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arXiv:1011.4982 · Superconductor Science and Technology

Wirebond crosstalk and cavity modes in large chip mounts for superconducting qubits

J. Wenner, M Neeley, Radoslaw C Bialczak, M Lenander, Erik Lucero, A D O’Connell, D Sank, H Wang, Martin P. Weides, A N Cleland, John M. Martinis

Published Mar 25, 2011• 80 citations
arXivHTMLPDF

Abstract

We analyze the performance of a microwave chip mount that uses wirebonds to connect the chip and mount grounds. A simple impedance ladder model predicts that transmission crosstalk between two feedlines falls off exponentially with distance at low frequencies, but rises to near unity above a resonance frequency set by the chip to ground capacitance. Using SPICE simulations and experimental measurements of a scale model, the basic predictions of the ladder model were verified. In particular, by decreasing the capacitance between the chip and box grounds, the resonance frequency increased and transmission decreased. This model then influenced the design of a new mount that improved the isolation to − 65 dB at 6 GHz, even though the chip dimensions were increased to 1 cm × 1 cm, three times as large as our previous devices. We measured a coplanar resonator in this mount as preparation for larger qubit chips, and were able to identify cavity, slotline, and resonator modes.

DOI
10.1088/0953-2048/24/6/065001

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We analyze the performance of a microwave chip mount that uses wirebonds to connect the chip and mount grounds. A simple impedance ladder model predicts that transmission crosstalk between two feedlines falls off exponentially with distance at low frequencies, but rises to near unity above a resonance frequency set by the chip to ground capacitance. Using SPICE simulations and experimental measurements of a scale model, the basic predictions of the ladder model were verified. In particular, by decreasing the capacitance between the chip and box grounds, the resonance frequency increased and transmission decreased. This model then influenced the design of a new mount that improved the isolation to − 65 dB at 6 GHz, even though the chip dimensions were increased to 1 cm × 1 cm, three times as large as our previous devices. We measured a coplanar resonator in this mount as preparation for larger qubit chips, and were able to identify cavity, slotline, and resonator modes.
Cryogenic microwave measurement of superconducting quantum devices is complicated by the packaging required to connect devices to control and read out circuitry. In this work, we outline the design and experimental demonstration of a wirebond-free, PCB-free, drop-in microwave package for on-chip superconducting quantum devices. Once a chip is prepared for installation, the proposed package enables device exchange in about 1 min, with no special equipment required. The package is composed of a superconducting aluminum enclosure with a suspended tungsten transmission pin which couples to on-chip resonators in a hanger-style geometry, enabling broadband transmission measurements without on-chip feedlines or wirebonds. The fundamental package cavity mode is far detuned from the 4 to 8 GHz band of interest and does not participate in resonator readout. We demonstrate the use of this package to extract the loss tangent of superconducting ring resonators, measuring a value of (1.10±0.09)×10−6, which agrees with measurements of λ/4 resonators in wirebond-based packaging. This high-throughput measurement system will allow the rapid generation of large datasets for improving superconducting qubit performance, and facilitate time-sensitive surface passivation and oxide regrowth studies.
Superconducting quantum chips commonly utilize quarter-wavelength (λ/4) transmission line resonators as readout circuits. An analytical model for the accurate determination of resonance frequencies and coupling Q-factors of feedline-coupled superconducting resonators is introduced. The model leverages four-port microwave network analysis, integrating boundary conditions and conformal mapping techniques to compute even- and odd-mode impedances in edge-coupled coplanar waveguide (CPW) structures. Its versatility allows application to both planar and 3-D heterogeneous architectures, making it a powerful tool for resonator design. To validate the model, a test chip with λ/4 resonators of varying geometries is fabricated and measured in a cryogenic environment. Comparisons with finite element method (FEM) simulations and experimental measurements confirm the model's accuracy, with resonance frequencies and coupling Q-factors aligning closely across configurations. This proposed model facilitates the design of superconducting resonators in readout circuits for more effective, scalable, and adaptable quantum computing architectures.
Cryogenic microwave measurement of superconducting quantum devices is complicated by the packaging required to connect devices to control and readout circuitry. In this work, we outline the design and experimental demonstration of a wirebond-free, PCB-free, drop-in microwave package for on-chip superconducting quantum devices. The package is composed of a superconducting aluminum cavity with a suspended tungsten transmission pin. The fundamental package cavity mode is far detuned from the 4 GHz to 8 GHz band of interest, and the pin transmission exhibits less than 3 dB of ripple across this range. We demonstrate the use of this package to extract the loss tangent of superconducting ring resonators, measuring a value of (1.10 +- 0.09) x 10^-6, which agrees with measurements of lambda/4 resonators in wirebond-based packaging. This high-throughput measurement system will allow the rapid generation of large datasets for improving superconducting qubit performance, and facilitate time-sensitive surface passivation and oxide regrowth studies.
We investigate measurement crosstalk in a system with two flux-biased phase qubits coupled by a resonant coplanar waveguide cavity. After qubit measurement, the superconducting phase undergoes damped oscillations in a deep anharmonic potential producing a frequency chirped voltage or crosstalk signal. We show experimentally that a coplanar waveguide cavity acts as a bandpass filter that can significantly reduce the propagation of this crosstalk signal when the qubits are far off resonance from the cavity. The transmission of the crosstalk signal $\ensuremath{\propto}{({\ensuremath{\omega}}_{q}{C}_{x})}^{2}$ can be further minimized by reducing the qubit frequencies and the coupling capacitance to the cavity. We model the large amplitude crosstalk signal and qubit response classically with results that agree well with the experimental data. We find that the maximum energy transferred by the crosstalk generating qubit roughly saturates for long energy relaxation times (T1>100 ns)({T}_{1}>100\text{ }\text{ns})(T1​>100 ns) while the delay time necessary for the crosstalk signal to propagate to the cavity scales linearly with T1{T}_{1}T1​. Ultimately, the use of resonant cavities as coupling elements and crosstalk filters is extremely beneficial for future architectures incorporating many coupled qubits.
The increasing size of superconducting quantumcomputer chips requires a shift in evaluation methods for chip design. Three-dimensional (3D) electromagnetic (EM) simulations become computationally intractable as model size increases owing to the exponential growth in computation time. To address this challenge, we develop a technique that analyzes the circuit parameters of large-scale superconducting qubit chips by combining S-parameters simulated in smaller-scale 3D EM models. Herein, we design a four-qubit unit cell for large-scale qubit devices and evaluate both residual qubit-qubit coupling and control-line-to-qubit crosstalk for distant qubit pairs. In addition, we propose guard structures around qubits to mitigate nearestneighbor crosstalk. Although previous methods are limited to chips with at most ten qubits, our approach enables the analysis of systems with over a hundred qubits.
As superconducting quantum processors scale to large qubit counts, unwanted microwave drive crosstalk becomes an important source of coherent errors. Here, we investigate the role of parasitic coupling paths in the suppression of drive crosstalk in a processor with two fixed-frequency transmon qubits and a tunable coupler. To account for the many different coupling paths, we develop a detailed circuit model to capture the dependence of crosstalk on the coupler frequency. We experimentally demonstrate suppression of crosstalk, finding that the suppression does not originate solely from cancellation of the effective qubit-qubit coupling, but also is a result of interference between other coupling paths. Building on these insights, we show that drive crosstalk can be suppressed with the right choice of parasitic capacitances, which otherwise often are treated as unwanted design imperfections. Our results provide practical guidance for low-crosstalk device design of superconducting quantum processors and point toward a broader strategy in which parasitic coupling paths are engineered rather than simply minimized.