With massive improvements in device coherence times and gate fidelity over the past two decades, superconducting quantum devices have emerged as a leading technology platform for next generation quantum computing. While many of these improvements have been driven through optimized device designs and geometries, the presence of defects, impurities, interfaces, and surfaces in the constituent materials continue to limit performance and present a critical barrier in achieving scalable quantum systems with long coherence times. As part of the Superconducting Quantum Materials and Systems (SQMS) center, we have applied state-of-the-art materials characterization techniques, such as scanning/transmission electron microscopy, secondary ion mass spectrometry, and atom probe tomography, to identify structural defects and chemical inhomogeneities in superconducting qubits. In this review, we discuss the findings of these efforts as they relate to the inherent surfaces, interfaces, impurities, and defects in superconducting qubits. Through this comprehensive investigation, we provide insight into possible sources of dissipation in these systems. Further, we supplement these findings with potential strategies for mitigating these undesired features in an effort to systematically and intelligently improve the coherence times of superconducting qubits.
With massive improvements in device coherence times and gate fidelity over the past two decades, superconducting quantum devices have emerged as a leading technology platform for next generation quantum computing. While many of these improvements have been driven through optimized device designs and geometries, the presence of defects, impurities, interfaces, and surfaces in the constituent materials continue to limit performance and present a critical barrier in achieving scalable quantum systems with long coherence times. As part of the Superconducting Quantum Materials and Systems (SQMS) center, we have applied state-of-the-art materials characterization techniques, such as scanning/transmission electron microscopy, secondary ion mass spectrometry, and atom probe tomography, to identify structural defects and chemical inhomogeneities in superconducting qubits. In this review, we discuss the findings of these efforts as they relate to the inherent surfaces, interfaces, impurities, and defects in superconducting qubits. Through this comprehensive investigation, we provide insight into possible sources of dissipation in these systems. Further, we supplement these findings with potential strategies for mitigating these undesired features in an effort to systematically and intelligently improve the coherence times of superconducting qubits.
Superconducting qubits have emerged as a potentially foundational platform technology for addressing complex computational problems deemed intractable with classical computing. Despite recent advances enabling multiqubit designs that exhibit coherence lifetimes on the order of hundreds of μs, material quality and interfacial structures continue to curb device performance. Two-level system defects in the thin superconducting film and adjacent dielectric regions introduce stochastic noise and dissipate electromagnetic energy at the cryogenic operating temperatures. In this study, we utilize time-of-flight secondary ion mass spectrometry to understand the role specific fabrication procedures play in introducing such dissipation mechanisms in these complex systems. We interrogated Nb thin films and transmon qubit structures fabricated through slight modifications in the processing and vacuum conditions. We find that when the Nb film is sputtered onto the Si substrate, oxide and silicide regions are generated at various interfaces. We also observe that impurity species, such as niobium hydrides and carbides, are incorporated within the niobium layer during the subsequent lithographic patterning steps. The formation of these resistive compounds likely impacts the superconducting properties of the Nb thin film. Additionally, we observe the presence of halogen species distributed throughout the patterned thin films. We conclude by hypothesizing the source of such impurities in these structures in an effort to intelligently fabricate superconducting qubits and extend coherence times moving forward.
While significant strides have been made to increase the coherence time of superconducting qubits, further advancements are essential for realizing scalable quantum computing. Decoherence is often a result of loss and noise stemming from two-level systems and excess quasiparticles, arising due to material defects, fabrication processes, and ambient exposure, particularly at surfaces and interfaces. Our recent efforts to mitigate these decoherence mechanisms have employed a variety of strategies, including low-loss surface encapsulation materials, advanced substrate preparation techniques, modifications to metal film growth, and the development of novel fabrication processes. The structural and chemical properties of materials, surfaces, and interfaces are studied using scanning probe microscopy, electron microscopy, photoelectron spectroscopy, mass spectrometry, and X-ray diffraction, which is correlated to device performance metrics, including superconducting resonator internal quality factor and qubit T1 time. This information is used to identify and understand material sources of loss and their origins in the device fabrication process. Through multi-institution efforts within SQMS we have identified the loss mechanism of interstitial hydrogen in niobium-based devices and shown how standard fabrication processes introduce these hydrides, developing strategies to mitigate their formation.1 Furthermore, we have characterized the metal-substrate interface, including the loss of niobium-silicides formed at that interface, and developed silicon surface treatments that reduce atomic scale roughness and oxygen content at the metal-substrate and Josephson junction interfaces.2-4 By developing the connection between materials properties and the overall performance of superconducting quantum circuitry, we can develop fabrication strategies to mitigate material losses, thus supporting the ongoing efforts to enhance coherence time in superconducting quantum devices. 1. Torres-Castanedo, C. G.*, Goronzy, D. P.*, et al., Adv. Funct. Mater., 2401365 (2024) 2. Lu, X., et al., Phys. Rev. Materials 6, 064402 (2022) 3. Berti, G., Appl. Phys. Lett. 122, 192605 (2023) 4. Kopas, C. J., Goronzy, D. P., et al., arXiv:2408.02863 (2024)
