Cryogenic microwave measurement of superconducting quantum devices is complicated by the packaging required to connect devices to control and readout circuitry. In this work, we outline the design and experimental demonstration of a wirebond-free, PCB-free, drop-in microwave package for on-chip superconducting quantum devices. The package is composed of a superconducting aluminum cavity with a suspended tungsten transmission pin. The fundamental package cavity mode is far detuned from the 4 GHz to 8 GHz band of interest, and the pin transmission exhibits less than 3 dB of ripple across this range. We demonstrate the use of this package to extract the loss tangent of superconducting ring resonators, measuring a value of (1.10 +- 0.09) x 10^-6, which agrees with measurements of lambda/4 resonators in wirebond-based packaging. This high-throughput measurement system will allow the rapid generation of large datasets for improving superconducting qubit performance, and facilitate time-sensitive surface passivation and oxide regrowth studies.
Cryogenic microwave measurement of superconducting quantum devices is complicated by the packaging required to connect devices to control and readout circuitry. In this work, we outline the design and experimental demonstration of a wirebond-free, PCB-free, drop-in microwave package for on-chip superconducting quantum devices. The package is composed of a superconducting aluminum cavity with a suspended tungsten transmission pin. The fundamental package cavity mode is far detuned from the 4 GHz to 8 GHz band of interest, and the pin transmission exhibits less than 3 dB of ripple across this range. We demonstrate the use of this package to extract the loss tangent of superconducting ring resonators, measuring a value of (1.10 +- 0.09) x 10^-6, which agrees with measurements of lambda/4 resonators in wirebond-based packaging. This high-throughput measurement system will allow the rapid generation of large datasets for improving superconducting qubit performance, and facilitate time-sensitive surface passivation and oxide regrowth studies.
Cryogenic microwave measurement of superconducting quantum devices is complicated by the packaging required to connect devices to control and read out circuitry. In this work, we outline the design and experimental demonstration of a wirebond-free, PCB-free, drop-in microwave package for on-chip superconducting quantum devices. Once a chip is prepared for installation, the proposed package enables device exchange in about 1 min, with no special equipment required. The package is composed of a superconducting aluminum enclosure with a suspended tungsten transmission pin which couples to on-chip resonators in a hanger-style geometry, enabling broadband transmission measurements without on-chip feedlines or wirebonds. The fundamental package cavity mode is far detuned from the 4 to 8 GHz band of interest and does not participate in resonator readout. We demonstrate the use of this package to extract the loss tangent of superconducting ring resonators, measuring a value of (1.10±0.09)×10−6, which agrees with measurements of λ/4 resonators in wirebond-based packaging. This high-throughput measurement system will allow the rapid generation of large datasets for improving superconducting qubit performance, and facilitate time-sensitive surface passivation and oxide regrowth studies.
Measuring the losses arising from different materials and interfaces is crucial to improving the coherence of superconducting quantum circuits. Although this has been of interest for a long time, current studies can either only provide bounds to those losses, or require several devices for a complete characterization. In this work, we introduce a method to measure the microwave losses of materials and interfaces with a single multi-mode superconducting resonator. We demonstrate a formalism for analyzing the loss sensitivity of multi-mode systems and discuss the design strategies of multi-mode resonators for material loss studies. We present two types of multi-mode superconducting resonators for the study of bulk superconductors: the forky whispering-gallery-mode resonator (FWGMR) and the ellipsoidal cavity. We use these resonators to measure the surface dielectric, conductor, and seam losses of high-purity (5N5) aluminum and aluminum alloy (6061), as well as how they are affected by chemical etching, diamond turning, and thin-film coating. We find that chemical etching and diamond turning reduce both the surface dielectric and conductive losses of high-purity aluminum, but provide no appreciable improvement to the seam. Coating the surfaces of diamond-turned aluminum alloys with e-beam evaporated or sputtered aluminum thin-films significantly reduces all three losses under study. In addition, we study the effect of chemical etching on the surface of high-purity aluminum using transmission electron microscopy (TEM) and find that the chemical etching process creates a thinner and more uniform oxide layer, consistent with the observed improvement in the surface dielectric loss.
