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arXiv:2202.04316 · Optics Express

Near perfect two-photon interference out of a down-converter on a silicon photonic chip

Romain Dalidet, Florent Mazeas, Edgars Nitišs, Ozan Yakar, Anton Stroganov, Sébastien Tanzilli, Laurent Labonté, Camille‐Sophie Brès

Published Mar 11, 2022• 17 citations
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Abstract

Integrated entangled photon-pair sources are key elements for enabling large-scale quantum photonic solutions and address the challenges of both scaling-up and stability. Here we report the first demonstration of an energy-time entangled photon-pair source based on spontaneous parametric down-conversion in silicon-based platform–stoichiometric silicon nitride (Si3N4)–through an optically induced second-order (χ(2)) nonlinearity, ensuring type-0 quasi-phase-matching of fundamental harmonic and its second-harmonic inside the waveguide. The developed source shows a coincidence-to-accidental ratio of 1635 for 8 µW pump power. We report two-photon interference with remarkable near-perfect visibility of 99.36±1.94%, showing high-quality photonic entanglement without excess background noise. This opens a new horizon for quantum technologies requiring the integration of a large variety of building functionalities on a single chip.

DOI
10.1364/oe.451621

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Integrated entangled photon-pair sources are key elements for enabling large-scale quantum photonic solutions and address the challenges of both scaling-up and stability. Here we report the first demonstration of an energy-time entangled photon-pair source based on spontaneous parametric down-conversion in silicon-based platform–stoichiometric silicon nitride (Si3N4)–through an optically induced second-order (χ(2)) nonlinearity, ensuring type-0 quasi-phase-matching of fundamental harmonic and its second-harmonic inside the waveguide. The developed source shows a coincidence-to-accidental ratio of 1635 for 8 µW pump power. We report two-photon interference with remarkable near-perfect visibility of 99.36±1.94%, showing high-quality photonic entanglement without excess background noise. This opens a new horizon for quantum technologies requiring the integration of a large variety of building functionalities on a single chip.
Abstract Entangled photon pairs from spontaneous parametric down-conversion (SPDC) 1 are central to many quantum applications 2–6 . SPDC is typically performed in non-centrosymmetric systems 7 with an inherent second-order nonlinearity ( χ (2) ) 8–10 . We demonstrate strong narrowband SPDC with an on-chip rate of 0.8 million pairs per second in Si 3 N 4 . Si 3 N 4 is the pre-eminent material for photonic integration and also exhibits the lowest waveguide loss (which is essential for integrated quantum circuits). However, being amorphous, silicon nitride lacks an intrinsic χ (2) , which limits its role in photonic quantum devices. We enabled SPDC in Si 3 N 4 by combining strong light-field enhancement inside a high optical Q -factor microcavity with an optically induced space-charge field. We present narrowband photon pairs with a high spectral brightness. The quantum nature of the down-converted photon pairs is verified through coincidence measurements. This light source, based on Si 3 N 4 integrated photonics technology, unlocks new avenues for quantum systems on a chip.
Quantum-photonic chips, which integrate quantum light sources alongside active and passive optical elements, as well as single-photon detectors, show great potential for photonic quantum information processing and quantum technology. Mature semiconductor nanofabrication processes allow for scaling such photonic integrated circuits to on-chip networks of increasing complexity. Second-order nonlinear materials are the method of choice for generating photonic quantum states in the overwhelming majority of linear optic experiments using bulk components, but integration with waveguide circuitry on a nanophotonic chip proved to be challenging. Here, we demonstrate such an on-chip parametric down-conversion source of photon pairs based on second-order nonlinearity in an aluminum-nitride microring resonator. We show the potential of our source for quantum information processing by measuring the high visibility anti-bunching of heralded single photons with nearly ideal state purity. Our down-conversion source yields measured coincidence rates of 80 Hz, which implies MHz generation rates of correlated photon pairs. Low noise performance is demonstrated by measuring high coincidence-to-accidental ratios. The generated photon pairs are spectrally far separated from the pump field, providing great potential for realizing sufficient on-chip filtering and monolithic integration of quantum light sources, waveguide circuits and single-photon detectors. A chip-based source of photon pairs for applications in quantum information processing has been built by a team of scientists in the US. Xiang Guo and co-workers from Yale University built the quantum light source from an aluminum nitride microring resonator. The strong second-order nonlinearity of the aluminum nitride yields efficient parametric down-conversion. This allows 775-nm-wavelength pump photons to be converted into a pair of entangled photons in the telecommunications window of 1550 nm. Tests indicated that the heralded photons generated by the microring source are anti-bunched and have high visibility and a high purity of state, indicating that they are highly suitable for use in quantum optics experiments. In principle, the on-chip source is compatible with megahertz generation rates and large-scale manufacture of integrated optical circuits.
