High-dimensional time-bin analyzers are essential for characterizing quantum states in photonic systems. We present advancements in fiber- and chip-based platforms for generating and analyzing time-bin entanglement, emphasizing ultrastable fiber architectures, scalable quantum key distribution, and post-selection-free measurements, enabling robust and scalable quantum communication and processing.
High-dimensional time-bin analyzers are essential for characterizing quantum states in photonic systems. We present advancements in fiber- and chip-based platforms for generating and analyzing time-bin entanglement, emphasizing ultrastable fiber architectures, scalable quantum key distribution, and post-selection-free measurements, enabling robust and scalable quantum communication and processing.
The development of integrated photonic systems, both on-chip and fiber-based, has transformed quantum photonics by replacing bulky, fragile free-space optical setups with compact, efficient, and robust circuits. Photonic platforms incorporating fiber-connected sources of correlated and entangled photon pairs offer practical advantages, such as operation at room temperature, efficient integration with telecom infrastructure, and compatibility with mature and efficient semiconductor fabrication processes for cost-effective and large-scale optical circuits. The stability and scalability of integrated quantum photonics platforms have facilitated the generation and processing of quantum information in the temporal domain within a single spatial mode. Time-bin encoded states, known for their robustness against decoherence and compatibility with existing fiber-optic infrastructure, have shown to be an efficient paradigm for advanced applications like quantum secure communication, information processing, spectroscopy, imaging, and sensing. This review examines recent advancements in fiber- and chip-based platforms for generating non-classical states and their applications as quantum state processors in the time domain. We discuss the generation of pulsed quantum frequency combs using microring resonators and intra-cavity mode-locked laser schemes, enabling co- and cross-polarized quantum photonic states. Additionally, the versatility of these resonator chips for entanglement generation is emphasized, including two- and multi-photon time-bin entangled schemes. We highlight the development of time-bin entanglement analyzers in fiber architectures, featuring ultrahigh stability and post-selection-free capabilities, which enable precise and efficient characterization of two- and higher-dimensional time-bin entanglement. We also review scalable on-chip schemes for quantum key distribution, demonstrating low quantum bit error rates and compatibility with higher-dimensional quantum communication protocols. Further, methods for enhancing temporal resolution in detection schemes, crucial for time-bin encoding, are presented, such as the time-stretch sampling technique using electro-optic modulation. These innovations, relying on readily available, telecom-based fiber-optic components, provide practical, scalable, and cost-effective solutions for advancing quantum photonic technologies. Looking forward, time-bin encoding is expected to play a pivotal role in the advancement of quantum repeaters, distributed quantum networks, and hybrid light-matter systems, advancing the realization of globally scalable quantum technologies.
Quantum photonic resources are critical for advanced applications such as quantum computation, communication, and information processing. Efficient generation and detection of quantum states, as well as reliable photon manipulation techniques, are essential for the development of practical quantum technologies. Integrated photonic platforms offer attractive solutions due to their stability, small device footprint, and improved power efficiencies. However, optical loss and environmental noise hinder their capability to transmit, measure, and detect quantum states with high accuracies. To tackle these limitations, we have developed robust solutions for quantum signal processing by leveraging infrastructures from telecommunications and integrated photonics. These approaches focus on the use of silicon-based photonic sources for entanglement generation in the time and frequency degrees of freedom, as well as chip- and fiber-based architectures for entanglement verification via quantum interference and tomography measurements. Our photonic schemes allow for high-dimensional entanglement processing, demonstrating their versatility in developing scalable and cost-efficient quantum signal processing platforms.
Encoding information in time-bin entangled photonic systems enables the implementation of quantum technologies that are compatible with both integrated and fiber frameworks. Extending such an encoding to high-dimensional (qudit) time-bin entanglement provides a tool towards scaling the information capacity, noise resilience, and scalability of information processing. Here, we demonstrate scalable time-bin entangled qudits in a programmable photonic chip, as well as in a fully fibered coupled loop system.
Many quantum communication protocols rely on the distribution of entanglement between the different participating parties. One example is quantum key distribution (QKD), an application that has matured to commercial use in recent years. However, difficulties remain, especially with noise resilience and channel capacity in long-distance communication. One way to overcome these problems is to use high-dimensional entanglement, which has been shown to be more robust to noise and enables higher secret-key rates. It is therefore important to have access to certifiable high-dimensional entanglement sources to confidently implement these advanced QKD protocols. Here we develop a method for certifying high-dimensional time-bin entanglement in fiber-loop systems. In these systems, entanglement creation and detection can utilize the same physical components, and the number of time bins, and thus the entanglement dimension, can be adapted without making physical changes to the setup. Our certification method builds on previous proposals for the certification of angular-momentum entanglement in photon pairs. In particular, measurements in only two experimentally accessible bases are sufficient to obtain a lower bound on the entanglement dimension for both two- and multiphoton quantum states. Numerical simulations show that the method is robust against typical experimental noise effects and works well even with limited measurement statistics, thus establishing time-bin encoded photons as a promising platform for high-dimensional quantum-communication protocols.
Abstract High-dimensional quantum entanglement is an important resource for emerging quantum technologies such as quantum communication and quantum computation. The scalability of metres-long experimental setups limits high-dimensional entanglement in bulk optics. Advancements in quantum technology hinge on reproducible, and reconfigurable quantum devices—including photon sources, which are challenging to achieve in a scalable manner using bulk optics. Advances in nanotechnology and CMOS-compatible integration techniques have enabled the generation of entangled photons on millimeter-scale chips, significantly enhancing scalability, stability, replicability, and miniaturization for real-world quantum applications. In recent years we have seen several chip-scale demonstrations with different discrete degrees of freedom including path, frequency-bin, time-bin, and transverse modes, on many material platforms. A complete quantum photonic integrated circuit requires the generation, manipulation, and detection of quantum states, involving various active and passive quantum photonic components which further increase the degree of complexity. Here, we focus on the high-dimensional versions of qubits—qudits—and review the nonlinear optical processes that facilitate on-chip high-dimensional entangled photon sources, and the currently used material platforms. We discuss a range of current implementations of on-chip high-dimensional entangled photon sources and demonstrated applications. We comment on the current challenges due to the limitations of individual material platforms and present future opportunities in hybrid and heterogeneous integration strategies for the next generation of integrated quantum photonic chips.
High-dimensional photonic entanglement holds significant promise for advancing quantum communication, computation, and metrology. For example, large-alphabet quantum communication protocols are known to benefit from enhanced noise resilience and information capacity via multi-bit time-bin encoding. Yet, characterizing high-dimensional entangled states is challenging, as full state tomography becomes prohibitively costly and often requires unrealizable measurements. Here, we demonstrate a scan-free method to characterize high-dimensional entanglement in the time-frequency domain. Our reconstruction achieves a record 5.70±0.07 ebits and a fidelity of 65.4±0.4% with the maximally entangled state of local dimension 1021, certifying the presence of 668-dimensional entanglement. We further prove the attainability of a secure key rate of 15.6 kB/s in a composable finite-size, entanglement-based protocol, and show that in continuous operation, the setup can quickly approach asymptotic key rates. Using commercial telecom components and state-of-the-art low-jitter single-photon detectors, our scalable architecture offers a practical path towards high-rate, noise-resilient quantum communication testbeds.