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arXiv:2305.05502 · IEEE Transactions on Quantum Engineering

Experimentally Verified, Fast Analytic, and Numerical Design of Superconducting Resonators in Flip-Chip Architectures

Hang-Xi Li, Daryoush Shiri, Sandoko Kosen, Marcus Rommel, Lert Chayanun, Andreas Nylander, Robert Rehammar, Giovanna Tancredi, Marco Caputo, Kestutis Grigoras, Leif Grönberg, Joonas Govenius, Jonas Bylander

Published Jan 1, 2023• 10 citations
arXivHTMLPDF

Abstract

In superconducting quantum processors, the predictability of device parameters is of increasing importance as many labs scale up their systems to larger sizes in a 3D-integrated architecture. In particular, the properties of superconducting resonators must be controlled well to ensure high-fidelity multiplexed readout of qubits. Here we present a method, based on conformal mapping techniques, to predict a resonator's parameters directly from its 2D cross-section, without computationally heavy and time-consuming 3D simulation. We demonstrate the method's validity by comparing the calculated resonator frequency and coupling quality factor with those obtained through 3D finite-element-method simulation and by measurement of 15 resonators in a flip-chip-integrated architecture. We achieve a discrepancy of less than 2% between designed and measured frequencies, for 6-GHz resonators. We also propose a design method that reduces the sensitivity of the resonant frequency to variations in the inter-chip spacing.

