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IEEE International Superconductive Electronics Conference (ISEC)

Fabrication of NbN/Al-AlNx/NbN tunnel junctions on several kinds of substrates

Hiroyuki Akaike, Tatsunori Funai, Shunya Sakamoto, Akira Fujimaki

Published Jul 1, 2013• 1 citation
Publisher

Abstract

We have evaluated the electrical characteristics of NbN/Al-AlNx/NbN tunnel junctions fabricated on sapphire-C or fused-silica substrates. NbN/Al-AlNx/NbN multilayers were prepared by reactive dc-magnetron sputtering deposition of lower and upper NbN layers, and rf-magnetron sputtering deposition of the Al layer, followed by radical-nitridation. The junctions showed low sub-gap leakage currents in the current-voltage characteristics at 4.2 K. The quality parameter, Rsg/Rn, where respective Rsgand Rnare the sub-gap resistance at 2 mV and junction resistance at 5 mV, was above 15. The gap voltage (Vg) was around 3.3 mV, which was reduced in comparison with Vgvalues of ~4.3 mV for junctions on MgO substrates. The reduced Vgwas caused by superconducting properties of lower NbN layers deposited on the sapphire or fused-silica substrates. Uniformity in critical current (Ic) was relatively good, and the maximum-to-minimum spread in Icwas ±1.7% for 200 junctions on a sapphire substrate and ±2.0% for the junctions on a fused-silica substrate.

DOI
10.1109/isec.2013.6604313

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We have evaluated the electrical characteristics of NbN/Al-AlNx/NbN tunnel junctions fabricated on sapphire-C or fused-silica substrates. NbN/Al-AlNx/NbN multilayers were prepared by reactive dc-magnetron sputtering deposition of lower and upper NbN layers, and rf-magnetron sputtering deposition of the Al layer, followed by radical-nitridation. The junctions showed low sub-gap leakage currents in the current-voltage characteristics at 4.2 K. The quality parameter, Rsg/Rn, where respective Rsgand Rnare the sub-gap resistance at 2 mV and junction resistance at 5 mV, was above 15. The gap voltage (Vg) was around 3.3 mV, which was reduced in comparison with Vgvalues of ~4.3 mV for junctions on MgO substrates. The reduced Vgwas caused by superconducting properties of lower NbN layers deposited on the sapphire or fused-silica substrates. Uniformity in critical current (Ic) was relatively good, and the maximum-to-minimum spread in Icwas ±1.7% for 200 junctions on a sapphire substrate and ±2.0% for the junctions on a fused-silica substrate.
All-NbN Josephson tunnel junctions with sputter-deposited magnesium oxide barriers have been fabricated using single-crystal NbN films for the base electrodes. Fabricated Josephson junctions have shown good tunneling characteristics with large gap voltages (5.6-5.8 mV), narrow gap widths (0.1-0.2 mV, from 30 to 70%), and small subgap leakage currents (V/sub m/=20-30 mV, measured at 3 mV). The results of a measurement of a subgap structure for a fabricated junction suggest that the excess leakage currents of fabricated junctions are due to multiparticle tunneling through locally thin areas in the MgO barriers.
A new NbN multilayer technology has been developed on 3 inch diameter R-plane sapphire substrates, for combining on-chip fast RSFQ circuits with GHz bandwidth optical links, The circuits take advantage of two high quality [110] NbN layers sputtered epitaxially on sapphire at 600/spl deg/C and selectively patterned: a 400 nm thick layer (/spl lambda//sub L//spl sim/250 nm at 6 K) acts for the ground-plane and microbridge photodetectors are made of a 3.5-8 nm thick NbN epilayer with T/sub c/ above 11 K. Innovative dielectrics formed of 10 nm thick MgO sputtered on top of 200 mm SiO/sub 2/ layers are found to improve significantly the superconductivity of NbN junction electrode lines deposited below 300/spl deg/C. Good quality, hysteretic 2 /spl mu/m/sup 2/ area, NbN/MgO/NbN junctions with high J/sub c/ (up to 50 kA/cm/sup 2/) are obtained with very large gap voltage (6.20 mV) and low sub-gap leakage current (V/sub m/>15 mV) at 4.2 K. At 11 K such junctions are found self-shunted (J/sub c//spl sim/10 k4/cm/sup 2/) with R/sub n/I/sub c/ above 0.5 mV and with low J/sub c/ spread in arrays. J/sub c/ can be adjusted (reduced) without any detrimental effect on the junction quality or spread by annealing at 250/spl deg/C.
Niobium nitride-niobium nitride Josephson tunnel junctions have been fabricated using amorphous magnesium oxide (a-MgO) films as barriers. These junctions have excellent tunneling characteristics. For example, a large gap voltage (Vg=5.1 mV), a large product of the maximum critical current and the normal tunneling resistance (IcRn=3.25 mV), and a small subgap leakage current (Vm=45 mV, measured at 3 mV) have been obtained for a NbN/a-MgO/NbN junction. The critical current of this junction remains finite up to 14.5 K.
We have fabricated NbTiN/Al-AlNX/NbTiN Josephson tunnel junctions on thermally oxidized Si substrates for their applications to single-flux-quantum circuits operating around 10 K. NbTiN films with a critical temperature Tcof 14.2 K and a root-mean-square value of their surface roughness of 0.45 nm were used as junction electrodes. For a junction barrier, radical-nitrided AlNXwas used to realize high uniformity in the critical current Icof the junctions. We obtained NbTiN junctions with a gap voltage Vg of 4.3 mV and an IcRn. product of 2.6 mV at 4.2 K, where R. is the junction resistance. The critical current density Jc, at 4.2 K was obtained in the range between 0.2 and 6.2 kA/cm2by changing a nitridation time for the AlNXbarrier formation. A series array of 200 junctions with an area of 10 μm × 10 μm exhibited a small I', spread, and the standard deviation 1-σ in Icuniformity was less than 1.6% in the temperature range between 4 K and 10 K.
Superconductor–insulator–superconductor (SIS) tunnel junctions including magnetic barriers, with structures NbN/AlNiN/NbN or NbN/MgO/NiO/MgO/NbN, were fabricated. The junctions with upper NbN layers of good crystallinity showed a gap voltage ( V g ) higher than 5 mV. In an NbN/Al 0.942 Ni 0.058 N/NbN junction, its Josephson current I c was suppressed to approximately a third of a theoretical value under no magnetic field. Therefore, it would be possible to avoid Josephson noise in magnetic barrier junctions with a much smaller magnetic field than junctions with conventional barriers. The Ni ion area density dependence of I c suppression ratio was identical for both types of junction, suggesting that the area density of magnetic ions is the factor that determines the I c suppression ratio. On the other hand, the extents of degradation of V g and increase in leakage current caused by the increase in Ni ion area density were smaller in MgO/NiO/MgO barrier junctions than in AlNiN barrier junctions. This suggests that the proximity effect of magnetic ions was weakened owing to the separation of Ni ions and NbN layers by the inserted thin MgO layers.