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Applied Superconductivity

Investigation of basic elements and devices in multilayer technology for HTS digital RSFQ circuits

Ben J. Ruck, Yonuk Chong, Georg Wahl, Regina Dittmann, C. Horstmann, A. Engelhardt, B. Oelze, Erik Sodtke

Published Oct 1, 1999• 0 citations
Publisher
DOI
10.1016/s0964-1807(99)00031-9

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Thermal noise strongly influences the operation of RSFQ (rapid single flux quantum) logic circuits made of high-temperature superconductors (HTS). In the past, the circuit design was based on fabrication yield optimization. A new theoretical study using a method of general determination of the digital bit-error rate (BER) gives hope to develop such devices with a large immunity against noise. With regard to this study the design parameters of a circuit optimized with respect to fabrication yield are far from its minimum bit-error rate. Only for temperatures close to 4 K the parameters determined for fabrication yield match the parameters obtained with BER optimization. For this reason, a new reliable technology for fabrication of HTS circuits is required. We have developed a new fabrication process to serve as a basis for a proof of this new design approach. We have calculated the bit-error rate of a newly designed RSFQ chip with realistic values derived from a test chip which has been fabricated with this new multilayer technology. The new technology contains three superconductor thin films. An inductance smaller than 0.5 pH per square has been reached by using a ground plane.

Superconductor Science and Technology•Feb 19, 2002•8 citations
Thermal noise strongly influences the operation of RSFQ (rapid single flux quantum) logic circuits made of high-temperature superconductors (HTS). In the past, the circuit design was based on fabrication yield optimization. A new theoretical study using a method of general determination of the digital bit-error rate (BER) gives hope to develop such devices with a large immunity against noise. With regard to this study the design parameters of a circuit optimized with respect to fabrication yield are far from its minimum bit-error rate. Only for temperatures close to 4 K the parameters determined for fabrication yield match the parameters obtained with BER optimization. For this reason, a new reliable technology for fabrication of HTS circuits is required. We have developed a new fabrication process to serve as a basis for a proof of this new design approach. We have calculated the bit-error rate of a newly designed RSFQ chip with realistic values derived from a test chip which has been fabricated with this new multilayer technology. The new technology contains three superconductor thin films. An inductance smaller than 0.5 pH per square has been reached by using a ground plane.