DOI
10.1109/tqe.2023.3302371

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In superconducting quantum processors, the predictability of device parameters is of increasing importance as many labs scale up their systems to larger sizes in a 3D-integrated architecture. In particular, the properties of superconducting resonators must be controlled well to ensure high-fidelity multiplexed readout of qubits. Here we present a method, based on conformal mapping techniques, to predict a resonator's parameters directly from its 2D cross-section, without computationally heavy and time-consuming 3D simulation. We demonstrate the method's validity by comparing the calculated resonator frequency and coupling quality factor with those obtained through 3D finite-element-method simulation and by measurement of 15 resonators in a flip-chip-integrated architecture. We achieve a discrepancy of less than 2% between designed and measured frequencies, for 6-GHz resonators. We also propose a design method that reduces the sensitivity of the resonant frequency to variations in the inter-chip spacing.
Superconducting quantum chips commonly utilize quarter-wavelength (λ/4) transmission line resonators as readout circuits. An analytical model for the accurate determination of resonance frequencies and coupling Q-factors of feedline-coupled superconducting resonators is introduced. The model leverages four-port microwave network analysis, integrating boundary conditions and conformal mapping techniques to compute even- and odd-mode impedances in edge-coupled coplanar waveguide (CPW) structures. Its versatility allows application to both planar and 3-D heterogeneous architectures, making it a powerful tool for resonator design. To validate the model, a test chip with λ/4 resonators of varying geometries is fabricated and measured in a cryogenic environment. Comparisons with finite element method (FEM) simulations and experimental measurements confirm the model's accuracy, with resonance frequencies and coupling Q-factors aligning closely across configurations. This proposed model facilitates the design of superconducting resonators in readout circuits for more effective, scalable, and adaptable quantum computing architectures.
This work presents a comprehensive analytical and simulation-based study of superconducting quantum chip architectures, spanning both 2D planar and 3D-integrated designs. We first design and simulate a planar quantum chip layout using Qiskit Metal, which is imported into Ansys HFSS (High Frequency Structure Simulator) to construct a 3D model and perform electromagnetic simulations. A detailed analysis using Driven Modal, Eigenmode, Magnetostatic, and Q3D Capacitance Extraction solvers ensures our simulations accurately reflect physical behavior. The results are validated against analytical models from microwave engineering. pyEPR (Python Energy Participation Ratio) is used to extract key quantum metrics, including eigenfrequencies, quality factors, decoherence times, anharmonicity, cross-Kerr interactions, and participation ratios. Building on this planar design, we extend our study to a 3D-integrated flip-chip architecture featuring two superconducting qubits fabricated on separate high-resistivity silicon substrates. Using HFSS and analytical modeling, we show that detuned qubits maintain stable eigenfrequencies, quality factors, decoherence times, anharmonicity, and cross-Kerr interactions over varying substrate separation values. However, the introduction of dielectric loss tangents reduces quality factors which degrades coherence times and introduces an additional dephasing. These findings highlight the potential of 3D quantum integration, given minimal material imperfections.The planar and 3D designs together form a cohesive investigation into next-generation quantum hardware, with the 2D layout currently taped-out and under fabrication.
Abstract In multi-qubit superconducting systems utilizing flip-chip technology, achieving high accuracy in resonator frequencies is of paramount importance, particularly when multiple resonators share a common Purcell filter with restricted bandwidth. Nevertheless, variations in inter-chip spacing can considerably influence these frequencies. To tackle this issue, we present and experimentally validate the effectiveness of a resonator design. In our design, we etch portions of the metal on the bottom chip that faces the resonator structure on the top chip. This enhanced design substantially improves frequency stability by a factor of over 3.5 compared to the non-optimized design, as evaluated by the root mean square error of a linear fitting of the observed frequency distribution, which is intended to be linear. This advancement is crucial for successful scale-up and achievement of high-fidelity quantum operations.
In multi-qubit superconducting systems utilizing flip-chip technology, achieving high accuracy in resonator frequencies is of paramount importance, particularly when multiple resonators share a common Purcell filter with restricted bandwidth. Nevertheless, variations in inter-chip spacing can considerably influence these frequencies. To tackle this issue, we present and experimentally validate the effectiveness of a resonator design. In our design, we etch portions of the metal on the bottom chip that faces the resonator structure on the top chip. This enhanced design substantially improves frequency stability by a factor of over 3.5 compared to the non-optimized design, as evaluated by the root mean square error of a linear fitting of the observed frequency distribution, which is intended to be linear. This advancement is crucial for successful scale-up and achievement of high-fidelity quantum operations.
Fast and high-fidelity qubit readout requires strong coupling between the readout resonator and the feedline. However, such coupling unavoidably enhances qubit decay through the Purcell effect. We present a four-pole broadband Purcell filter implemented on a 3D flip-chip platform to overcome this trade-off. The filter provides a flat 1 GHz passband centered at 7.68 GHz and achieves more than 45 dB suppression at typical qubit frequencies. We demonstrate the filter's compatibility with multiplexed readout using a test chip that integrates six floating readout resonators strongly coupled within the passband. The chip is fabricated using a 150 nm Niobium (Nb) thin-film process and characterized at 20 mK in a cryogenic measurement setup. We also develop an analytical model that accurately captures the filter response and determines the resonance frequencies and external quality factors of the floating resonators directly from their physical geometry, enabling rapid circuit synthesis and design optimization. The proposed design is compact and fabrication-tolerant, making it a practical solution for large-scale superconducting quantum processors.
This study primarily investigates variations in the radio-frequency (RF) performance characteristics of components within flip-chip packaged superconducting qubit chips. By comparing changes in the lumped-element parameters of identical qubit chip physical structures across different packaging architectures, we analyze the evolving trends in the qubits' energy dissipation models and nonlinear parameters. Simulation and numerical computation results reveal that the metal layers proximal to the chip surface and the microbumps within the flip-chip architecture significantly impact structural parameters such as the resonant frequency and self-capacitance of resonant elements (including the qubits and readout cavities). This influence manifests as an increase in self-capacitance, consequently leading to an overall decrease in resonant frequency. Furthermore, structures such as the XY/Z control lines and the qubit-readout cavity coupling elements exhibit coupling strength of different change trends due to the altered electromagnetic field distribution within the packaging structure. Additionally, the direction of electromagnetic field leakage during coupling undergoes a change.