (I c R n) of the junctions with different barrier resistivities were measured for various barrier thicknesses. For the 10 nm-thick NbN x layer with resistivities of 73.44, 385.72, and 711 mΩ cm, the coherence length of the barrier was determined to be 5.55 ± 0.07, 4.88 ± 0.06, and 1.40 ± 0.13 nm, respectively, corresponding to carrier diffusion rates of 2.741 ± 0.004, 1.211 ± 0.002, and 0.008 ± 0.001 cm2 s−1, respectively. Thus, the reduction in barrier resistivity leads to a larger coherence length and a faster diffusion rate, which will further increase the J c and I c R n of the junction. By adjusting the barrier resistivity and thickness, the J c of the junction can be easily tuned over more than four orders of magnitude, and an I c R n value of 0.97 ± 0.07 mV was obtained at 10 K. The results indicate that the all-NbN self-shunt junction is a promising candidate in high-speed and high-temperature applications.
To improve the performance of Josephson oscillators and SIS mixers over 700 GHz, we have developed a fabrication process to grow epitaxial NbN/MgO/NbN trilayers by reactive dc-sputtering. Trilayers were fabricated on a single-crystal MgO substrate at ambient temperature. NbN and MgO films were deposited by reactive dc-sputtering with an Nb and Mg target, respectively. The MgO inter-layer thickness was changed up to 480 nm, but, T/sub C/ and 20-K resistivity of the NbN upper-layer showed no remarkable dependency and they were 15.7 K and about 60 /spl mu//spl Omega/cm, respectively. To evaluate the RF performance of the epitaxial NbN films, we fabricated Josephson junctions with a microstrip resonator constructed from an epitaxial NbN/MgO/NbN trilayer. The I-V characteristics of the junction exhibited resonance steps up to 2.5 mV, which suggests that the epitaxial NbN films have low loss up to 1.2 THz.
We have fabricated NbTiN/Al-AlNX/NbTiN Josephson tunnel junctions on thermally oxidized Si substrates for their applications to single-flux-quantum circuits operating around 10 K. NbTiN films with a critical temperature Tcof 14.2 K and a root-mean-square value of their surface roughness of 0.45 nm were used as junction electrodes. For a junction barrier, radical-nitrided AlNXwas used to realize high uniformity in the critical current Icof the junctions. We obtained NbTiN junctions with a gap voltage Vg of 4.3 mV and an IcRn. product of 2.6 mV at 4.2 K, where R. is the junction resistance. The critical current density Jc, at 4.2 K was obtained in the range between 0.2 and 6.2 kA/cm2by changing a nitridation time for the AlNXbarrier formation. A series array of 200 junctions with an area of 10 μm × 10 μm exhibited a small I', spread, and the standard deviation 1-σ in Icuniformity was less than 1.6% in the temperature range between 4 K and 10 K.
Self-Shunted NbN Junctions With NbNx/AlN Bilayered Barriers for 4 K Operation
We report the fabrication and electrical characteristics of self-shunted Josephson junctions consisting of NbN electrodes, an AlN barrier, and an NbNx normal layer for an SFQ circuit application. To fabricate such junctions with a high characteristic voltage V c, we have studied their preparation conditions including the surface treatments of MgO substrates. Junction characteristics at 4 K were dependent on the electrical properties and film thickness of the NbNx layer; the underdamped junctions changed into overdamped ones with an increase in the film thickness. The overdamped junctions showed a characteristic voltage Vc of 0.8 mV and a critical current density Jc of 22 A/cm2 at 4.2 K.
The field of quantum computation has advanced greatly in the recent years, with materials being tuned to address issues like qubit lifetime, and coherence time. Superconducting qubits based on Josephson Junctions are a promising approach for improved qubit design, yet they are made with polycrystalline and amorphous materials. Transition metal nitrides, like TiN and NbN, offer good chemical and mechanical properties as well as the possibility of a lattice matched junction, with AlN as the insulating layer. We have characterized MBE grown NbxTi1-xN films (with x = 0, 0.45, and 0.78) and a Nb2N film by XRD and AFM. This thesis will focus on the superconducting properties: critical temperature (Tc), superconducting transition width (ΔTc), and critical field (Hc). Two methods have been used: four-point probe DC measurements in an adiabatic demagnetization refrigerator (ADR) were used for Tc and ΔTc measurements, and a magnetic properties measurement system (MPMS) which employs a SQUID magnetometer was employed for Tc and Hc measurements. Values of Tc ranged from 4.2 K for TiN to 15.2 K for the x= 0.45 film, and 14.8 for x=0.78, while the Nb2N had Tc of 9.9 K, as found by DC measurements. These values agreed with those found by MPMS. The films’ critical fields were found to be ~69.6 Oe for the TiN film and ~250 Oe for x=0.78. These results start to demonstrate the trends of the superconducting properties of alloyed NbxTi1-xN superconductors.