Microwave filtering for superconducting qubits is a key element of quantum computing technology, enabling high coherence and fast state detection. This work presents the design and implementation of novel microwave Purcell filters for superconducting quantum circuits, integrated within a multilayer printed circuit board (PCB). The off-chip design removes all filter components from the qubit substrate, reducing device complexity, improving layout footprint and allowing better scalability to large qubit counts. Each embedded filter can couple up to nine readout resonators, enabling efficient multiplexed readout. Electromagnetic simulations of the filter predict a thousand-fold improvement in qubit isolation from the readout port. The design was experimentally validated under cryogenic conditions in conjunction with a 35-qubit device, demonstrating compatibility of the PCB-based filter with high-coherence superconducting qubits. The comparison of the measured qubit median T1 of 84 μs with the expected radiative limit from electromagnetic simulations validated the presence of Purcell filtering in the system.
Variable microwave-frequency couplers are highly useful components in classical communication systems and likely will play an important role in quantum communication applications. Conventional semiconductor-based microwave couplers have been used with superconducting quantum circuits, enabling, for example, the in situ measurements of multiple devices via a common readout chain. However, the semiconducting elements are lossy and furthermore dissipate energy when switched, making them unsuitable for cryogenic applications requiring rapid, repeated switching. Superconducting Josephson junction-based couplers can be designed for dissipation-free operation with fast switching and are easily integrated with superconducting quantum circuits. These enable on-chip, quantum-coherent routing of microwave photons, providing an appealing alternative to semiconductor switches. Here, we present and characterize a chip-based broadband microwave variable coupler, tunable over 4–8 GHz with over 1.5 GHz instantaneous bandwidth, based on the superconducting quantum interference device with two parallel Josephson junctions. The coupler is dissipation-free and features large on-off ratios in excess of 40 dB, and the coupling can be changed in about 10 ns. The simple design presented here can be readily integrated with superconducting qubit circuits and can be easily generalized to realize a four- or more port device.
Resonators and qubits with a niobium (Nb) base metal layer achieve some of the highest coherence times in superconducting quantum devices. The performance of such devices is often limited by loss associated with two-level systems, which are found primarily at material surfaces and interfaces. The metal-air (MA) interface is a major contributor to device loss. In this work, we develop a fast-sealing microwave cavity that enables devices to be placed under vacuum within five minutes of oxide removal, thereby significantly reducing the MA interface loss compared to common device processing and packaging approaches. Using coplanar stripline resonators, we demonstrate that devices sealed in such a cavity exhibit internal quality factors exceeding one million at single-photon power. After re-exposure to air, the devices show downward resonance frequency shifts and quality factor degradations, quantitatively consistent with a model of Nb oxide regrowth. The fast-sealing microwave cavity provides a practical and consistent method to mitigate MA interface loss and sustain high coherence in Nb devices, and establishes a controlled platform for studying metal oxide regrowth kinetics and dielectric properties, the understanding of which is critical to achieving high coherence in superconducting quantum devices.
A promising way to store quantum information is by encoding it in the bosonic excitations of microwave resonators. This provides for long coherence times, low dephasing rates, as well as a hardware-efficient approach to quantum error correction. There are two main methods used to make superconducting microwave resonators: by traditionally machining them out of bulk material and by lithographically fabricating them on a chip in thin film. 3D resonators have few loss channels and larger mode volumes, and therefore smaller participations in the lossy parts, but it can be challenging to achieve high material quality. On-chip resonators can use low-loss thin films, but they confine the field more tightly, resulting in higher participations and additional loss channels from the dielectric substrate. In this work, we present a design in which a dielectric scaffold supports a thin-film conductor within a 3D package, thus combining the low surface participations of bulk-machined cavities with high quality and control over materials of thin-film circuits. By incorporating a separate chip containing a transmon qubit, we realize a quantum memory and measure single-photon lifetimes in excess of a millisecond. This hybrid 3D architecture has several advantages for scaling as it relaxes the importance of the package and permits modular construction with separately replaceable qubit and resonator devices.