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Optics Express

Experimental 61-partite entanglement on a three-dimensional photonic chip

Wenhao Zhou, Zhi‐Qiang Jiao, Hang Li, Jun Gao, Xiaowei Wang, Ruo-Jing Ren, Xiao-Yun Xu, Lu-Feng Qiao, Xian‐Min Jin

Published Apr 25, 2023• 0 citations
Publisher

Abstract

Multipartite entanglements are essential resources for proceeding tasks in quantum information science and technology. However, generating and verifying them present significant challenges, such as the stringent requirements for manipulations and the need for a huge number of building-blocks as the systems scale up. Here, we propose and experimentally demonstrate the heralded multipartite entanglements on a three-dimensional photonic chip. Integrated photonics provide a physically scalable way to achieve an extensive and adjustable architecture. Through sophisticated Hamiltonian engineering, we are able to control the coherent evolution of shared single photon in the multiple spatial modes, dynamically tuning the induced high-order W-states of different orders in a single photonic chip. Using an effective witness, we successfully observe and verify 61-partite quantum entanglements in a 121-site photonic lattice. Our results, together with the single-site-addressable platform, offer new insights into the accessible size of quantum entanglements and may facilitate the developments of large-scale quantum information processing applications.

DOI
10.1364/oe.492725

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Multipartite entanglements are essential resources for proceeding tasks in quantum information science and technology. However, generating and verifying them present significant challenges, such as the stringent requirements for manipulations and the need for a huge number of building-blocks as the systems scale up. Here, we propose and experimentally demonstrate the heralded multipartite entanglements on a three-dimensional photonic chip. Integrated photonics provide a physically scalable way to achieve an extensive and adjustable architecture. Through sophisticated Hamiltonian engineering, we are able to control the coherent evolution of shared single photon in the multiple spatial modes, dynamically tuning the induced high-order W-states of different orders in a single photonic chip. Using an effective witness, we successfully observe and verify 61-partite quantum entanglements in a 121-site photonic lattice. Our results, together with the single-site-addressable platform, offer new insights into the accessible size of quantum entanglements and may facilitate the developments of large-scale quantum information processing applications.
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Abstract High-dimensional entanglement is significant for the fundamental studies of quantum physics and offers unique advantages in various quantum information processing tasks. Integrated quantum devices have recently emerged as a promising platform for creating, processing, and detecting complex high-dimensional entangled states. A crucial step toward practical quantum technologies is to verify that these devices work reliably with an optimal strategy. In this work, we experimentally implement an optimal quantum verification strategy on a three-dimensional maximally entangled state using local projective measurements on a silicon photonic chip. A 95% confidence is achieved from 1190 copies to verify the target quantum state. The obtained scaling of infidelity as a function of the number of copies is −0.5497 ± 0.0002, exceeding the standard quantum limit of −0.5 with 248 standard deviations. Our results indicate that quantum state verification could serve as an efficient tool for complex quantum measurement tasks.
Entanglement-based quantum science exploits subtle properties of quantum mechanics into applications such as quantum computing, sensing, and metrology. The emerging route for quantum computing applications, which calls for ultracompact, integrated, and scalable architecture, aims at on-chip entangled qubits. In this context, quantum entanglement among atomic qubits was achieved via cold-controlled collisions which are only significant at subwavelength separations. However, as other manifolds of quantum state engineering require single-site addressability and controlled manipulation of the individual qubit using diffraction-limited optics, entanglement of qubits separated by macroscopic distances at the chip level is still an outstanding challenge. Here, we report a novel platform for on-chip quantum state engineering by harnessing the extraordinary light-molding capabilities of metasurfaces. We theoretically demonstrate quantum entanglement between two qubits trapped on a chip and separated by macroscopic distances, by engineering their coherent and dissipative interactions via the metasurface. Spatially scalable interaction channels offered by the metasurface enable robust generation of entanglement, with large values of concurrence and remarkable revival from sudden death. The metasurface route to quantum state engineering opens a new paradigm for on-chip quantum science and technologies.