Metrology, Inspection, and Process Control XXXVI
Exploration of quantum entanglement technologies for semiconductor inspection: practical applications and future directions
Yasunori Furukawa, Tetsuya Nishimura, Masafumi Asano, Masayoshi Arai, Yu Mukai, Ryo Okamoto, Shigeki Takeuchi
Abstract
This paper explores the use of photonic quantum sensing - specifically, quantum infrared spectroscopy (QIRS) - as a novel approach for inspecting devices fabricated on silicon wafers. By employing entangled photon pairs, QIRS enables infrared spectroscopy using solely a visible light source and a visible detector and is anticipated to realize substantial miniaturization and cost reduction in the future. We developed a QIRS system employing the sample as a reflector for the probe idler photons and successfully acquired the infrared reflection spectra from a single surface of a silicon wafer, demonstrating consistency with its refractive index. Furthermore, we successfully evaluated High Aspect Ratio Contact (HARC) pattern using QIRS, marking the first accurate infrared reflectivity assessment in semiconductor fabrication. This advancement paves the way for widespread practical applications.