Hybrid photonic devices, harnessing the advantages of multiple materials while mitigating their respective weaknesses, represent a promising solution to the effective on-chip integration of generation and manipulation of non-classical states of light encoding quantum information. We demonstrate a hybrid III-V/Silicon quantum photonic device combining the strong second-order nonlinearity and compliance with electrical pumping of the III-V semiconductor platform with the high maturity and CMOS compatibility of the silicon photonic platform. Our device embeds the spontaneous parametric down-conversion (SPDC) of photon pairs into an Al-GaAs source and their subsequent routing to a silicon-on-insulator circuitry. This enables the on-chip generation of broadband telecom photon pairs by type 0 and type 2 SPDC from the hybrid device, at room temperature and with strong rejection of the pump beam. Two-photon interference with 92% visibility proves the high energy-time entanglement quality characterizing the produced quantum state, thereby enabling a wide range of quantum information applications.
The demand for integrated photonic chips combining the generation and manipulation of quantum states of light is steadily increasing, driven by the need for compact and scalable platforms for quantum information technologies. While photonic circuits with diverse functionalities are being developed in different single material platforms, it has become crucial to realize hybrid photonic circuits that harness the advantages of multiple materials while mitigating their respective weaknesses, resulting in enhanced capabilities. Here, we demonstrate a hybrid III-V/Silicon quantum photonic device combining the strong second-order nonlinearity and direct bandgap of the III-V semiconductor platform with the high maturity and CMOS compatibility of the silicon photonic platform. Our device embeds the spontaneous parametric down-conversion (SPDC) of photon pairs into an AlGaAs source and their vertical routing to an adhesively-bonded silicon-on-insulator circuitry, within an evanescent coupling scheme managing both polarization states. This enables the on-chip generation of broadband (> 40 nm) telecom photons by type 0 and type 2 SPDC from the hybrid device, at room temperature and with internal pair generation rates exceeding 10510^5105 s−1s^{-1}s−1 for both types, while the pump beam is strongly rejected. Two-photon interference with 92% visibility (and up to 99% upon 5 nm spectral filtering) proves the high energy-time entanglement quality of the produced quantum state, thereby enabling a wide range of quantum information applications on-chip, within an hybrid architecture compliant with electrical pumping and merging the assets of two mature and highly complementary platforms in view of out-of-the-lab deployment of quantum technologies.
The demand for integrated photonic chips combining the generation and manipulation of quantum states of light is steadily increasing, driven by the need for compact and scalable platforms for quantum information technologies. While photonic circuits with diverse functionalities are being developed in different single material platforms, it has become crucial to realize hybrid photonic circuits that harness the advantages of multiple materials while mitigating their respective weaknesses, resulting in enhanced capabilities. Here, we demonstrate a hybrid III-V/silicon quantum photonic device combining the strong second-order nonlinearity and direct band gap of the III-V semiconductor platform with the high maturity and CMOS compatibility of the silicon photonic platform. Our device embeds the spontaneous parametric down-conversion (SPDC) of photon pairs into an Al Ga As source and their vertical routing to an adhesively bonded silicon-on-insulator circuitry, within an evanescent coupling scheme managing both polarization states. This enables the on-chip generation of broadband ( > 40 nm) telecom photons by type-0 and type-2 SPDC from the hybrid device, at room temperature and with internal pair generation rates exceeding 10 5 s − 1 for both types, while the pump beam is strongly rejected. Two-photon interference with 92% visibility (and up to 99% upon 5-nm spectral filtering) proves the high energy-time entanglement quality of the produced quantum state, thereby enabling a wide range of quantum information applications on chip, within a hybrid architecture compliant with electrical pumping and merging the assets of two mature and highly complementary platforms in view of out-of-the-lab deployment of quantum technologies. Published by the American Physical Society 2024