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Chip

Hybrid superconducting photonic-phononic chip for quantum information processing

Xin‐Biao Xu, Weiting Wang, Luyan Sun, Chang‐Ling Zou

Published Jul 2, 2022• 45 citations
Publisher

Abstract

The integration of qubits with long coherence times and functional quantum devices on a single chip, and thus the realization of an all-solid-state quantum computing chip, is an important goal in current experimental research on quantum information processing. Among various quantum platforms, a series of significant progresses have been made in photonic quantum chips and superconducting quantum chips, while both the number of qubits and the complexity of quantum circuits have been increasing. Although these two chip platforms have respective unique advantages and potentials, their shortcomings have been gradually revealed and need to be solved. By introducing phonon-integrated devices, it is possible to combine all unsuspended phononic, photonic, and superconducting quantum devices organically on the same chip to achieve coherent coupling among them. Here, we provide a prospect and a short review on the integrated photonic, superconducting, and hybrid quantum chips for quantum information processing.

DOI
10.1016/j.chip.2022.100016

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The integration of qubits with long coherence times and functional quantum devices on a single chip, and thus the realization of an all-solid-state quantum computing chip, is an important goal in current experimental research on quantum information processing. Among various quantum platforms, a series of significant progresses have been made in photonic quantum chips and superconducting quantum chips, while both the number of qubits and the complexity of quantum circuits have been increasing. Although these two chip platforms have respective unique advantages and potentials, their shortcomings have been gradually revealed and need to be solved. By introducing phonon-integrated devices, it is possible to combine all unsuspended phononic, photonic, and superconducting quantum devices organically on the same chip to achieve coherent coupling among them. Here, we provide a prospect and a short review on the integrated photonic, superconducting, and hybrid quantum chips for quantum information processing.
The goal of integrated quantum photonics is to combine components for the generation, manipulation, and detection of nonclassical light in a phase-stable and efficient platform. Solid-state quantum emitters have recently reached outstanding performance as single-photon sources. In parallel, photonic integrated circuits have been advanced to the point that thousands of components can be controlled on a chip with high efficiency and phase stability. Consequently, researchers are now beginning to combine these leading quantum emitters and photonic integrated circuit platforms to realize the best properties of each technology. In this paper, we review recent advances in integrated quantum photonics based on such hybrid systems. Although hybrid integration solves many limitations of individual platforms, it also introduces new challenges that arise from interfacing different materials. We review various issues in solid-state quantum emitters and photonic integrated circuits, the hybrid integration techniques that bridge these two systems, and methods for chip-based manipulation of photons and emitters. Finally, we discuss the remaining challenges and future prospects of on-chip quantum photonics with integrated quantum emitters.
Hybrid quantum circuits combine two or more physical systems, with the goal of harnessing the advantages and strengths of the different systems in order to better explore new phenomena and potentially bring about novel quantum technologies. This article presents a brief overview of the progress achieved so far in the field of hybrid circuits involving atoms, spins, and solid-state devices (including superconducting and nanomechanical systems). How these circuits combine elements from atomic physics, quantum optics, condensed matter physics, and nanoscience is discussed, and different possible approaches for integrating various systems into a single circuit are presented. In particular, hybrid quantum circuits can be fabricated on a chip, facilitating their future scalability, which is crucial for building future quantum technologies, including quantum detectors, simulators, and computers.
With high integration density and excellent optical properties, silicon photonics is becoming a promising platform for complete integration and large-scale optical quantum information processing. Scalable quantum information applications need photon generation and detection to be integrated on the same chip, and we have seen that various devices on the silicon photonic chip have been developed for this goal. This paper reviews the relevant research results and state-of-the-art technologies on the silicon photonic chip for scalable quantum applications. Despite the shortcomings, the properties of some components have already met the requirements for further expansion. Furthermore, we point out the challenges ahead and future research directions for on-chip scalable quantum information applications.
