arXiv:2409.16097 · Journal of Experimental and Theoretical Physics Letters
Effect of Etching Methods on Dielectric Losses in Transmons
T. A. Chudakova, Grigoriy S. Mazhorin, I. V. Trofimov, N. Yu. Rudenko, Alexander M. Mumlyakov, Alena S. Kazmina, Elena Yu. Egorova, P. A. Gladilovich, M. V. Chichkov, Nataliya Maleeva, Michael A. Tarkhov, Vladimir I. Chichkov
Superconducting qubits are considered as a promising platform for implementing a fault tolerant quantum computing. However, surface defects of superconductors and the substrate leading to qubit state decoherence and fluctuations in qubit parameters constitute a significant problem. The amount and type of defects depend both on the chip materials and fabrication procedure. In this work, transmons produced by two different methods of aluminum etching: wet etching in a solution of weak acids and dry etching using a chlorine-based plasma are experimentally studied. The relaxation and coherence times for dry-etched qubits are more than twice as long as those for wet-etched ones. Additionally, the analysis of time fluctuations of qubit frequencies and relaxation times, which is an effective method to identify the dominant dielectric loss mechanisms, i-ndicates a significantly lower impact of two-level systems in the dry-etched qubits compared to the wet-etched ones.
Superconducting qubits are considered as a promising platform for implementing a fault tolerant quantum computing. However, surface defects of superconductors and the substrate leading to qubit state decoherence and fluctuations in qubit parameters constitute a significant problem. The amount and type of defects depend both on the chip materials and fabrication procedure. In this work, transmons produced by two different methods of aluminum etching: wet etching in a solution of weak acids and dry etching using a chlorine-based plasma are experimentally studied. The relaxation and coherence times for dry-etched qubits are more than twice as long as those for wet-etched ones. Additionally, the analysis of time fluctuations of qubit frequencies and relaxation times, which is an effective method to identify the dominant dielectric loss mechanisms, i-ndicates a significantly lower impact of two-level systems in the dry-etched qubits compared to the wet-etched ones.
We present a dry surface treatment combining atomic layer etching and deposition (ALE and ALD) to mitigate dielectric loss in fully fabricated superconducting quantum devices formed from aluminum thin films on silicon. The treatment, performed as a final processing step prior to device packaging, starts by conformally removing the native metal oxide and fabrication residues from the exposed surfaces through ALE, before in situ encapsulating the metal surfaces with a thin dielectric layer using ALD. We measure a 2-fold reduction in loss attributed to two-level system (TLS) absorption in treated aluminum-based resonators and planar transmon qubits. Treated transmons with compact capacitor plates and gaps achieve median transmon quality factor ( Q ) and transmon qubit energy relaxation time ( T 1 ) values of 3.69 ± 0.42 × 10 6 and 196 ± 22 μs, respectively. These improvements were found to be sustained over several months. We discuss how the combination of ALE and ALD reverses fabrication-induced surface damage to significantly and durably improve device performance via a reduction of the TLS defect density in the capacitive elements.
By using the dry etching process of tantalum (Ta) film, we had obtained transmon qubit with the best lifetime (T1) 503 us, suggesting that the dry etching process can be adopted in the following multi-qubit fabrication with Ta film. We also compared the relaxation and coherence times of transmons made with different materials (Ta, Nb and Al) with the same design and fabrication processes of Josephson junction, we found that samples prepared with Ta film had the best performance, followed by those with Al film and Nb film. We inferred that the reason for this difference was due to the different loss of oxide materials located at the metal-air interface.