Improving qubit lifetime is essential for fault-tolerant quantum computing. It is widely acknowledged that intricate processing techniques introduce defects at the interfaces and surfaces of superconducting quantum circuits, which can create sources of decoherence. Therefore, a precise understanding of how a material's structure contributes to decoherence is critical for enhancing the performance of superconducting qubits. This talk highlights our recent advancements in understanding surface oxides in resonators and ultrathin aluminum oxide barriers in Josephson junctions (JJs) using transmission electron microscopy and spectroscopy techniques [1-4]. The Superconducting Quantum Materials & Systems Center (SQMS) demonstrated that encapsulating niobium surfaces with a ∼10nm tantalum layer results in 2-5x longer T1 than bare niobium [2]. Our collaborative investigation shows that this improvement is attributed to tantalum's less lossy surface oxide, which contains fewer sub-oxides than niobium oxide. Moreover, the amorphous Ta2O5 shows a bonding nature closer to crystalline form than amorphous Nb2O5, potentially reducing hydrogen diffusion toward the oxide/metal interface [1, 2]. Moreover, we will briefly discuss our preliminary study of the thin film structure under cryogenic conditions down to 20K, conducted using a liquid helium TEM holder in a Thermo Cs-corrected Titan. We also explored the effect of aluminum deposition rates on aluminum oxide microstructure and qubit lifetime. Although increasing the deposition rate from 0.5 Å/s to 5 Å/s significantly improved oxide layer roughness and thickness variation, the qubits’ coherence remained unchanged. This is likely due to Cooper pairs only tunneling through the thinnest parts of the barrier, making them less affected by the grain boundaries in the thin aluminum films. Additionally, we uncovered a stress-induced grain boundary sliding mechanism, which contributes to short-circuit failures in JJs [4]. Our discovery provides vital insight into oxide microstructure and superconducting qubits’ functionality [5].
The development of quantum computers, capable of surpassing classical computing in solving specific complex problems, hinges on breakthroughs in materials science, precision device fabrication, and the optimization of quantum architectures [1]. Among the leading candidates for quantum computation, superconducting qubits, particularly those based on transmon designs, have shown promising advances with coherence times reaching hundreds of microseconds [2]. However, to fully unlock the potential of scalable quantum computing, further enhancements in coherence are necessary. The intricate structure-coherence relationship within these devices, especially at critical interfaces such as metal-air, metal-dielectric, and metal-substrate in Josephson junctions (JJs), poses a significant challenge due to the potential for two-level-system loss channels. Here, we detail our pioneering efforts to understand these structure-coherence relationships utilizing advanced electron microscopy techniques. Focusing on the Al-AlOx and Al-Si substrate interfaces in Josephson Junctions, we employ a combination of low-loss and core-loss electron energy loss spectroscopy (EELS) and four-dimensional scanning transmission electron microscopy (4D-STEM) conducted at room and ultra-low temperatures (sub-6 K). This approach allows for an unprecedented examination of the chemical composition, bonding environments, and nanoscale structures of key surfaces and interfaces critical to the quantum coherence. Figure 1 presents a typical superconducting architecture at the chip level; each superconducting qubit consists of a Josephson Junction in parallel with an ultra-low-loss capacitor to create a resonant structure in the 3-6GHz range. JJs are highlighted in the area boxed in Fig. 1A and can be observed in detail in Fig. 1B. Lamella cross-sections (as shown in Fig. 1C) were prepared using a dual-beam focused ion beam (FIB) FEI-SEM Helios Nanolab. The lift-off was performed using 30 kV Ga+ ions, and the final cleaning step was carried out at 2 kV to remove surface damage on the area of interest, resulting in a final sample thickness of 50-100 nm. Transmission electron microscopy (TEM) and scanning transmission electron microscopy (STEM) data were collected on a probe-corrected JEOL ARM200 S/TEM operating at 200 kV. The convergent angle for ADF-STEM imaging was 25 mrad. Electron energy loss spectra (EELS) were acquired at 200 kV using a Gatan GIF Quantum on a K2 pixelated detector. Data processing (background subtraction, plural scattering removal, and signal mapping) was conducted using Gatan GMS software. Four-dimensional STEM (4D-STEM) data were collected by a K3 and STELA cameras. The convergent angles were 0.5-1.5 mrad, and the camera length was 6-10 cm. The step size was 5-10 Å. Merging microscopic insights with electrical data and theoretical frameworks, we aim to reveal how atomic-scale irregularities affect coherence times. Our results highlight key decoherence mechanisms in superconducting qubits and suggest specific improvements for qubit design and manufacturing. By linking electron microscopy findings to device performance, we outline strategies to reduce decoherence, essential for achieving reliable quantum computing. This work bridges materials science and quantum engineering, driving efforts in making scalable quantum computers forward [3]. A) Microscopic view of a superconducting transmon qubit, highlighting its symmetric design with central island and capacitor pads. B) SEM image of a JJ displaying their Al top and bottom contacts. C) STEM image of a JJ showing its key components and interfaces: Al top and bottom contact, AlOx tunnel barrier, Si substrate and Al-Si interface. A) EELS chemical maps of two interfaces, Al/Al and Al/Si using K-edges of oxygen, aluminum and silicon of a Josephson junction. It is possible to detect a formation of oxides at both interfaces. Plots showing Al and Si K-edge at 1560 eV and 1839 eV, respectively, and the ELNES are shown on the right side (Scale bar in A – 20 nm). B) Analysis of the disordered Al phases at the interfaces utilizing ePDF.