Leveraging the quantum information-processing ability of superconducting circuits and long-distance distribution ability of optical photons promises the realization of complex and large-scale quantum networks. In such a scheme, a coherent and efficient quantum transducer between superconducting and photonic circuits is critical. However, this quantum transducer is still challenging because the use of intermediate excitations in current schemes introduces extra noise and limits bandwidth. We realize direct and coherent transduction between superconducting and photonic circuits based on the triple-resonance electro-optic principle, with integrated devices incorporating both superconducting and optical cavities on the same chip. Electromagnetically induced transparency is observed, indicating the coherent interaction between microwave and optical photons. Internal conversion efficiency of 25.9 ± 0.3% has been achieved, with 2.05 ± 0.04% total efficiency. Superconducting cavity electro-optics offers broad transduction bandwidth and high scalability and represents a significant step toward integrated hybrid quantum circuits and distributed quantum computation.
Superconducting quantum circuits (SQCs), composed of superconducting capacitors, inductances, Josephson junctions, and transmission lines, exhibit macroscopic quantum effects at ultra-low temperatures. Due to the extremely low dissipation of superconductors, an important application of SQCs is superconducting qubits with long coherence time. Quantum computing based on superconducting qubits is a leading physical realization method of quantum computing, which is theoretically capable of accelerating many computational problems including quantum simulation, database searching, and optimization. In the long run, to use the power of quantum computing to its full extent, universal quantum computers should be constructed with quantum error correction. In the short term, one of the most pressing targets of the superconducting quantum computing community is to demonstrate quantum advantage using noisy intermediate-scale quantum chips. Both goals rely on the increasing of the number of coupled qubits in a quantum circuit and the quality of these qubits, which dictate the breadth and the depth of a problem it can solve, respectively. The fabrication of SQCs has adopted a few manufacturing processes from conventional integrated circuits. Quantum chips containing multiple superconducting qubits can be made and packaged on a large scale. “Quantum supremacy” has been demonstrated on a quantum chip with fifty-three qubits fabricated using the flip-chip bonding technology. However, to demonstrate quantum advantage, the quality and quantity of qubits need to increase simultaneously. Dissipative channels emerge in circuit design, material preparation, chip fabrication, and working environment, limiting the lifetime of superconducting qubits. For quantum chips with tens to hundreds of qubits, the integration will also introduce extra processing steps which may degrade the qubits, and unwanted coupling to loss channels. Most of these channels are microscopically related to materials constructing the quantum chips, chip surfaces, and material interfaces. Thus, it is important to investigate the material growth and device fabrication of SQCs, and to understand the material related loss mechanisms. This review paper investigates the material related topics in superconducting quantum circuits pertinent to the quantum computing application from a comprehensive perspective. The history of SQCs is briefly mentioned, followed by the peculiar characteristics as an engineerable quantum system, and a roadmap to quantum advantage and universal quantum computing in the next a few years. Technically, the superconducting quantum computer is compared to a Schrodinger’s cat, and can be boiled down into three parts, i.e., quantum chips, the environment, and the operating system, corresponding to the cat, the box, and the observer, respectively. The material related decoherence channels of the SQCs can be sorted into four categories; each will be discussed in details. To fabricate SQCs with minimal loss, the processing technologies are elaborated, including qubit design, material selection, surface treatments, film growth, and Josephson junction, etc. Though there are general guidelines that amorphous materials should be avoided and processing induced damage should be minimized, more is to be investigated due to the emerging of new materials and new fabrication methods. The last part presents the potential application of the superconducting quantum computer and its current state of play. SQC for quantum computing is a multi-discipline research topic, demanding joint efforts from different scientific and technical areas. Materials science and device processing will play important roles along the way to quantum practicality.
Hybrid semiconductor-superconductor qubits have recently emerged as a promising alternative to traditional platforms, combining material advantages with device-level tunability. A defining feature is their gate-tunable Josephson coupling, enabling superconducting qubit architectures with full electric-field control and offering a path toward scalable, low-crosstalk quantum processors. This approach seeks to merge benefits of superconducting and semiconductor qubits, for instance by encoding quantum information in the spin of a quasiparticle occupying an Andreev bound state, thus combining long coherence times with fast, flexible control. Progress has accelerated through bottom-up engineering of Andreev states in coupled quantum dot arrays, leading to architectures such as minimal Kitaev chains hosting Majorana zero modes. In parallel, Hamiltonian-protected designs aim to enhance resilience against local noise and decoherence by exploiting superconducting phase dynamics and discrete charge or flux degrees of freedom. This article reviews recent theoretical and experimental advances in hybrid qubits, providing an overview of physical mechanisms, device implementations, and emerging architectures, with emphasis on their potential for (topologically) protected quantum information processing. While many designs remain at proof-of-concept stage, rapid progress suggests practical demonstrations may soon be achievable.