Superconducting resonator systems, including a superconducting qubit, require exceptional coherence and longevity lifetime performance. However, these systems have been impeded by dielectric loss and quasiparticle loss, many of which have been caused by the materials imperfection [1]. In this work, we report a comparative scanning transmission electron microscopy (S/TEM) investigation of the impacts of wet and dry etching on superconducting Tantalum (Ta) films. This work has been sparked by the critical importance of superconducting resonators in a wide range of quantum technological applications, which necessitates optimizing their fabrications to improve the performance of various quantum devices and communication systems [2]. The primary objective of this work is to understand the morphology, substrate crystallinity degradation, chemical segregation, and strain of etched Ta films, as well as the characteristics of the oxidized sidewalls that can influence the performance and homogeneity of the superconducting device. In the pursuit of deeper insights, advanced characterization techniques such as atomic-resolution STEM imaging, electron energy loss spectroscopy (EELS) chemical mapping, and 4-dimensional STEM (4D STEM) strain mapping were employed. The key findings of this work are the significant variations in sidewall morphology, chemical composition, and strain fields depending on the type of etching employed (wet or dry). The findings suggest that sidewall formation induces localized strain fields in proximity to amorphized oxidation layers of the superconducting resonator sidewalls, which potentially impacting the coherence and homogeneity of the superconducting quantum devices [3]. This study, therefore, emphasizes the need to optimize the morphology of the sidewall to minimize local strain field generation. Additionally, the research underscores the importance of precise and meticulous fabrication in the construction of quantum devices, emphasizing the need for a chemically robust and uniform coating process to protect the resonator film from oxidation and wet etchants without affecting the operation of the superconducting device. These insights are crucial for advancing the performance and coherence of superconducting qubits, ultimately contributing to the optimization of quantum devices and the progress of quantum technologies and high-frequency communication systems [4]. Top-view schematics of Ta superconducting resonators at (a) zoom-out view and (b) zoom-in view. Cross-sectional HAADF STEM images of (c) dry- and (d) wet-etched Ta film on sapphire substrate. These images show the overall dimensions and morphologies of the resonators. The BF STEM images, εxx, εzz, εxz, and ωxz mapping results were virtually reconstructed from 4D STEM for the (a) dry- and (b) wet-etched samples, respectively. The positive (negative) value is represented by the color red (blue) in the colorbar. Lattice elongation (shrinkage), is represented by positive (negative) values in εxx and εzz. Lattice shearing, which has a positive value in εxz, is defined as distortion from the top to the right and the bottom to the left of the lattice. The Ta lattice rotates counterclockwise (clockwise) represented by positive (negative) numbers in ωxz.
Abstract The performance of superconducting qubits is often limited by dissipation and two-level systems (TLS) losses. The dominant sources of these losses are believed to originate from amorphous materials and defects at interfaces and surfaces, likely as a result of fabrication processes or ambient exposure. Here, we explore a novel wet chemical surface treatment at the Josephson junction-substrate and the substrate-air interfaces by replacing a buffered oxide etch (BOE) cleaning process with one that uses hydrofluoric acid followed by aqueous ammonium fluoride. We show that the ammonium fluoride etch process results in a statistically significant improvement in median T 1 by ∼ 22 % (p = 0.002), and a reduction in the number of strongly-coupled TLS in the tunable frequency range. Microwave resonator measurements on samples treated with the ammonium fluoride etch after niobium deposition and etching also show ∼ 33 % lower TLS-induced loss tangent compared to the BOE treated samples. As the chemical treatment primarily modifies the Josephson junction-substrate interface and substrate-air interface, we perform targeted chemical and structural characterizations to examine materials differences at these interfaces and identify multiple microscopic changes that could contribute to decreased TLS losses.
Aluminum (Al) remains the central material for superconducting qubits, and considerable effort has been devoted to optimizing its deposition and patterning for quantum devices. However, post-processing strategies focused on oxide removal of niobium (Nb) and tantalum (Ta) -based resonators using buffered oxide etch (BOE), which can not be used for Al. This challenge becomes particularly relevant for industry-scale fabrication with multi-chip bonding, where delays between sample preparation and cooldown require surface treatments that preserve low dielectric loss during extended exposure to ambient conditions. In this work, we investigate surface modification approaches for Al resonators subjected to a 24-hour delay prior to cryogenic measurement. Passivation using self-limiting oxygen and fluorine chemistries was evaluated utilizing different plasma processes. Remote oxygen plasma treatment reduced dielectric losses, in contrast to direct oxygen plasma. A fluorine-based plasma process was developed that passivated the Al surface for subsequent BOE treatment. However, the fluorine content in the surface resulted in higher loss, identifying fluorine as an unsuitable passivation material for Al resonators. Above all, selective oxide removal using HF (hydrogen fluoride) vapor and phosphoric acid yielded median dielectric losses as low as δ~LP=5.7×10−7 (QLP≈1.7M) with δ~TLS=3.6×10−7 (QTLS≈2.8M) in the single photon regime. Selective oxide removal provides a promising pathway for robust Al-based qubit fabrication, as it preserves low dielectric losses for a 24-hour delay before cooldown.
Superconducting resonators play a pivotal role in various quantum technology applications, such as quantum computing and high-frequency communication systems. The performance of these resonators is closely tied to the properties of the superconducting films used in their fabrication. In this study, we investigated the impact of wet and dry etching on tantalum (Ta) films leveraging advanced scanning transmission electron microscopy-based characterization methods and examined the morphological, chemical, and strain changes caused by the etching processes. Consequently, we report the significant differences between the two etching methods, with dry etching resulting in straight slanted sidewalls and a thinner oxidized layer, while wet etching produced curved sidewalls and undercuts. Both methods led to the formation of a residual Ta wedge at the lower part of the sidewall, causing lattice deformation, which could adversely influence the homogeneous operations of superconducting devices. These insights enhance our understanding of how etching influences superconducting films, offering valuable guidance for optimizing resonators and related devices. Our findings mark a significant stride in advancing quantum technologies and high-frequency communication by enhancing our practical understanding of superconducting material fabrication.