Modular quantum computing chips

Zeising, Michael

Quantum computers promise exponential speedups over classical computers for a specific set of problems, yet scaling quantum systems to the sizes required for practical applications remains a major challenge. Multi-chip architectures promise improved scalability and reduced per-chip complexity by interconnecting quantum processors via quantum links. The performance of these interconnects is a key factor determining overall system performance and, ultimately, the feasibility of modular quantum computing. This master's thesis investigates the modeling and analysis of link-layer protocols for multi-chip quantum computers. In this work, various protocols for communication and interaction between chips are modeled, including Teledata, Telegate, and entanglement swapping. The impact of different architectural decisions like the number of qubits per chip and the speed of the classical network on overall performance is analyzed using detailed timing models. The results show that the choice of architecture, network speed, and selected communication protocols have a significant impact on execution time. These findings provide important insights into the scalability of future quantum computing architectures.

Vladimír Bužek, Mark S. Hillery, Mário Ziman +1 more

Laurie Donaldson

Matthew E. Trusheim, Michael E. Walsh, Eric A. Bersin +7 more

Atom-like quantum emitters in diamond have emerged as leading spin-photon interfaces for quantum networks. This talk discusses the development of chip-based architectures to control large numbers of such artificial atoms for applications in quantum networks and modular quantum computing.

Sahar Ben Rached, Sergio Navarro Reyes, Junaid Khan +3 more

Modularity is a promising approach for scaling up quantum computers and therefore integrating higher qubit counts. The essence of such architectures lies in their reliance on high-fidelity and fast quantum state transfers enabled by generating entanglement between chips. In addressing the challenge of implementing quantum coherent communication channels to interconnect quantum processors, various techniques have been proposed to account for qubit technology specifications and the implemented communication protocol. By employing Design Space Exploration (DSE) methodologies, this work presents a comparative analysis of the cavity-mediated interconnect technologies according to a defined figure of merit, and we identify the configurations related to the cavity and atomic decay rates as well as the qubit-cavity coupling strength that meet the efficiency thresholds. We therefore contribute to benchmarking contemporary cavity-mediated quantum interconnects and guide the development of reliable and scalable chip-to-chip links for modular quantum computers.

Hansika Weerasena, Prabhat Mishra