A quantum computer will potentially solve far-reaching problems which are currently intractable on any classical computer. Many technological obstacles have prevented the realization of a quantum computer, the main obstacle being decoherence, which is the loss of quantum information. Decoherence arises from the undesired interaction between qubits and their environment. Isolated qubits have better coherence but are more difficult to control. Superconducting qubits are a promising platform since their macroscopic size allows for easy control and coupling to other qubits. While the coherence of superconducting qubits has substantially improved over the past two decades, further improvements in coherence are required.We have repeatedly and reliably increased the coherence times of superconducting qubits. Currently decoherence in these devices is dominated by coupling to material defects. These defects are present in the dielectrics used to fabricate these devices or introduced during fabrication. Using simpler resonators as a testbed, we individually isolate, characterize, and then improve each step of the more complicated fabrication of superconducting qubits. We increased the quality factor of resonators by a factor of four by first identifying the surfaces and interfaces as a major source of loss and then by optimizing the substrate preparation. Furthermore, we measure and subsequently mitigate additional defect loss, which is dependent on the position of ground plane holes used to limit the loss from magnetic vortices. Implementing these improvements led to an increase of our qubit coherence times by more than an order of magnitude.The progress made in coherence while maintaining a high degree of connectivity and controllability has been directly used in more complex circuits. One such device is a fully connected three qubit ring with both tunable qubit frequencies and adjustable qubit-qubit couplings. The considerable level of control allows us to generate the quantum dynamics resulting from a collision between Na and He atoms by encoding the problem into a time-dependent multi-qubit interaction. We compute a scattering cross section by measuring the probability of exciting the Na atom over a wide range of collision parameters. The scattering cross-section shows that there is a velocity where the excitation probability is maximized, in agreement with scattering experiments.
Superconducting qubit technology is among the most promising hardware platform for quantum computing due to its fast gate operation, manufacturing scalability, and architectural flexibility [1]. A key figure of merit that dictates quantum computing functionality is the qubit’s coherence time, which needs to be maximized in order to bring quantum computing to the practical and scalable realm [2]. In particular, the T1 relaxation time—now on the order of milliseconds—can be enhanced with materials engineering, as amorphous dielectrics and crystallographic defects, among other factors, are known to induce decoherence [3-7]. Current state-of-the-art superconducting qubit devices use amorphous AlOx sandwiched between two superconducting Al electrodes as the Josephson junction (JJ), a key element in the transmon qubit, but amorphous dielectrics introduce two-level system (TLS) loss that underlie decoherence [8]. For this reason, numerous efforts have explored crystalline dielectrics as a replacement for amorphous AlOx, since single-crystal materials do not suffer from the lack of long-range order and sub-stoichiometry that comprise TLS defects [9-12]. However, none of these alternative materials choices have been able to surpass, let alone replicate, the performance of Al-AlOx-Al JJs. In this work, we fabricate superconducting quantum devices using a novel heteroepitaxial TiN/γ-Al2O3/TiN tri-layer stack grown on sapphire (Fig. 1a) and find that the measured microwave loss of the single-crystal γ-Al2O3 dielectric is lower than that of amorphous AlOx by two orders of magnitude. For qubits made with this tri-layer to transcend the coherence of incumbent Al-AlOx-Al, the structural, chemical, and electronic defects that induce TLS loss in these materials need to be well understood. Towards this end, we combine scanning transmission electron microscopy (STEM) and scanning electron microscopy (SEM) methods to highlight structural and interfacial complexity across length scales, ultimately identifying loss sources in the TiN/γ-Al2O3/TiN heteroepitaxial tri-layer. With atomic-resolution imaging and four-dimensional (4D-)STEM nanobeam electron diffraction (NBED), we find that the dielectric γ-Al2O3 layer, though single-crystalline (Fig. 1b), suffers from the formation of antiphase boundaries (Fig. 1c), which can host strong local electric fields and enhance lossy dielectric response [13]. Correlated with these nanoscale planar defects is uniformly distributed elastic strain, on the order of 6%, between the lattice-mismatched γ-Al2O3 and TiN (Fig. 1d). In other words, the dielectric layer is fully strained to match the underlying metal layer; such high strain can distort local bonding environments and thus create new TLSs or shift existing TLSs into resonance. Beyond imperfections within the bulk of the dielectric layer, there are noteworthy interfacial defects: roughening of both TiN/γ-Al2O3 interfaces deviate from atomically flat boundaries (Fig. 1c), while anion interdiffusion across both interfaces, as evident from core-loss electron energy-loss spectral (EELS) maps (Fig. 1e), leave behind vacancies and undercoordinated metal atoms, thereby creating 1.5 – 2 nm nonstoichiometric diffuse interfacial layers, both of which can cause TLS loss. In the superconducting TiN layers, we again use NBED to identify 180°-reflected specular twinned domains, indicating distinct heteroepitaxial relationships of [111]TiN//[0006]Al2O3 and [002¯]TiN//[22¯02¯]Al2O3 (Fig. 2a) [14]. Crystal twinning of the TiN epilayer is not only spatially distributed at the nanoscale, as shown using virtual dark-field (VDF) images (Fig. 2b), but is also widespread at the microscale, as shown using SEM electron backscatter diffraction (EBSD) (Fig. 2c). While microwave performance is not limited by a single factor, it is clear that defective quantum microstructure across length scales collectively contribute to dielectric loss, and in turn, TLS-related decoherence. By correlating nanoscale crystallographic and spectroscopic information with microscale diffraction measurements, our work can guide interface engineering during material growth, paving the way towards further improvements in quantum device performance. Cross-sectional samples were prepared by subsequent 30 kV, 8 kV and 5 kV Xe+ plasma focused ion beam (FIB) using the Thermo Scientific Helios 5 Hydra CX DualBeam Plasma FIB/SEM. Samples were then plasma cleaned using South Bay Technology PC-2000 Plasma Cleaner with a 3:1 mixture of Ar:O2 gas at 20∼40 W RF power for 15 s at 150 mTorr. High-angle annular dark-field (HAADF-) and annular bright-field (ABF-) STEM images were collected on a probe-corrected JEOL JEM-ARM200CF S/TEM operating at 200 kV using JEOL detectors. The STEM convergence angle, HAADF collection angle, and ABF collection angle were 27 mrad, 90 – 370 mrad, and 23 mrad, respectively. EELS data were collected on a JEOL JEM-ARM300F GrandARM S/TEM operating at 300 kV using the Gatan GIF Continuum K3 IS system. The data were collected using a 2.5 mm aperture and a 750 eV wide energy slit at a dispersion of 0.18 eV/Ch and a camera length of 2 cm. 4D-STEM data were collected on the same microscope and detector system using a 0.5 – 1.5 mrad convergence angle and a 20 eV wide energy slit at a camera length of 4 cm. All STEM data processing was performed using the Gatan Microscopy Suite software. Top-down EBSD measurements were performed in the Thermo Scientific Helios 5 CX DualBeam FIB/SEM at 25 kV using the Oxford Symmetry S3 detector. EBSD data processing was performed using the Oxford AZtecCrystal software [15]. Defects in γ-Al2O3. a) HAADF-STEM image of a TiN/γ-Al2O3/TiN tri-layer stack on a α-Al2O3 (0001) substrate. The thickness of γ-Al2O3 is approximately 13.5 nm. b) 4D-STEM NBED pattern of the γ-Al2O3 layer, confirming the {111} out-of-plane orientation. c) Fourier-filtered atomic-resolution ABF-STEM image of the γ-Al2O3 dielectric layer, taken from the cyan-colored square region in a), emphasizing the planar defects along both TiN/γ-Al2O3 interfaces and within the γ-Al2O3 layer itself–interfacial roughness (yellow lines) and antiphase boundaries (colored parallelograms), respectively. The scale bar is 2 nm. d) In-plane and out-of-plane strain maps of the heteroepitaxial tri-layer stack, with approximately 6.5∼6.8% strain in both directions. The units of the intensity bar are such that 100% strain would be equivalent to 1.0. e) STEM-EELS maps of Ti-L2,3, N-K, and O-K edges, along with a superimposed image of the three, taken from the same region as c). The scale bars are all 5 nm. Defects in TiN. a) 4D-STEM NBED patterns and b) VDF images of nanoscale TiN {111} and {002} twins. c) SEM EBSD pole figures in the three face-centered cubic crystallographic directions, revealing that the 60° rotation twinning behavior (with the [111] twin axis) is spread across the microscale.