Smart Materials and Devices

Recent advances in photonic integrated chips for quantum key distribution: Protocol requirements and system deployment

Jin You, Xia Yin, Songrui Yang, Chuqiao Hu, Pengle Cheng, Junming An

Published Jan 1, 2026• 0 citations

Abstract

Quantum key distribution (QKD) is moving from laboratory demonstrations toward network deployment, and integrated photonic chips provide a hardware route for compact, stable and scalable systems. This review summarizes progress in integrated photonic chips for QKD from protocol requirements to deployable systems. It first examines how decoy-state BB84, measurement-device-independent QKD (MDI-QKD), twin-field QKD (TF-QKD), continuous-variable QKD (CV-QKD) and device-independent QKD (DI-QKD) constrain chip metrics such as loss, modulation accuracy, state indistinguishability, phase stability, synchronization and security monitoring. It then compares planar lightwave circuit (PLC), silicon photonics, silicon nitride, thin-film lithium niobate, indium phosphide (InP) and heterogeneous platforms in terms of routing loss, modulation speed, stable interference, source integration and detector interfaces. Transmitter and receiver architectures, coherent detection, single-photon detection interfaces and on-chip monitoring are discussed as system-level building blocks. The review further analyses phase stability, packaging coupling, thermal management, polarization control, network coexistence and reliability, emphasizing that deployable QKD chips must remain calibratable and compatible with security models under realistic operation. Finally, system demonstrations, network deployment and practical security are discussed within a unified evaluation framework. Throughout, we argue that integration benefits QKD only when compact routing, stable interference, calibration access and manufacturable packaging jointly keep the device inside the assumptions of its security proof; accordingly, chip performance should be judged by mapped, calibratable security parameters rather than by integration density alone.

DOI: 10.70401/smd.2026.0062

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